FR2373168B1 - - Google Patents
Info
- Publication number
- FR2373168B1 FR2373168B1 FR7731853A FR7731853A FR2373168B1 FR 2373168 B1 FR2373168 B1 FR 2373168B1 FR 7731853 A FR7731853 A FR 7731853A FR 7731853 A FR7731853 A FR 7731853A FR 2373168 B1 FR2373168 B1 FR 2373168B1
- Authority
- FR
- France
- Prior art keywords
- case
- crystal
- melting point
- low melting
- enhancing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/11—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/748,249 US4077558A (en) | 1976-12-06 | 1976-12-06 | Diffusion bonding of crystals |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2373168A1 FR2373168A1 (fr) | 1978-06-30 |
FR2373168B1 true FR2373168B1 (fr) | 1980-08-08 |
Family
ID=25008642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7731853A Granted FR2373168A1 (fr) | 1976-12-06 | 1977-10-14 | Procede de liaison de cristaux |
Country Status (6)
Country | Link |
---|---|
US (1) | US4077558A (fr) |
JP (1) | JPS5370841A (fr) |
CA (1) | CA1078532A (fr) |
DE (1) | DE2749696C2 (fr) |
FR (1) | FR2373168A1 (fr) |
GB (1) | GB1537816A (fr) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2742922C2 (de) * | 1977-09-23 | 1984-03-08 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum mittelbaren Verbinden zweier Teile |
DE2742921C2 (de) * | 1977-09-23 | 1985-07-11 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum mittelbaren Verbinden zweier Teile durch Verschweißung zweier Metallauflagen |
JPS5478693A (en) * | 1977-12-05 | 1979-06-22 | Matsushima Kogyo Co Ltd | Crystal vibrator |
US4365736A (en) * | 1979-10-12 | 1982-12-28 | Stumm James E | Method of manufacturing high stability joint |
US4295373A (en) * | 1980-04-03 | 1981-10-20 | United Technologies Corporation | Fluidic angular rate sensor with integrated impulse jet pump assembly |
FR2515999B1 (fr) * | 1981-11-09 | 1986-09-05 | Stephanois Rech Mec | Procede de brasage s'effectuant a basse temperature, pour permettre d'obtenir des assemblages a caracteristiques mecaniques elevees, et pieces assemblees par ce procede |
US4518112A (en) * | 1982-12-30 | 1985-05-21 | International Business Machines Corporation | Process for controlled braze joining of electronic packaging elements |
US4582240A (en) * | 1984-02-08 | 1986-04-15 | Gould Inc. | Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components |
FR2573346B1 (fr) * | 1984-11-16 | 1987-02-06 | Grenoble Inst Nal Polytechni | Composites de multicouches fines metal-metal et/ou metal-semi-metal |
JPS6283593U (fr) * | 1985-11-12 | 1987-05-28 | ||
JPH0222621A (ja) * | 1988-07-09 | 1990-01-25 | Ngk Insulators Ltd | 光学素子およびそれを用いた光部品 |
DE3830174A1 (de) * | 1988-09-06 | 1990-03-15 | Geesthacht Gkss Forschung | Leitfaehige oberflaechenschicht |
US4848643A (en) * | 1988-09-19 | 1989-07-18 | Honeywell Inc. | Process of bonding plates |
US4895291A (en) * | 1989-05-04 | 1990-01-23 | Eastman Kodak Company | Method of making a hermetic seal in a solid-state device |
US5280414A (en) * | 1990-06-11 | 1994-01-18 | International Business Machines Corp. | Au-Sn transient liquid bonding in high performance laminates |
WO1992016095A1 (fr) * | 1991-03-04 | 1992-09-17 | Motorola, Inc. | Appareil de blindage pour un boitier de circuit electronique non conducteur |
JPH07506773A (ja) * | 1993-01-19 | 1995-07-27 | ヒューズ・エアクラフト・カンパニー | 中間温度拡散接合 |
US5432998A (en) * | 1993-07-27 | 1995-07-18 | International Business Machines, Corporation | Method of solder bonding processor package |
DE19742688C1 (de) * | 1997-09-26 | 1999-03-18 | Siemens Ag | Verfahren zur Herstellung eines Stapelaktors und Stapelaktor |
DE19747846A1 (de) * | 1997-10-30 | 1999-05-06 | Daimler Benz Ag | Bauelement und Verfahren zum Herstellen des Bauelements |
DE19945934C1 (de) * | 1999-09-24 | 2001-03-22 | Epcos Ag | Verfahren zur Herstellung einer Außenkontaktierung eines elektrokeramischen Bauelementes, insbesondere eines Piezoaktors |
JP2002141576A (ja) * | 2000-11-02 | 2002-05-17 | Fujitsu Ltd | ピエゾ素子と電極との接合方法及び該接合方法を使用したピエゾマイクロアクチュエータ |
US6476541B1 (en) * | 2001-02-23 | 2002-11-05 | General Electric Company | Optically controlled ultrasonic sensor |
AU2003264717A1 (en) * | 2002-08-16 | 2004-03-03 | New Transducers Limited | Method of bonding a piezoelectric material and a substrate |
US7168608B2 (en) * | 2002-12-24 | 2007-01-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and method for hermetic seal formation |
US20050253282A1 (en) * | 2004-04-27 | 2005-11-17 | Daoqiang Lu | Temperature resistant hermetic sealing formed at low temperatures for MEMS packages |
DE102007027679B4 (de) | 2007-06-15 | 2009-04-09 | Coherent Gmbh | Befestigungsvorrichtung für ein optisches Element |
US8377797B1 (en) | 2009-07-28 | 2013-02-19 | Science Research Laboratory, Inc. | Method for bonding of semiconductor component to a substrate |
FR2961945B1 (fr) * | 2010-06-23 | 2012-08-17 | Commissariat Energie Atomique | Procede de scellement de deux elements par thermocompression a basse temperature |
CN102136672B (zh) * | 2011-03-15 | 2012-12-26 | 上海交通大学 | 基于碳化硅包层板条的激光器冷却装置 |
KR101927559B1 (ko) * | 2011-08-30 | 2018-12-10 | 에베 그룹 에. 탈너 게엠베하 | 고체 상태 확산 또는 상 변환에 의해 연결 층에 의한 웨이퍼의 영구 접착을 위한 방법 |
FR2980268B1 (fr) * | 2011-09-21 | 2018-05-04 | Sck-Cen | Procede et systeme de detection dans des environnements a haute temperature |
KR101963933B1 (ko) * | 2012-09-28 | 2019-03-29 | 에베 그룹 에. 탈너 게엠베하 | 기판을 코팅 및 본딩하기 위한 방법 |
US10607857B2 (en) * | 2017-12-06 | 2020-03-31 | Indium Corporation | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger |
WO2020148626A1 (fr) * | 2019-01-16 | 2020-07-23 | Patek Philippe Sa Geneve | Procédé de brasage de composants horlogers |
CN110794597B (zh) * | 2019-11-15 | 2022-10-18 | 中国电子科技集团公司第二十六研究所 | 一种金锡合金键合层结构的声光器件及其制备方法 |
CN111799368B (zh) * | 2020-06-29 | 2021-06-22 | 中国科学院上海微系统与信息技术研究所 | 降低薄膜剥离热应力的异质结构薄膜的制备方法 |
DE102021109992A1 (de) | 2021-04-20 | 2022-10-20 | Flexim Flexible Industriemesstechnik Gmbh | Verfahren und Anordnung zur Fügung eines piezoelektrischen Materials für einen weiten Temperaturbereich |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3042550A (en) * | 1958-05-23 | 1962-07-03 | Corning Glass Works | Solid delay line improvements |
US3128545A (en) * | 1959-09-30 | 1964-04-14 | Hughes Aircraft Co | Bonding oxidized materials |
US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
US3179826A (en) * | 1961-09-14 | 1965-04-20 | Trott Winfield James | Piezolelectric assembly |
US3432913A (en) * | 1962-12-26 | 1969-03-18 | Philips Corp | Method of joining a semi-conductor to a base |
US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
US3921885A (en) * | 1973-06-28 | 1975-11-25 | Rca Corp | Method of bonding two bodies together |
US3893229A (en) * | 1973-10-29 | 1975-07-08 | Gen Electric | Mounting for light-emitting diode pellet and method for the fabrication thereof |
-
1976
- 1976-12-06 US US05/748,249 patent/US4077558A/en not_active Expired - Lifetime
-
1977
- 1977-09-23 CA CA287,334A patent/CA1078532A/fr not_active Expired
- 1977-10-14 FR FR7731853A patent/FR2373168A1/fr active Granted
- 1977-11-07 DE DE2749696A patent/DE2749696C2/de not_active Expired
- 1977-11-11 JP JP13484077A patent/JPS5370841A/ja active Granted
- 1977-11-16 GB GB47673/77A patent/GB1537816A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4077558A (en) | 1978-03-07 |
JPS5719076B2 (fr) | 1982-04-20 |
DE2749696C2 (de) | 1982-06-03 |
DE2749696A1 (de) | 1978-06-08 |
GB1537816A (en) | 1979-01-04 |
JPS5370841A (en) | 1978-06-23 |
FR2373168A1 (fr) | 1978-06-30 |
CA1078532A (fr) | 1980-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2373168B1 (fr) | ||
JPS5478694A (en) | Crystal vibrator | |
TW221037B (en) | Permanent metallic bonding method | |
GB1237672A (en) | Method for bonding a crystal to a solid delay medium | |
JPS54132187A (en) | Crystal oscillator | |
US4070749A (en) | Method of manufacturing liquid crystal display devices | |
GB1465010A (en) | Process for attaching a lead member to a semi-conductor device and product thereof | |
JPS562346Y2 (fr) | ||
ATE4092T1 (de) | Lotlegierungen zum direkten aufloeten von oxidhaltigen silberkontakten auf kontakttraeger. | |
GB1447817A (en) | Acousto-optical filters | |
JPS554175A (en) | Holding method for crystal oscillating reed | |
JPS5419690A (en) | Electrode of semiconductor devices | |
JPS5723417B2 (fr) | ||
JPS523383A (en) | Manufacturing method of semiconductor device electrode | |
CH678680GA3 (en) | Watch glass mounting - has a deposited metal layer between decorative layer and solder to prevent visible effects of soldering | |
JPS5370847A (en) | Sealing method of liquid crystal cell | |
JPS55103762A (en) | Dhd glass-sealed diode | |
GB1482807A (en) | Pressure bonding a silicon or germanium disc to a tabular metal member | |
JPS5768022A (en) | Manufacture of compound semiconductor device | |
JPS54100941A (en) | Low temperature fusion plating material | |
JPS5627947A (en) | Semiconductor device | |
JPS55103742A (en) | Fabrication of electrode of semiconductor element | |
JPS55138717A (en) | Manufacture of electrochromic display device | |
JPS5788741A (en) | Semiconductor device | |
JPS57211763A (en) | Surface treatment for lead frame for semiconductor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |