AU2003264717A1 - Method of bonding a piezoelectric material and a substrate - Google Patents

Method of bonding a piezoelectric material and a substrate

Info

Publication number
AU2003264717A1
AU2003264717A1 AU2003264717A AU2003264717A AU2003264717A1 AU 2003264717 A1 AU2003264717 A1 AU 2003264717A1 AU 2003264717 A AU2003264717 A AU 2003264717A AU 2003264717 A AU2003264717 A AU 2003264717A AU 2003264717 A1 AU2003264717 A1 AU 2003264717A1
Authority
AU
Australia
Prior art keywords
bonding
substrate
piezoelectric material
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003264717A
Inventor
Vyachesloav Alexandrovich Fedorov
Sergei Alexandrovich Gavrilov
Dmitry Gennadievich Gromov
Yury Nikolaevich Korkishko
Viktor Borisovich Yakovlev
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NVF Tech Ltd
Original Assignee
New Transducers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from RU2002122364/28A external-priority patent/RU2002122364A/en
Application filed by New Transducers Ltd filed Critical New Transducers Ltd
Publication of AU2003264717A1 publication Critical patent/AU2003264717A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
AU2003264717A 2002-08-16 2003-08-13 Method of bonding a piezoelectric material and a substrate Abandoned AU2003264717A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
RU2002122364 2002-08-16
RU2002122364/28A RU2002122364A (en) 2002-08-16 METHOD FOR CONNECTING PIESOELECTRIC MATERIAL AND SUBSTRATE
PCT/GB2003/003531 WO2004016384A1 (en) 2002-08-16 2003-08-13 Method of bonding a piezoelectric material and a substrate

Publications (1)

Publication Number Publication Date
AU2003264717A1 true AU2003264717A1 (en) 2004-03-03

Family

ID=31885195

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003264717A Abandoned AU2003264717A1 (en) 2002-08-16 2003-08-13 Method of bonding a piezoelectric material and a substrate

Country Status (2)

Country Link
AU (1) AU2003264717A1 (en)
WO (1) WO2004016384A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009008284B4 (en) * 2009-02-10 2019-03-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for laser-assisted, machining of high-strength materials
EP2363373A1 (en) * 2010-03-02 2011-09-07 SensoNor Technologies AS Bonding process for sensitive micro-and nano-systems
CN105537756B (en) * 2016-01-29 2018-06-26 山东大学 A kind of cryogenic vacuum diffusion connection method of copper and zinc-containing alloy

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3590467A (en) * 1968-11-15 1971-07-06 Corning Glass Works Method for bonding a crystal to a solid delay medium
US4077558A (en) * 1976-12-06 1978-03-07 International Business Machines Corporation Diffusion bonding of crystals
US4582240A (en) * 1984-02-08 1986-04-15 Gould Inc. Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
EP0365807B1 (en) * 1988-10-12 1993-12-22 International Business Machines Corporation Bonding of metallic surfaces
DE4303790A1 (en) * 1993-02-10 1994-08-11 Daimler Benz Ag Method for producing a positively engaging connection between semiconductor components and metallic surface of carrier elements
DE19531158A1 (en) * 1995-08-24 1997-02-27 Daimler Benz Ag Diffusion soldering method esp. for semiconductor components
DE19532250A1 (en) * 1995-09-01 1997-03-06 Daimler Benz Ag Diffusion soldering of a multi-layered structure
DE19742688C1 (en) * 1997-09-26 1999-03-18 Siemens Ag Stacked piezoelectric actuator manufacturing method e.g. for ultrasonic therapy device
DE19747846A1 (en) * 1997-10-30 1999-05-06 Daimler Benz Ag Component and method for producing the component
WO2000076066A1 (en) * 1999-06-08 2000-12-14 Takaya Watanabe Piezoelectric vibrator
JP2002141576A (en) * 2000-11-02 2002-05-17 Fujitsu Ltd Jointing method piezo element and electrode, and piezo micro actuator using it

Also Published As

Publication number Publication date
WO2004016384A1 (en) 2004-02-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase