FI96034B - Epoxidhartsblandningar - Google Patents

Epoxidhartsblandningar Download PDF

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Publication number
FI96034B
FI96034B FI901083A FI901083A FI96034B FI 96034 B FI96034 B FI 96034B FI 901083 A FI901083 A FI 901083A FI 901083 A FI901083 A FI 901083A FI 96034 B FI96034 B FI 96034B
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FI
Finland
Prior art keywords
epoxy resin
mixtures according
resin mixtures
component
group
Prior art date
Application number
FI901083A
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English (en)
Finnish (fi)
Other versions
FI96034C (sv
FI901083A0 (sv
Inventor
Wolfgang Rogler
Gentzkow Wolfgang Von
Juergen Huber
Dieter Wilhelm
Original Assignee
Siemens Ag
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Filing date
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Publication of FI901083A0 publication Critical patent/FI901083A0/sv
Publication of FI96034B publication Critical patent/FI96034B/sv
Application granted granted Critical
Publication of FI96034C publication Critical patent/FI96034C/sv

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Disintegrating Or Milling (AREA)
  • Biological Depolymerization Polymers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Organic Insulating Materials (AREA)

Claims (12)

1. Epoxidhartsblandningar för framställning av prepregs och kompositmaterial kännetecknad e 5 av, att de innehäller följande komponenter: (A) ett fosforfritt, aromatiskt och/eller hetero-cykliskt polyepoxidharts, eventuellt i blandning med ali-fatiskt epoxidharts, (B) en fosforförening som innehäller epoxidgrupper 10 och som har följande struktur Γ ΙΓχΊυ / \ 1 * X 9 / \ CH9—CH-CH9-A1---P-R'--P----CH„-CH-CH0 L M<R>n Jo 15 väri m = 0 eller 1, n = 0, 1 eller 2 och o = 1,2 eller 3, varvid m + n + o * 3, och p * 0, 1 eller 2; X är ett fritt elektronpar eller en genom en dubbelbindning bunden O-20 eller S-atom, R är en direkt eller genom O- eller S-atomen bunden alkylgrupp med 1-4 C-atomer, en alkenylgrupp med 2-3 C-atomer, arylgrupp, aralkylgrupp, dialkylamino-eller alkylarylaminogrupp eller 3-trialkyl-silyl-propyl-grupp; R' är en bryggrupp O, S, fenylen, dioxifenylen, 25 dioxinaftylen, (CH2)r, 0-(CH2)r eller 0-(CH2)r-0, varvid r = 1 - 3; och bäda grupperna A1 och A2, vilka kan vara lika eller olika, är en enkelbindning eller en bryggrupp som motsvarar grupperingen R1; (C) som härdare en aromatisk polyamin med följande 30 struktur: 96034
5 Y^R2 R2 °γγ° r2 . :&y-ie . väri den ena av grupperna R1 och R2 i var och en av de tre aromatiska delstrukturerna är en H-atom och den andra är 15 en alkylgrupp.
2. Epoxidhartsblandningar enligt patentkrav 1, kännetecknade av, att komponenten B är en di-eller triglycidylester av fosforsyra eller en blandning av dessa föreningar.
3. Epoxidhartsblandningar enligt patentkrav 1, kännetecknade av, att komponenten B är en di-glycidylester av en alkyl- eller arylfosfonsyra.
4. Epoxidhartsblandningar enligt patentkrav 1, kännetecknade av, att komponenten B är en di- 25 eller triglycidylester av fosforsyrlighet eller en blandning av denna föreningar.
5. Epoxidhartsblandningar enligt nägot av patent-kraven 1-4, kännetecknade av, att förhäl-landet mellan komponten A och komponenten B är 10:1 - 30 1:10, företrädesvis 4:1 - 1:4. . 6. Epoxidhartsblandningar enligt nägot av patent- : kraven 1-5, kännetecknade av, att förhäl- landet mellan de funktionella epoxidgrupperna och de funk-tionella aminvätegrupperna är 0,9:1 - 1,1:1, företrädesvis 35 cirka 1:1. 96034
7. Epoxidhartsblandningar enligt nägot av patentkraven 1 - 6, kännetecknade av, att kompo-nenten C är en polyaminblandning framstäiId genom trime-risering av en blandning av 2,4- och 2,6-di-isocyanatal- 5 kylbensener och efterföljande hydrolys.
8. Epoxidhartsblandningar enligt nägot av patent-kraven 1 - 7, kännetecknade av, att kom-ponenten C är närvarande i blandningen med andra aromatis-ka och/eller heterocykliska polyaminer som verkar som här- 10 dare.
9. Epoxidhartsblandningar enligt patentkrav 8, kännetecknade av, att komponentens andel C i härdarblandningen är minst 70 vikt-%.
10. Epoxidhartsblandningar enligt nägot av paten-15 tkraven 1 - 9, kännetecknade av, att poly- epoxidhartset är en epoxierad novolack, som iimehäller företrädesvis mindre än 0,1 vikt-% hydrolyserbar halogen.
11. Prepregs och kompositmaterial baserade pä oor-ganiska eller organiska armeringsmedel i form av fiber, 20 fiberflor eller vävnader eller skivartade material, kännetecknade av, att de är framställda av epoksidhartsblandningar enligt nägot av patentkraven 1 - 10.
12. Mönsterkort, kännetecknade av, 25 att de är framställda av prepregs som är framställda av glasf ibervävnader och epoksidhartsblandningar enligt nägot av patentkraven 1-10. 1 II
FI901083A 1989-03-03 1990-03-02 Epoxidhartsblandningar FI96034C (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP89103802 1989-03-03
EP89103802A EP0384940B1 (de) 1989-03-03 1989-03-03 Epoxidharzmischungen

Publications (3)

Publication Number Publication Date
FI901083A0 FI901083A0 (sv) 1990-03-02
FI96034B true FI96034B (sv) 1996-01-15
FI96034C FI96034C (sv) 1996-04-25

Family

ID=8201040

Family Applications (1)

Application Number Title Priority Date Filing Date
FI901083A FI96034C (sv) 1989-03-03 1990-03-02 Epoxidhartsblandningar

Country Status (8)

Country Link
US (1) US5376453A (sv)
EP (1) EP0384940B1 (sv)
JP (1) JP2797254B2 (sv)
KR (1) KR0176963B1 (sv)
AT (1) ATE107677T1 (sv)
DE (1) DE58907953D1 (sv)
FI (1) FI96034C (sv)
HK (1) HK64096A (sv)

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KR0176963B1 (ko) 1999-05-15
KR900014508A (ko) 1990-10-24
JPH02269730A (ja) 1990-11-05
ATE107677T1 (de) 1994-07-15
EP0384940B1 (de) 1994-06-22
FI96034C (sv) 1996-04-25
FI901083A0 (sv) 1990-03-02
EP0384940A1 (de) 1990-09-05
DE58907953D1 (de) 1994-07-28
JP2797254B2 (ja) 1998-09-17
US5376453A (en) 1994-12-27
HK64096A (en) 1996-04-19

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