JPS5694781A - Flip chip type transistor and manufacturing method thereof - Google Patents

Flip chip type transistor and manufacturing method thereof

Info

Publication number
JPS5694781A
JPS5694781A JP17185179A JP17185179A JPS5694781A JP S5694781 A JPS5694781 A JP S5694781A JP 17185179 A JP17185179 A JP 17185179A JP 17185179 A JP17185179 A JP 17185179A JP S5694781 A JPS5694781 A JP S5694781A
Authority
JP
Japan
Prior art keywords
electrode
type
source
flip chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17185179A
Other languages
Japanese (ja)
Inventor
Michihiro Kobiki
Manabu Watase
Yasuro Mitsui
Mutsuyuki Otsubo
Takashi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17185179A priority Critical patent/JPS5694781A/en
Publication of JPS5694781A publication Critical patent/JPS5694781A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To improve reproducibility, mass productivity and reliability by a method wherein an island type source projecting electrode is connected with an electrolytic metal plating. CONSTITUTION:A beam type electrode 21, a drain projecting electrode 7 and a gate projecting electrode 8 of a flip chip type GaAs chip 22 are brazed with a solder 23 to a carrier main body 10 having a source electrode terminal function and strip lines 12, 14. In a structure wherein each source electrode of an island type is connected with the beam type electrode, even when several score of island type source electrodes are provided in one chip as in a high output FET, if three prober needles are erected, an autotester can be introduced as in a small signal FET.
JP17185179A 1979-12-28 1979-12-28 Flip chip type transistor and manufacturing method thereof Pending JPS5694781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17185179A JPS5694781A (en) 1979-12-28 1979-12-28 Flip chip type transistor and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17185179A JPS5694781A (en) 1979-12-28 1979-12-28 Flip chip type transistor and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JPS5694781A true JPS5694781A (en) 1981-07-31

Family

ID=15930943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17185179A Pending JPS5694781A (en) 1979-12-28 1979-12-28 Flip chip type transistor and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPS5694781A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352926A (en) * 1993-01-04 1994-10-04 Motorola, Inc. Flip chip package and method of making
US6166436A (en) * 1997-04-16 2000-12-26 Matsushita Electric Industrial Co., Ltd. High frequency semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49108972A (en) * 1973-02-07 1974-10-16
JPS54138370A (en) * 1978-04-19 1979-10-26 Mitsubishi Electric Corp Flip chip mounting body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49108972A (en) * 1973-02-07 1974-10-16
JPS54138370A (en) * 1978-04-19 1979-10-26 Mitsubishi Electric Corp Flip chip mounting body

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352926A (en) * 1993-01-04 1994-10-04 Motorola, Inc. Flip chip package and method of making
US6166436A (en) * 1997-04-16 2000-12-26 Matsushita Electric Industrial Co., Ltd. High frequency semiconductor device

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