FI974488A - Puolijohdeyksikön kotelo, puolijohdeyksikön kotelointimenetelmä sekä kapselointi käytettäväksi puolijohdeyksikön kotelointiin - Google Patents

Puolijohdeyksikön kotelo, puolijohdeyksikön kotelointimenetelmä sekä kapselointi käytettäväksi puolijohdeyksikön kotelointiin Download PDF

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Publication number
FI974488A
FI974488A FI974488A FI974488A FI974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A FI 974488 A FI974488 A FI 974488A
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FI
Finland
Prior art keywords
enclosure
semiconductor unit
procedure
capsule
semiconductor
Prior art date
Application number
FI974488A
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English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI974488A0 (fi
Inventor
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Mitsuru Harada
Yoshihiro Bessho
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP07308798A external-priority patent/JP3093621B2/ja
Priority claimed from US08/593,675 external-priority patent/US5641996A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of FI974488A0 publication Critical patent/FI974488A0/fi
Publication of FI974488A publication Critical patent/FI974488A/fi

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    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Epoxy Resins (AREA)
  • Tires In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FI974488A 1995-06-12 1997-12-11 Puolijohdeyksikön kotelo, puolijohdeyksikön kotelointimenetelmä sekä kapselointi käytettäväksi puolijohdeyksikön kotelointiin FI974488A (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14437395 1995-06-12
JP07308798A JP3093621B2 (ja) 1995-01-30 1995-11-28 半導体装置の実装方法
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en) 1995-06-12 1996-06-12 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

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FI974488A0 FI974488A0 (fi) 1997-12-11
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US6133637A (en) * 1997-01-24 2000-10-17 Rohm Co., Ltd. Semiconductor device having a plurality of semiconductor chips
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US6407461B1 (en) 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
DE69934153T2 (de) * 1998-02-02 2007-09-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Montage von Flip-Chip-Halbleiterbauelementen
CN1143373C (zh) 1998-07-01 2004-03-24 精工爱普生株式会社 半导体装置及其制造方法、电路基板和电子装置
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
CN103477428B (zh) * 2011-05-13 2016-10-19 富士电机株式会社 半导体器件及其制造方法
JP5658088B2 (ja) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 半導体パッケージ部品の実装構造体および製造方法
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
US10157887B2 (en) * 2017-03-09 2018-12-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US10297564B2 (en) * 2017-10-05 2019-05-21 Infineon Technologies Ag Semiconductor die attach system and method

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JPS63268724A (ja) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JP2515344B2 (ja) * 1987-07-24 1996-07-10 松下電工株式会社 封止用一液性の液状エポキシ樹脂組成物
JPH04130633A (ja) * 1990-09-20 1992-05-01 Matsushita Electron Corp 半導体装置とその製造方法およびそれに用いるキャピラリ
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法
JPH06279654A (ja) * 1993-02-26 1994-10-04 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JPH06313027A (ja) * 1993-05-06 1994-11-08 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

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SE9704602D0 (sv) 1997-12-10
ID19377A (id) 1998-07-09
AU695142B2 (en) 1998-08-06
SE9704602L (sv) 1998-02-05
NO321429B1 (no) 2006-05-08
AU6015496A (en) 1997-01-09
CN1185231A (zh) 1998-06-17
CA2221286A1 (en) 1996-12-27
ID19376A (id) 1998-07-09
IN192021B (no) 2004-02-07
NO975833D0 (no) 1997-12-11
CN1101594C (zh) 2003-02-12
WO1996042106A1 (en) 1996-12-27
FI974488A0 (fi) 1997-12-11
NO975833L (no) 1998-02-03
SE522253C2 (sv) 2004-01-27

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