KR970003225U - 테블릿 보호장치 - Google Patents
테블릿 보호장치Info
- Publication number
- KR970003225U KR970003225U KR2019950013173U KR19950013173U KR970003225U KR 970003225 U KR970003225 U KR 970003225U KR 2019950013173 U KR2019950013173 U KR 2019950013173U KR 19950013173 U KR19950013173 U KR 19950013173U KR 970003225 U KR970003225 U KR 970003225U
- Authority
- KR
- South Korea
- Prior art keywords
- protection device
- tablet protection
- tablet
- protection
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950013173U KR0124553Y1 (ko) | 1995-06-12 | 1995-06-12 | 테블릿 보호장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950013173U KR0124553Y1 (ko) | 1995-06-12 | 1995-06-12 | 테블릿 보호장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970003225U true KR970003225U (ko) | 1997-01-24 |
KR0124553Y1 KR0124553Y1 (ko) | 1999-02-18 |
Family
ID=19415334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950013173U KR0124553Y1 (ko) | 1995-06-12 | 1995-06-12 | 테블릿 보호장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0124553Y1 (ko) |
-
1995
- 1995-06-12 KR KR2019950013173U patent/KR0124553Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0124553Y1 (ko) | 1999-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20051299D0 (no) | Boreror-beskyttelsesanordning | |
DE69608918T2 (de) | Zerkleinerungsvorrichtung | |
BR9606198A (pt) | Aparelho | |
DE69605458D1 (de) | Ausserhalb-der-Spur-Alarmeinrichtung | |
DK0732046T3 (da) | Lokaliseringsindretning | |
DE69628849D1 (de) | Teleskopartige schutzeinrichtung | |
FI960583A (fi) | Hälytinlaite | |
DE69602082T2 (de) | Sicherheitsgerät | |
BR9602906A (pt) | Dispositivo protetor | |
DK0745364T3 (da) | Ørebeskyttelsesanordning | |
DE59504521D1 (de) | Überspannungsschutzgerät | |
BR9611186A (pt) | Aparelho moedor-misturador | |
DE19680844D2 (de) | Getränke-Schutzvorrichtung | |
IT1279616B1 (it) | Dispositivo gommatore | |
KR970003225U (ko) | 테블릿 보호장치 | |
KR970008018U (ko) | 장제용 위패 | |
IT1279619B1 (it) | Dispositivo gommatore | |
BR9603137A (pt) | Aparelho | |
EE00059U1 (et) | Varakaitseseade | |
IT1279608B1 (it) | Dispositivo gommatore | |
SE9504092D0 (sv) | Skyddsanordning | |
KR970031201U (ko) | 접촉 방지 장치 | |
KR970021022U (ko) | 전격방지장치 | |
SE9501271D0 (sv) | Fallskydd | |
ATE174454T1 (de) | Überspannungsschutzgerät |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040331 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |