JPS5769764A - Connecting structure of fet - Google Patents

Connecting structure of fet

Info

Publication number
JPS5769764A
JPS5769764A JP55144372A JP14437280A JPS5769764A JP S5769764 A JPS5769764 A JP S5769764A JP 55144372 A JP55144372 A JP 55144372A JP 14437280 A JP14437280 A JP 14437280A JP S5769764 A JPS5769764 A JP S5769764A
Authority
JP
Japan
Prior art keywords
fet
conductor
metal plate
slit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55144372A
Other languages
Japanese (ja)
Other versions
JPS6318881B2 (en
Inventor
Masaki Noda
Takao Shinkawa
Chuichi Sodeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55144372A priority Critical patent/JPS5769764A/en
Publication of JPS5769764A publication Critical patent/JPS5769764A/en
Publication of JPS6318881B2 publication Critical patent/JPS6318881B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Connection Structure (AREA)
  • Microwave Amplifiers (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To earth a source electrode of FET with simple constituion and to constitute as not to generate damage of the FET by a method wherein a conductor on the back of a metal plate and the source metal face of the FET are connected using the metal plate being formed a cross type slit therein. CONSTITUTION:The cross type slit 15 is provided at the center of the metal plate 14, and a square to be formed by connecting the tops of the slit 15 is made as to have size being insertable the FET1 therein. Pedestal type parts formed between the slit 15 are bent rectangularly to form ratches 16, the source metal face 8 is fixed therein as to protrude on the conductor 11 side on the back, the flange part 19 of the metal plate 14 and the conductor 11 on the back are soldered with a solder 17, and the ratches 16 and the metal face 8 are soldered with the solder 13. Accordingly the source electrode 6 can be earthed with short lead length, and damage of the FET to be caused by flowing of the solder in e gap 12 generating short-circuit between the conductor 11 on the back and a gate electrode 5 or a drain electrode 6 is not generated.
JP55144372A 1980-10-17 1980-10-17 Connecting structure of fet Granted JPS5769764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55144372A JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55144372A JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Publications (2)

Publication Number Publication Date
JPS5769764A true JPS5769764A (en) 1982-04-28
JPS6318881B2 JPS6318881B2 (en) 1988-04-20

Family

ID=15360580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55144372A Granted JPS5769764A (en) 1980-10-17 1980-10-17 Connecting structure of fet

Country Status (1)

Country Link
JP (1) JPS5769764A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135114U (en) * 1982-03-08 1983-09-10 株式会社東芝 microwave fet amplifier
JPS59224148A (en) * 1983-06-02 1984-12-17 Sumitomo Electric Ind Ltd Package for semiconductor element
JPS6049675A (en) * 1983-08-29 1985-03-18 Fujitsu Ltd Semiconductor device
EP2911487A1 (en) * 2014-02-21 2015-08-26 Autoliv Development AB Circuit board mounting arrangement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135114U (en) * 1982-03-08 1983-09-10 株式会社東芝 microwave fet amplifier
JPS59224148A (en) * 1983-06-02 1984-12-17 Sumitomo Electric Ind Ltd Package for semiconductor element
JPS6049675A (en) * 1983-08-29 1985-03-18 Fujitsu Ltd Semiconductor device
EP2911487A1 (en) * 2014-02-21 2015-08-26 Autoliv Development AB Circuit board mounting arrangement

Also Published As

Publication number Publication date
JPS6318881B2 (en) 1988-04-20

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