FR2434483A1 - Procede de commande du recuit de semi-conducteurs - Google Patents
Procede de commande du recuit de semi-conducteursInfo
- Publication number
- FR2434483A1 FR2434483A1 FR7921071A FR7921071A FR2434483A1 FR 2434483 A1 FR2434483 A1 FR 2434483A1 FR 7921071 A FR7921071 A FR 7921071A FR 7921071 A FR7921071 A FR 7921071A FR 2434483 A1 FR2434483 A1 FR 2434483A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor
- annuit
- control method
- monitored
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02634—Homoepitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/09—Laser anneal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/093—Laser beam treatment in general
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/965—Shaped junction formation
Abstract
a. Procédé pour améliorer la commande du recuit de couches superficielles d'un corps semi-conducteur 10 par fusion de la couche superficielle à 'aide d'un faisceau à énergie rayonnante 21. b. On contrôle la réflectivité de la surface de la couche pour détecter les changements de cette surface entre ses états fondus et solide, et la quantité d'énergie rayonnante reçue par la surface est contrôlée en réponse à ces changements. c. Application au controle de la diffusion d'impuretés dans des semi-conducteurs.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/935,665 US4155779A (en) | 1978-08-21 | 1978-08-21 | Control techniques for annealing semiconductors |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2434483A1 true FR2434483A1 (fr) | 1980-03-21 |
FR2434483B1 FR2434483B1 (fr) | 1983-05-13 |
Family
ID=25467491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7921071A Granted FR2434483A1 (fr) | 1978-08-21 | 1979-08-21 | Procede de commande du recuit de semi-conducteurs |
Country Status (7)
Country | Link |
---|---|
US (1) | US4155779A (fr) |
JP (1) | JPS55500615A (fr) |
CA (1) | CA1118114A (fr) |
FR (1) | FR2434483A1 (fr) |
GB (1) | GB2040077B (fr) |
NL (1) | NL7920078A (fr) |
WO (1) | WO1980000509A1 (fr) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4240843A (en) * | 1978-05-23 | 1980-12-23 | Western Electric Company, Inc. | Forming self-guarded p-n junctions by epitaxial regrowth of amorphous regions using selective radiation annealing |
WO1980001121A1 (fr) * | 1978-11-28 | 1980-05-29 | Western Electric Co | Recuit de materiau par laser a double longueur d'onde |
US4234358A (en) * | 1979-04-05 | 1980-11-18 | Western Electric Company, Inc. | Patterned epitaxial regrowth using overlapping pulsed irradiation |
US4234356A (en) * | 1979-06-01 | 1980-11-18 | Bell Telephone Laboratories, Incorporated | Dual wavelength optical annealing of materials |
EP0171509B1 (fr) * | 1979-07-24 | 1990-10-31 | Hughes Aircraft Company | Procédé de traitement à laser pour "silicium sur saphir" |
US4242149A (en) * | 1979-07-31 | 1980-12-30 | The United States Of America As Represented By The Secretary Of The Army | Method of making photodetectors using ion implantation and laser annealing |
US4249962A (en) * | 1979-09-11 | 1981-02-10 | Western Electric Company, Inc. | Method of removing contaminating impurities from device areas in a semiconductor wafer |
JPS5640275A (en) * | 1979-09-12 | 1981-04-16 | Hitachi Ltd | Preparation of semiconductor device |
US4309225A (en) * | 1979-09-13 | 1982-01-05 | Massachusetts Institute Of Technology | Method of crystallizing amorphous material with a moving energy beam |
US4257827A (en) * | 1979-11-13 | 1981-03-24 | International Business Machines Corporation | High efficiency gettering in silicon through localized superheated melt formation |
JPS5674921A (en) * | 1979-11-22 | 1981-06-20 | Toshiba Corp | Manufacturing method of semiconductor and apparatus thereof |
US4292093A (en) * | 1979-12-28 | 1981-09-29 | The United States Of America As Represented By The United States Department Of Energy | Method using laser irradiation for the production of atomically clean crystalline silicon and germanium surfaces |
US4322253A (en) * | 1980-04-30 | 1982-03-30 | Rca Corporation | Method of making selective crystalline silicon regions containing entrapped hydrogen by laser treatment |
JPS577924A (en) * | 1980-06-18 | 1982-01-16 | Hitachi Ltd | Semiconductor device and manufacture thereof |
