FI2633746T3 - Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo - Google Patents
Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo Download PDFInfo
- Publication number
- FI2633746T3 FI2633746T3 FIEP11836909.9T FI11836909T FI2633746T3 FI 2633746 T3 FI2633746 T3 FI 2633746T3 FI 11836909 T FI11836909 T FI 11836909T FI 2633746 T3 FI2633746 T3 FI 2633746T3
- Authority
- FI
- Finland
- Prior art keywords
- composite film
- base layer
- film according
- group
- top layer
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims 16
- 229920005989 resin Polymers 0.000 claims 15
- 239000011347 resin Substances 0.000 claims 15
- 239000011231 conductive filler Substances 0.000 claims 10
- 239000002245 particle Substances 0.000 claims 10
- 229920001187 thermosetting polymer Polymers 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 5
- 239000002952 polymeric resin Substances 0.000 claims 5
- 229910052709 silver Inorganic materials 0.000 claims 5
- 239000004332 silver Substances 0.000 claims 5
- 229920003002 synthetic resin Polymers 0.000 claims 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 239000007771 core particle Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000010420 shell particle Substances 0.000 claims 4
- 239000011162 core material Substances 0.000 claims 3
- 239000000945 filler Substances 0.000 claims 3
- 229910002804 graphite Inorganic materials 0.000 claims 3
- 239000010439 graphite Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 238000003856 thermoforming Methods 0.000 claims 3
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 2
- 229920000459 Nitrile rubber Polymers 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- 229920006397 acrylic thermoplastic Polymers 0.000 claims 2
- 229920001971 elastomer Polymers 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 229920006287 phenoxy resin Polymers 0.000 claims 2
- 239000013034 phenoxy resin Substances 0.000 claims 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229920000098 polyolefin Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 229920001021 polysulfide Polymers 0.000 claims 2
- 239000005077 polysulfide Substances 0.000 claims 2
- 150000008117 polysulfides Polymers 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- 229920002554 vinyl polymer Polymers 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- -1 polyethylene Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
- G21F1/00—Shielding characterised by the composition of the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40670510P | 2010-10-26 | 2010-10-26 | |
| PCT/US2011/057418 WO2012058131A2 (en) | 2010-10-26 | 2011-10-24 | Composite film for board level emi shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FI2633746T3 true FI2633746T3 (fi) | 2023-07-24 |
Family
ID=45994675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FIEP11836909.9T FI2633746T3 (fi) | 2010-10-26 | 2011-10-24 | Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8847184B2 (enExample) |
| EP (1) | EP2633746B1 (enExample) |
| JP (2) | JP6082696B2 (enExample) |
| KR (1) | KR101584872B1 (enExample) |
| CN (1) | CN103190209B (enExample) |
| FI (1) | FI2633746T3 (enExample) |
| TW (1) | TWI507120B (enExample) |
| WO (1) | WO2012058131A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9678499B2 (en) | 2012-06-27 | 2017-06-13 | Mitsubishi Electric Research Laboratories, Inc. | Method for controlling redundantly actuated machines for cutting a pattern of disconnected contours |
| TWI573523B (zh) * | 2014-04-10 | 2017-03-01 | Joinsoon Electronic Manufacturing Co Ltd | Prevention and control of electrical signals are disturbed by the method and its circuit structure |
| CN106465568B (zh) * | 2014-06-02 | 2019-01-01 | 大自达电线股份有限公司 | 导电性接合膜、印刷布线板及电子设备 |
| KR102314774B1 (ko) | 2014-11-26 | 2021-10-21 | 삼성전자주식회사 | 반도체 패키지 |
| US9635789B2 (en) | 2015-01-30 | 2017-04-25 | Laird Technologies, Inc. | Board level electromagnetic interference (EMI) shields with increased under-shield space |
| KR101862121B1 (ko) * | 2015-02-02 | 2018-05-29 | 토요잉크Sc홀딩스주식회사 | 전자파 차폐 시트, 프린트 배선판 및 전자 기기 |
| EP3075798A1 (en) * | 2015-04-01 | 2016-10-05 | Ronald R. Savin | Coating compositions |
| JP3216710U (ja) | 2015-06-12 | 2018-06-21 | グラフテック インターナショナル ホールディングス インコーポレイティド | グラファイト複合材料及び熱管理システム |
| US9968004B2 (en) | 2015-09-25 | 2018-05-08 | Laird Technologies, Inc. | Thermal interface materials including electrically-conductive material |
| CN213951063U (zh) | 2016-03-31 | 2021-08-13 | 新格拉夫解决方案有限责任公司 | 噪声抑制石墨物品和组件 |
| JP6528733B2 (ja) | 2016-06-21 | 2019-06-12 | 株式会社デンソー | エジェクタ式冷凍サイクル |
| US10080317B2 (en) | 2016-06-29 | 2018-09-18 | Microsoft Technology Licensing, Llc | Polymeric electromagnetic shield for electronic components |
| TWI619561B (zh) * | 2016-07-28 | 2018-04-01 | Rotating target | |
