FR2699556B1 - Bains pour former un depot electrolytique de cuivre et procede de depot electrolytique utilisant ce bain. - Google Patents

Bains pour former un depot electrolytique de cuivre et procede de depot electrolytique utilisant ce bain.

Info

Publication number
FR2699556B1
FR2699556B1 FR9315097A FR9315097A FR2699556B1 FR 2699556 B1 FR2699556 B1 FR 2699556B1 FR 9315097 A FR9315097 A FR 9315097A FR 9315097 A FR9315097 A FR 9315097A FR 2699556 B1 FR2699556 B1 FR 2699556B1
Authority
FR
France
Prior art keywords
electrolytic
baths
copper
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9315097A
Other languages
English (en)
Other versions
FR2699556A1 (fr
Inventor
Sylvia Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone OMI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone OMI Inc filed Critical Enthone OMI Inc
Publication of FR2699556A1 publication Critical patent/FR2699556A1/fr
Application granted granted Critical
Publication of FR2699556B1 publication Critical patent/FR2699556B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
FR9315097A 1992-12-23 1993-12-15 Bains pour former un depot electrolytique de cuivre et procede de depot electrolytique utilisant ce bain. Expired - Fee Related FR2699556B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/996,095 US5328589A (en) 1992-12-23 1992-12-23 Functional fluid additives for acid copper electroplating baths

Publications (2)

Publication Number Publication Date
FR2699556A1 FR2699556A1 (fr) 1994-06-24
FR2699556B1 true FR2699556B1 (fr) 1996-03-01

Family

ID=25542500

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9315097A Expired - Fee Related FR2699556B1 (fr) 1992-12-23 1993-12-15 Bains pour former un depot electrolytique de cuivre et procede de depot electrolytique utilisant ce bain.

Country Status (9)

Country Link
US (1) US5328589A (fr)
JP (1) JPH06228785A (fr)
CA (1) CA2110214C (fr)
DE (1) DE4343946C2 (fr)
ES (1) ES2088356B1 (fr)
FR (1) FR2699556B1 (fr)
GB (1) GB2273941B (fr)
HK (1) HK28197A (fr)
IT (1) IT1261377B (fr)

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Also Published As

Publication number Publication date
DE4343946C2 (de) 1998-10-29
ES2088356B1 (es) 1997-03-16
ITTO930935A1 (it) 1995-06-10
FR2699556A1 (fr) 1994-06-24
GB2273941B (en) 1995-09-13
JPH06228785A (ja) 1994-08-16
GB9326323D0 (en) 1994-02-23
ES2088356A1 (es) 1996-08-01
IT1261377B (it) 1996-05-20
ITTO930935A0 (it) 1993-12-10
HK28197A (en) 1997-03-21
US5328589A (en) 1994-07-12
CA2110214C (fr) 2000-05-16
GB2273941A (en) 1994-07-06
DE4343946A1 (de) 1994-06-30
CA2110214A1 (fr) 1994-06-24

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Effective date: 20110131