GB2134098B (en) * | 1982-11-10 | 1987-01-28 | Gen Electric Co Plc | Methods of manufacturing optical components |
GB2133618B (en) * | 1983-01-05 | 1986-09-10 | Gen Electric Co Plc | Fabricating semiconductor circuits |
JPS61289617A (ja) * | 1985-06-18 | 1986-12-19 | Sony Corp | 薄膜単結晶の製造装置 |
NO157876C (no) * | 1985-09-23 | 1988-06-01 | Sintef | Fremgangsmaate og apparat for gjennomfoering av varmebehandling. |
DE3787440T2 (de) * | 1986-11-20 | 1994-01-13 | Nec Corp | Verfahren und Vorrichtung um eine Linie auf einem strukturierten Substrat zu schreiben. |
US4865683A (en) * | 1988-11-03 | 1989-09-12 | Lasa Industries, Inc. | Method and apparatus for laser process control |
US5155337A (en) * | 1989-12-21 | 1992-10-13 | North Carolina State University | Method and apparatus for controlling rapid thermal processing systems |
US5021362A (en) * | 1989-12-29 | 1991-06-04 | At&T Bell Laboratories | Laser link blowing in integrateed circuit fabrication |
US5198371A (en) * | 1990-09-24 | 1993-03-30 | Biota Corp. | Method of making silicon material with enhanced surface mobility by hydrogen ion implantation |
US5372836A (en) * | 1992-03-27 | 1994-12-13 | Tokyo Electron Limited | Method of forming polycrystalling silicon film in process of manufacturing LCD |
JPH06124913A (ja) * | 1992-06-26 | 1994-05-06 | Semiconductor Energy Lab Co Ltd | レーザー処理方法 |
KR100255689B1 (ko) * | 1993-05-27 | 2000-05-01 | 윤종용 | 반도체 레이져 소자 및 그 제조방법 |
US5441569A (en) * | 1993-11-29 | 1995-08-15 | The United States Of America As Represented By The United States Department Of Energy | Apparatus and method for laser deposition of durable coatings |
US6177127B1 (en) | 1995-12-15 | 2001-01-23 | Micron Technology, Inc. | Method of monitoring emissivity |
US5688550A (en) * | 1995-12-15 | 1997-11-18 | Micron Technology, Inc. | Method of forming polysilicon having a desired surface roughness |
GB9624715D0 (en) * | 1996-11-28 | 1997-01-15 | Philips Electronics Nv | Electronic device manufacture |
GB0001568D0 (en) * | 2000-01-24 | 2000-03-15 | Isis Innovation | Method and apparatus for measuring surface configuration |
DE10120730B4 (de) * | 2001-04-27 | 2006-08-24 | Schott Ag | Verfahren und Vorrichtung zur Messung der Phasengrenze |
US6656749B1 (en) * | 2001-12-13 | 2003-12-02 | Advanced Micro Devices, Inc. | In-situ monitoring during laser thermal annealing |
KR100541052B1 (ko) * | 2003-09-22 | 2006-01-11 | 삼성전자주식회사 | 자유 캐리어의 생성 기술을 사용하여 반도체 물질을레이저 열처리하는 공정 |
JP5279260B2 (ja) * | 2007-12-27 | 2013-09-04 | 株式会社半導体エネルギー研究所 | 半導体層の評価方法 |
JP4948629B2 (ja) * | 2010-07-20 | 2012-06-06 | ウシオ電機株式会社 | レーザリフトオフ方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364087A (en) * | 1964-04-27 | 1968-01-16 | Varian Associates | Method of using laser to coat or etch substrate |
US3585088A (en) * | 1968-10-18 | 1971-06-15 | Ibm | Methods of producing single crystals on supporting substrates |
US3716844A (en) * | 1970-07-29 | 1973-02-13 | Ibm | Image recording on tetrahedrally coordinated amorphous films |
US4021675A (en) * | 1973-02-20 | 1977-05-03 | Hughes Aircraft Company | System for controlling ion implantation dosage in electronic materials |
DE2449688C3 (de) * | 1974-10-18 | 1980-07-10 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper |
US4082958A (en) * | 1975-11-28 | 1978-04-04 | Simulation Physics, Inc. | Apparatus involving pulsed electron beam processing of semiconductor devices |
-
1978
- 1978-08-21 US US05/935,665 patent/US4155779A/en not_active Expired - Lifetime
-
1979
- 1979-08-14 WO PCT/US1979/000834 patent/WO1980000509A1/fr unknown
- 1979-08-14 NL NL7920078A patent/NL7920078A/nl unknown
- 1979-08-14 JP JP50164779A patent/JPS55500615A/ja active Pending
- 1979-08-14 GB GB8009229A patent/GB2040077B/en not_active Expired
- 1979-08-16 CA CA000333912A patent/CA1118114A/fr not_active Expired
- 1979-08-21 FR FR7921071A patent/FR2434483A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
WO1980000509A1 (fr) | 1980-03-20 |
FR2434483B1 (fr) | 1983-05-13 |
CA1118114A (fr) | 1982-02-09 |
NL7920078A (nl) | 1980-06-30 |
GB2040077B (en) | 1983-05-18 |
JPS55500615A (fr) | 1980-09-04 |
US4155779A (en) | 1979-05-22 |
GB2040077A (en) | 1980-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |