JPS56105646A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56105646A
JPS56105646A JP853580A JP853580A JPS56105646A JP S56105646 A JPS56105646 A JP S56105646A JP 853580 A JP853580 A JP 853580A JP 853580 A JP853580 A JP 853580A JP S56105646 A JPS56105646 A JP S56105646A
Authority
JP
Japan
Prior art keywords
inferior
articles
errors
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP853580A
Other languages
Japanese (ja)
Other versions
JPS6138856B2 (en
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP853580A priority Critical patent/JPS56105646A/en
Publication of JPS56105646A publication Critical patent/JPS56105646A/en
Publication of JPS6138856B2 publication Critical patent/JPS6138856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent counting errors of excellent articles and errors in fitting inferior articles by collectively cutting out leads and lead frame of inferior semiconductor device and by leaving the excellent goods only on a film carrier. CONSTITUTION:A semiconductor element 4 judged inferior is punched with a metal mold at the lead part 2, or allowed to be cut out from a polyamide frame supporting the lead. In such a manner, a production rate of the inferior articles is made clear and accurate by each different process and a special inferiority rate is clarified by changing a shape of cutting dies. Further, there can not occur the counting errors of excellent articles and errors of cutting down and using the inferior goods.
JP853580A 1980-01-28 1980-01-28 Manufacture of semiconductor device Granted JPS56105646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP853580A JPS56105646A (en) 1980-01-28 1980-01-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP853580A JPS56105646A (en) 1980-01-28 1980-01-28 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56105646A true JPS56105646A (en) 1981-08-22
JPS6138856B2 JPS6138856B2 (en) 1986-09-01

Family

ID=11695836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP853580A Granted JPS56105646A (en) 1980-01-28 1980-01-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56105646A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57350A (en) * 1980-05-31 1982-01-05 Hino Motors Ltd Exhaust recirculation controller in diese lengine
JPS5944840A (en) * 1982-09-07 1984-03-13 Toshiba Corp Measuring apparatus of flat package
JPS6021456A (en) * 1983-07-15 1985-02-02 Shimadzu Corp Automatic analyzer
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57350A (en) * 1980-05-31 1982-01-05 Hino Motors Ltd Exhaust recirculation controller in diese lengine
JPS5944840A (en) * 1982-09-07 1984-03-13 Toshiba Corp Measuring apparatus of flat package
JPS6021456A (en) * 1983-07-15 1985-02-02 Shimadzu Corp Automatic analyzer
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly

Also Published As

Publication number Publication date
JPS6138856B2 (en) 1986-09-01

Similar Documents

Publication Publication Date Title
ES8402520A1 (en) Process for the manufacture of a rack
RO82787B (en) Process for the fabrication of a metal recipient
JPS56105646A (en) Manufacture of semiconductor device
BE755003A (en) PROCESS FOR MANUFACTURING PRINTED ARTICLES, ESPECIALLY KNITTED
GB1406207A (en) Method of manufacturing a metallic lead frame for a semiconductor device
JPS5578273A (en) Manufacture for decoration plate for watch
FR2278416A1 (en) PROCESS AND DEVICE FOR THE MANUFACTURING OF PROFILES, IN PARTICULAR LIGHT METAL PROFILES
JPS5651505B2 (en)
FR2338228A1 (en) PROCESS FOR MANUFACTURING GLASS OBJECTS, BY MOLDING AND PRESSING OF A PARASON
FR2293794A1 (en) PROCESS FOR THE MANUFACTURING OF A SEMICONDUCTOR DEVICE, AND MANUFACTURED DEVICE OF THE KIND
JPS56158462A (en) Lead frame for single inline semiconductor device
IL35481A0 (en) A process for producing discrete semiconductor devices or integrated circuits,and the devices obtained by said process
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5593243A (en) Semiconductor device
GB1211184A (en) Pressing of glass articles from molten glass
JPS57184545A (en) Production for case of wrist watch
BE782327A (en) PROCESS FOR MANUFACTURING A PRECIOUS METAL POSTAL STAMP AND STAMP OBTAINED BY THIS PROCESS
JPS55157247A (en) Lead frame for semiconductor element
JPS55151357A (en) Lead frame for semiconductor device
FR2333755A1 (en) PROCESS FOR THE MANUFACTURE OF MOLDED PARTS WITH REVOLUTION SYMMETRY IN PLASTICALLY DEFORMABLE MATERIALS, IN PARTICULAR GLASS
JPS5310462A (en) Method of manufacturing noble metal-plated watch case
JPS542091A (en) Crystal oscillator and its manufacture
JPS5210339A (en) Method for coating a wire
JPS575340A (en) Manufacture of semiconductor device
JPS52113677A (en) Production of semiconductor device