FR2218654A1 - - Google Patents

Info

Publication number
FR2218654A1
FR2218654A1 FR7405267A FR7405267A FR2218654A1 FR 2218654 A1 FR2218654 A1 FR 2218654A1 FR 7405267 A FR7405267 A FR 7405267A FR 7405267 A FR7405267 A FR 7405267A FR 2218654 A1 FR2218654 A1 FR 2218654A1
Authority
FR
France
Prior art keywords
leads
frame
strip
plate
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7405267A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of FR2218654A1 publication Critical patent/FR2218654A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7405267A 1973-02-16 1974-02-15 Withdrawn FR2218654A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (enExample) 1973-02-16 1973-02-16

Publications (1)

Publication Number Publication Date
FR2218654A1 true FR2218654A1 (enExample) 1974-09-13

Family

ID=12005666

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7405267A Withdrawn FR2218654A1 (enExample) 1973-02-16 1974-02-15

Country Status (6)

Country Link
JP (1) JPS5144385B2 (enExample)
DE (1) DE2406086A1 (enExample)
FR (1) FR2218654A1 (enExample)
GB (1) GB1406207A (enExample)
IT (1) IT1008848B (enExample)
NL (1) NL7402112A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519001Y2 (enExample) * 1975-08-15 1980-05-06
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (enExample) * 1976-08-05 1978-02-25
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
JPS5832439A (ja) * 1982-03-01 1983-02-25 Nec Corp リ−ドフレ−ム
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
GB8910685D0 (en) * 1989-05-10 1989-06-28 Moran Peter Integrated circuit package

Also Published As

Publication number Publication date
JPS5144385B2 (enExample) 1976-11-27
DE2406086A1 (de) 1974-09-05
NL7402112A (enExample) 1974-08-20
GB1406207A (en) 1975-09-17
JPS49107674A (enExample) 1974-10-12
IT1008848B (it) 1976-11-30

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Legal Events

Date Code Title Description
ST Notification of lapse