IT1008848B - Procedimento per la fabbricazione di intelaiature metalliche per di spositivi a semiconduttori - Google Patents

Procedimento per la fabbricazione di intelaiature metalliche per di spositivi a semiconduttori

Info

Publication number
IT1008848B
IT1008848B IT48410/74A IT4841074A IT1008848B IT 1008848 B IT1008848 B IT 1008848B IT 48410/74 A IT48410/74 A IT 48410/74A IT 4841074 A IT4841074 A IT 4841074A IT 1008848 B IT1008848 B IT 1008848B
Authority
IT
Italy
Prior art keywords
leads
frame
strip
plate
procedure
Prior art date
Application number
IT48410/74A
Other languages
English (en)
Italian (it)
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of IT1008848B publication Critical patent/IT1008848B/it

Links

Classifications

    • H10W70/04—
    • H10W72/0198—
    • H10W70/457—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
IT48410/74A 1973-02-16 1974-02-15 Procedimento per la fabbricazione di intelaiature metalliche per di spositivi a semiconduttori IT1008848B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (enExample) 1973-02-16 1973-02-16

Publications (1)

Publication Number Publication Date
IT1008848B true IT1008848B (it) 1976-11-30

Family

ID=12005666

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48410/74A IT1008848B (it) 1973-02-16 1974-02-15 Procedimento per la fabbricazione di intelaiature metalliche per di spositivi a semiconduttori

Country Status (6)

Country Link
JP (1) JPS5144385B2 (enExample)
DE (1) DE2406086A1 (enExample)
FR (1) FR2218654A1 (enExample)
GB (1) GB1406207A (enExample)
IT (1) IT1008848B (enExample)
NL (1) NL7402112A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519001Y2 (enExample) * 1975-08-15 1980-05-06
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (enExample) * 1976-08-05 1978-02-25
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
JPS5832439A (ja) * 1982-03-01 1983-02-25 Nec Corp リ−ドフレ−ム
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
GB8910685D0 (en) * 1989-05-10 1989-06-28 Moran Peter Integrated circuit package

Also Published As

Publication number Publication date
GB1406207A (en) 1975-09-17
JPS49107674A (enExample) 1974-10-12
JPS5144385B2 (enExample) 1976-11-27
NL7402112A (enExample) 1974-08-20
FR2218654A1 (enExample) 1974-09-13
DE2406086A1 (de) 1974-09-05

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