AU2003264717A1 - Method of bonding a piezoelectric material and a substrate - Google Patents
Method of bonding a piezoelectric material and a substrateInfo
- Publication number
- AU2003264717A1 AU2003264717A1 AU2003264717A AU2003264717A AU2003264717A1 AU 2003264717 A1 AU2003264717 A1 AU 2003264717A1 AU 2003264717 A AU2003264717 A AU 2003264717A AU 2003264717 A AU2003264717 A AU 2003264717A AU 2003264717 A1 AU2003264717 A1 AU 2003264717A1
- Authority
- AU
- Australia
- Prior art keywords
- bonding
- substrate
- piezoelectric material
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2002122364 | 2002-08-16 | ||
RU2002122364/28A RU2002122364A (en) | 2002-08-16 | METHOD FOR CONNECTING PIESOELECTRIC MATERIAL AND SUBSTRATE | |
PCT/GB2003/003531 WO2004016384A1 (en) | 2002-08-16 | 2003-08-13 | Method of bonding a piezoelectric material and a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003264717A1 true AU2003264717A1 (en) | 2004-03-03 |
Family
ID=31885195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003264717A Abandoned AU2003264717A1 (en) | 2002-08-16 | 2003-08-13 | Method of bonding a piezoelectric material and a substrate |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003264717A1 (en) |
WO (1) | WO2004016384A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009008284B4 (en) * | 2009-02-10 | 2019-03-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for laser-assisted, machining of high-strength materials |
EP2363373A1 (en) * | 2010-03-02 | 2011-09-07 | SensoNor Technologies AS | Bonding process for sensitive micro-and nano-systems |
CN105537756B (en) * | 2016-01-29 | 2018-06-26 | 山东大学 | A kind of cryogenic vacuum diffusion connection method of copper and zinc-containing alloy |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
US4077558A (en) * | 1976-12-06 | 1978-03-07 | International Business Machines Corporation | Diffusion bonding of crystals |
US4582240A (en) * | 1984-02-08 | 1986-04-15 | Gould Inc. | Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components |
EP0365807B1 (en) * | 1988-10-12 | 1993-12-22 | International Business Machines Corporation | Bonding of metallic surfaces |
DE4303790A1 (en) * | 1993-02-10 | 1994-08-11 | Daimler Benz Ag | Method for producing a positively engaging connection between semiconductor components and metallic surface of carrier elements |
DE19531158A1 (en) * | 1995-08-24 | 1997-02-27 | Daimler Benz Ag | Diffusion soldering method esp. for semiconductor components |
DE19532250A1 (en) * | 1995-09-01 | 1997-03-06 | Daimler Benz Ag | Diffusion soldering of a multi-layered structure |
DE19742688C1 (en) * | 1997-09-26 | 1999-03-18 | Siemens Ag | Stacked piezoelectric actuator manufacturing method e.g. for ultrasonic therapy device |
DE19747846A1 (en) * | 1997-10-30 | 1999-05-06 | Daimler Benz Ag | Component and method for producing the component |
WO2000076066A1 (en) * | 1999-06-08 | 2000-12-14 | Takaya Watanabe | Piezoelectric vibrator |
JP2002141576A (en) * | 2000-11-02 | 2002-05-17 | Fujitsu Ltd | Jointing method piezo element and electrode, and piezo micro actuator using it |
-
2003
- 2003-08-13 AU AU2003264717A patent/AU2003264717A1/en not_active Abandoned
- 2003-08-13 WO PCT/GB2003/003531 patent/WO2004016384A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2004016384A1 (en) | 2004-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |