NO975833L - Halvleder enhetpakke, fremgangsmåte ved pakking av halvlederenhet, og innkapsling for bruk ved halvlederenhet pakking - Google Patents

Halvleder enhetpakke, fremgangsmåte ved pakking av halvlederenhet, og innkapsling for bruk ved halvlederenhet pakking

Info

Publication number
NO975833L
NO975833L NO975833A NO975833A NO975833L NO 975833 L NO975833 L NO 975833L NO 975833 A NO975833 A NO 975833A NO 975833 A NO975833 A NO 975833A NO 975833 L NO975833 L NO 975833L
Authority
NO
Norway
Prior art keywords
semiconductor unit
enclosure
pack
packing
unit packing
Prior art date
Application number
NO975833A
Other languages
English (en)
Other versions
NO321429B1 (no
NO975833D0 (no
Inventor
Kazunori Omoya
Takashi Oobayashi
Wataru Sakurai
Mitsuru Harada
Yoshihiro Bessho
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07308798A external-priority patent/JP3093621B2/ja
Priority claimed from US08/593,675 external-priority patent/US5641996A/en
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of NO975833D0 publication Critical patent/NO975833D0/no
Publication of NO975833L publication Critical patent/NO975833L/no
Publication of NO321429B1 publication Critical patent/NO321429B1/no

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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Tires In General (AREA)
  • Epoxy Resins (AREA)
NO19975833A 1995-06-12 1997-12-11 Halvleder enhetpakke, fremgangsmate ved pakking av halvlederenhet, og innkapsling for bruk ved halvlederenhet pakking NO321429B1 (no)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14437395 1995-06-12
JP07308798A JP3093621B2 (ja) 1995-01-30 1995-11-28 半導体装置の実装方法
US08/593,675 US5641996A (en) 1995-01-30 1996-01-29 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en) 1995-06-12 1996-06-12 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

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Publication Number Publication Date
NO975833D0 NO975833D0 (no) 1997-12-11
NO975833L true NO975833L (no) 1998-02-03
NO321429B1 NO321429B1 (no) 2006-05-08

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AU (1) AU695142B2 (no)
CA (1) CA2221286A1 (no)
FI (1) FI974488A (no)
ID (2) ID19377A (no)
IN (1) IN192021B (no)
NO (1) NO321429B1 (no)
SE (1) SE522253C2 (no)
WO (1) WO1996042106A1 (no)

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KR100522223B1 (ko) * 1997-01-24 2005-12-21 로무 가부시키가이샤 반도체장치및그제조방법
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
US6407461B1 (en) 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
EP0933809B1 (en) * 1998-02-02 2006-11-29 Shin-Etsu Chemical Co., Ltd. Method for mounting flip-chip semiconductor devices
US6995476B2 (en) 1998-07-01 2006-02-07 Seiko Epson Corporation Semiconductor device, circuit board and electronic instrument that include an adhesive with conductive particles therein
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
US8957508B2 (en) * 2011-05-13 2015-02-17 Fuji Electric Co., Ltd. Semiconductor device and method of manufacturing the same
JP5658088B2 (ja) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 半導体パッケージ部品の実装構造体および製造方法
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
US10157887B2 (en) * 2017-03-09 2018-12-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US10297564B2 (en) * 2017-10-05 2019-05-21 Infineon Technologies Ag Semiconductor die attach system and method

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JPS63268724A (ja) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JP2515344B2 (ja) * 1987-07-24 1996-07-10 松下電工株式会社 封止用一液性の液状エポキシ樹脂組成物
JPH04130633A (ja) * 1990-09-20 1992-05-01 Matsushita Electron Corp 半導体装置とその製造方法およびそれに用いるキャピラリ
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法
US5436503A (en) * 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JPH06279654A (ja) * 1993-02-26 1994-10-04 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物
JPH06313027A (ja) * 1993-05-06 1994-11-08 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

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CN1185231A (zh) 1998-06-17
ID19376A (id) 1998-07-09
AU695142B2 (en) 1998-08-06
ID19377A (id) 1998-07-09
AU6015496A (en) 1997-01-09
IN192021B (no) 2004-02-07
NO321429B1 (no) 2006-05-08
WO1996042106A1 (en) 1996-12-27
NO975833D0 (no) 1997-12-11
FI974488A0 (fi) 1997-12-11
SE9704602L (sv) 1998-02-05
CA2221286A1 (en) 1996-12-27
SE9704602D0 (sv) 1997-12-10
SE522253C2 (sv) 2004-01-27
FI974488A (fi) 1998-02-09
CN1101594C (zh) 2003-02-12

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