JPS5723417B2 - - Google Patents

Info

Publication number
JPS5723417B2
JPS5723417B2 JP9652676A JP9652676A JPS5723417B2 JP S5723417 B2 JPS5723417 B2 JP S5723417B2 JP 9652676 A JP9652676 A JP 9652676A JP 9652676 A JP9652676 A JP 9652676A JP S5723417 B2 JPS5723417 B2 JP S5723417B2
Authority
JP
Japan
Prior art keywords
substrate
bonding
tilting
header
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9652676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5321570A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9652676A priority Critical patent/JPS5321570A/ja
Publication of JPS5321570A publication Critical patent/JPS5321570A/ja
Publication of JPS5723417B2 publication Critical patent/JPS5723417B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
JP9652676A 1976-08-11 1976-08-11 Bonding method of semiconductor substrates Granted JPS5321570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9652676A JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9652676A JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Publications (2)

Publication Number Publication Date
JPS5321570A JPS5321570A (en) 1978-02-28
JPS5723417B2 true JPS5723417B2 (fr) 1982-05-18

Family

ID=14167572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9652676A Granted JPS5321570A (en) 1976-08-11 1976-08-11 Bonding method of semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS5321570A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237509A (ja) * 1985-08-12 1987-02-18 Sanshin Ind Co Ltd 多気筒内燃機関のクランク軸

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175532A (ja) * 1984-09-20 1986-04-17 Mitsubishi Electric Corp 半導体素子のはんだ付方法
JPH02181447A (ja) * 1989-01-06 1990-07-16 Matsushita Electric Ind Co Ltd ダイボンディング装置
JP6413340B2 (ja) * 2014-05-20 2018-10-31 住友電気工業株式会社 光モジュールの製造方法および光モジュールの製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122668A (fr) * 1973-03-23 1974-11-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122668A (fr) * 1973-03-23 1974-11-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237509A (ja) * 1985-08-12 1987-02-18 Sanshin Ind Co Ltd 多気筒内燃機関のクランク軸

Also Published As

Publication number Publication date
JPS5321570A (en) 1978-02-28

Similar Documents

Publication Publication Date Title
JPS5723417B2 (fr)
ZA763977B (en) "4-imino-1,3-diazobicyclo(3.1.0)hexan-2-one"
JPS52149084A (en) Crystal vibrator
JPS5233480A (en) Semiconductor device
JPS5333030A (en) Multi-mode vibrator
JPS53116072A (en) Electrode forming method for semiconductor device
JPS52140915A (en) Bonding of troughs
JPS5265184A (en) Eqipment for simultaneous sputtering at both surface
JPS53139974A (en) Semiconductor device
JPS5411694A (en) Elastic surface wave element
SU597532A1 (ru) Припой дл пайки силицированного графита со сталью
JPS5365685A (en) Piezoelectric oscillator
JPS547865A (en) Semiconductor device
JPS5370634A (en) Noise rejecting circuit for solid state pick up unit
JPS5228261A (en) Process for forming semiconductor electrodes
JPS5246828A (en) Electrochromic display unit
JPS543133A (en) Bonding of primed metal
JPS5260581A (en) Semiconductor device
JPS5354988A (en) Production of semiconductor device
JPS52149325A (en) Semiconductor rectifing device
JPS51119995A (en) Tension-proof insulator
JPS5397456A (en) Display device
JPS5345173A (en) Production of semiconductor device
JPS53139972A (en) Production of semiconductor device
JPS5380961A (en) Magnetron structure