HK28197A - Functional fluid additives for acid copper electroplating baths - Google Patents

Functional fluid additives for acid copper electroplating baths

Info

Publication number
HK28197A
HK28197A HK28197A HK28197A HK28197A HK 28197 A HK28197 A HK 28197A HK 28197 A HK28197 A HK 28197A HK 28197 A HK28197 A HK 28197A HK 28197 A HK28197 A HK 28197A
Authority
HK
Hong Kong
Prior art keywords
acid copper
functional fluid
copper electroplating
electroplating baths
fluid additives
Prior art date
Application number
HK28197A
Other languages
English (en)
Inventor
Sylvia Martin
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of HK28197A publication Critical patent/HK28197A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Resins (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
HK28197A 1992-12-23 1997-03-13 Functional fluid additives for acid copper electroplating baths HK28197A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/996,095 US5328589A (en) 1992-12-23 1992-12-23 Functional fluid additives for acid copper electroplating baths

Publications (1)

Publication Number Publication Date
HK28197A true HK28197A (en) 1997-03-21

Family

ID=25542500

Family Applications (1)

Application Number Title Priority Date Filing Date
HK28197A HK28197A (en) 1992-12-23 1997-03-13 Functional fluid additives for acid copper electroplating baths

Country Status (9)

Country Link
US (1) US5328589A (xx)
JP (1) JPH06228785A (xx)
CA (1) CA2110214C (xx)
DE (1) DE4343946C2 (xx)
ES (1) ES2088356B1 (xx)
FR (1) FR2699556B1 (xx)
GB (1) GB2273941B (xx)
HK (1) HK28197A (xx)
IT (1) IT1261377B (xx)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
DE4126502C1 (xx) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6276072B1 (en) * 1997-07-10 2001-08-21 Applied Materials, Inc. Method and apparatus for heating and cooling substrates
US6258241B1 (en) 1997-12-10 2001-07-10 Lucent Technologies, Inc. Process for electroplating metals
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
WO1999040615A1 (en) 1998-02-04 1999-08-12 Semitool, Inc. Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6416647B1 (en) 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
EP0991795B1 (en) 1998-04-21 2006-02-22 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6994776B2 (en) * 1998-06-01 2006-02-07 Semitool Inc. Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
US6267853B1 (en) 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6254760B1 (en) 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6290865B1 (en) 1998-11-30 2001-09-18 Applied Materials, Inc. Spin-rinse-drying process for electroplated semiconductor wafers
US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US6228233B1 (en) 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US7192494B2 (en) * 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US6837978B1 (en) 1999-04-08 2005-01-04 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
US6551488B1 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Segmenting of processing system into wet and dry areas
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6662673B1 (en) 1999-04-08 2003-12-16 Applied Materials, Inc. Linear motion apparatus and associated method
US6557237B1 (en) 1999-04-08 2003-05-06 Applied Materials, Inc. Removable modular cell for electro-chemical plating and method
US6582578B1 (en) 1999-04-08 2003-06-24 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6596148B1 (en) 1999-08-04 2003-07-22 Mykrolis Corporation Regeneration of plating baths and system therefore
US6391209B1 (en) 1999-08-04 2002-05-21 Mykrolis Corporation Regeneration of plating baths
EP1207730B1 (en) * 1999-08-06 2009-09-16 Ibiden Co., Ltd. Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
US6605204B1 (en) 1999-10-14 2003-08-12 Atofina Chemicals, Inc. Electroplating of copper from alkanesulfonate electrolytes
US6406609B1 (en) 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
WO2001090446A2 (en) 2000-05-23 2001-11-29 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US6436267B1 (en) 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
KR100366631B1 (ko) 2000-09-27 2003-01-09 삼성전자 주식회사 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법
EP1470268A2 (en) * 2000-10-03 2004-10-27 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
DE60123189T2 (de) * 2000-10-13 2007-10-11 Shipley Co., L.L.C., Marlborough Keimschichtreparatur und Elektroplattierungsbad
US7074315B2 (en) * 2000-10-19 2006-07-11 Atotech Deutschland Gmbh Copper bath and methods of depositing a matt copper coating
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
US6660153B2 (en) * 2000-10-20 2003-12-09 Shipley Company, L.L.C. Seed layer repair bath
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
TWI330587B (en) * 2002-07-26 2010-09-21 Clopay Plastic Prod Co Breathable materials comprising low-elongation fabrics, and methods
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
DE60336539D1 (de) * 2002-12-20 2011-05-12 Shipley Co Llc Methode zum Elektroplattieren mit Umkehrpulsstrom
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US7205153B2 (en) 2003-04-11 2007-04-17 Applied Materials, Inc. Analytical reagent for acid copper sulfate solutions
US7311810B2 (en) * 2003-04-18 2007-12-25 Applied Materials, Inc. Two position anneal chamber
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
TWI400365B (zh) 2004-11-12 2013-07-01 Enthone 微電子裝置上的銅電沈積
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20070014958A1 (en) * 2005-07-08 2007-01-18 Chaplin Ernest R Hanger labels, label assemblies and methods for forming the same
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
CN105543908B (zh) * 2016-02-29 2018-04-13 广州鸿葳科技股份有限公司 一种无氰碱性光亮滚镀铜的溶液及方法
CN106337195A (zh) * 2016-11-16 2017-01-18 武汉奥克特种化学有限公司 一种酸性镀锌载体及其制备方法与应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (xx) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3751289A (en) * 1971-08-20 1973-08-07 M & T Chemicals Inc Method of preparing surfaces for electroplating
US3832291A (en) * 1971-08-20 1974-08-27 M & T Chemicals Inc Method of preparing surfaces for electroplating
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US4109176A (en) * 1972-09-25 1978-08-22 Owen-Illinois, Inc. Insulating dielectric for gas discharge device
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor

Also Published As

Publication number Publication date
US5328589A (en) 1994-07-12
JPH06228785A (ja) 1994-08-16
FR2699556B1 (fr) 1996-03-01
GB2273941A (en) 1994-07-06
DE4343946C2 (de) 1998-10-29
ITTO930935A0 (it) 1993-12-10
ITTO930935A1 (it) 1995-06-10
DE4343946A1 (de) 1994-06-30
ES2088356B1 (es) 1997-03-16
GB2273941B (en) 1995-09-13
FR2699556A1 (fr) 1994-06-24
GB9326323D0 (en) 1994-02-23
IT1261377B (it) 1996-05-20
ES2088356A1 (es) 1996-08-01
CA2110214A1 (en) 1994-06-24
CA2110214C (en) 2000-05-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)