| US10477738B2 (en) | 2017-03-06 | 2019-11-12 | Laird Technologies, Inc. | Board level shields and systems and methods of applying board level shielding |
| KR20190076250A (ko) | 2017-12-22 | 2019-07-02 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
| KR102616814B1 (ko) * | 2018-03-09 | 2023-12-21 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
| CN111972051A (zh) | 2018-03-16 | 2020-11-20 | 华为技术有限公司 | 用于电磁干扰屏蔽的组件及方法 |
| KR102075669B1 (ko) * | 2018-10-26 | 2020-02-10 | 오재숙 | 신호 전송 커넥터 및 그 제조방법 |
| KR102869375B1 (ko) * | 2020-07-28 | 2025-10-14 | 삼성전자주식회사 | Fpcb 조립체 및 이를 포함하는 전자 기기 |
| KR102521564B1 (ko) * | 2021-01-14 | 2023-04-12 | 성균관대학교산학협력단 | 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3157344B2 (ja) * | 1993-04-27 | 2001-04-16 | 三洋電機株式会社 | 導電シート及び表示器の製造方法 |
| US5639989A (en) | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
| JPH087658A (ja) * | 1994-06-22 | 1996-01-12 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
| JP2002223094A (ja) | 2001-01-25 | 2002-08-09 | Yokohama Rubber Co Ltd:The | 電波吸収体の構造 |
| US6900383B2 (en) | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| US6674652B2 (en) * | 2002-01-29 | 2004-01-06 | 3Com Corporation | Integrated shield wrap |
| US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
| US20060247352A1 (en) * | 2005-04-29 | 2006-11-02 | Ariel - University Research And Development Ltd. | EMI shielding material |
| JP4319167B2 (ja) | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法 |
| KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| JP2007073547A (ja) * | 2005-09-02 | 2007-03-22 | Yuji Suda | 電子部品の加圧装置 |
| KR101367040B1 (ko) * | 2006-03-28 | 2014-02-24 | 파커-한니핀 코포레이션 | 분배성 경화 수지 |
| JP4914262B2 (ja) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | シールドフィルム及びシールドプリント配線板 |
| JP2007324161A (ja) * | 2006-05-30 | 2007-12-13 | Yuji Suda | ビルドアップ多層配線板の製造方法 |
| JP5129935B2 (ja) * | 2006-06-13 | 2013-01-30 | 日東電工株式会社 | シート状複合材料及びその製造方法 |
| US20100096181A1 (en) * | 2007-03-29 | 2010-04-22 | Munetomo Nakamura | Electromagnetic shield sheet and rfid plate |
| GB0710425D0 (en) | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
| JP5487419B2 (ja) * | 2008-02-12 | 2014-05-07 | タツタ電線株式会社 | 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法 |
| JP5139156B2 (ja) | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | 電磁波シールド材及びプリント配線板 |
| BR112012000203B1 (pt) * | 2009-06-12 | 2020-01-28 | Lord Corp | método para proteção de um substrato contra relâmpagos |
| KR101332362B1 (ko) | 2012-09-21 | 2013-12-02 | 재단법인 철원플라즈마 산업기술연구원 | 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법 |
-
2011
- 2011-10-24 FI FIEP11836909.9T patent/FI2633746T3/fi active
- 2011-10-24 CN CN201180051609.6A patent/CN103190209B/zh not_active Expired - Fee Related
- 2011-10-24 KR KR1020137013255A patent/KR101584872B1/ko not_active Expired - Fee Related
- 2011-10-24 EP EP11836909.9A patent/EP2633746B1/en active Active
- 2011-10-24 JP JP2013536689A patent/JP6082696B2/ja not_active Expired - Fee Related
- 2011-10-24 WO PCT/US2011/057418 patent/WO2012058131A2/en not_active Ceased
- 2011-10-25 TW TW100138733A patent/TWI507120B/zh not_active IP Right Cessation
-
2013
- 2013-03-13 US US13/798,895 patent/US8847184B2/en active Active
-
2016
- 2016-02-26 JP JP2016035811A patent/JP2016122859A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016122859A (ja) | 2016-07-07 |
| TWI507120B (zh) | 2015-11-01 |
| KR20130132450A (ko) | 2013-12-04 |
| JP6082696B2 (ja) | 2017-02-15 |
| US8847184B2 (en) | 2014-09-30 |
| EP2633746B1 (en) | 2023-07-19 |
| WO2012058131A3 (en) | 2012-06-28 |
| EP2633746A2 (en) | 2013-09-04 |
| WO2012058131A2 (en) | 2012-05-03 |
| CN103190209B (zh) | 2016-05-18 |
| KR101584872B1 (ko) | 2016-01-13 |
| US20130207005A1 (en) | 2013-08-15 |
| CN103190209A (zh) | 2013-07-03 |
| JP2014502221A (ja) | 2014-01-30 |
| TW201228589A (en) | 2012-07-01 |
| EP2633746A4 (en) | 2017-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FI2633746T3 (fi) | Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo | |
| JP2014502221A5 (enExample) | ||
| TWI495716B (zh) | 石墨烯散熱結構 | |
| WO2008048705A3 (en) | Low density lightning strike protection for use in airplanes | |
| CN202941086U (zh) | 一种具有导热及电磁屏蔽功能的屏蔽装置 | |
| JP6351330B2 (ja) | 電磁波シールドフィルム、シールドプリント配線板及び電磁波シールドフィルムの製造方法 | |
| CN109881038A (zh) | 一种导热电磁屏蔽复合材料及其制备方法 | |
| JP6125431B2 (ja) | Ｕｖ硬化性導電性組成物を形成するための方法およびそれにより形成される組成物 | |
| JP2015130484A5 (enExample) | ||
| JP2011029178A5 (enExample) | ||
| CN204669808U (zh) | 一种具有良好导热性的电磁屏蔽膜 | |
| JP2010034422A (ja) | 放熱シートの製造方法 | |
| CN106543728A (zh) | 一种石墨烯有机硅橡胶复合材料及其制备方法 | |
| Zulkarnain et al. | Effects of silver microparticles and nanoparticles on thermal and electrical characteristics of electrically conductive adhesives | |
| JP2015182248A5 (ja) | 異種部材を硬化性樹脂組成物で接合した積層体、車両用構造パネル、および硬化物 | |
| JP2018111814A (ja) | 熱伝導性樹脂組成物、熱伝導性シート及び積層体 | |
| JP2013118180A5 (enExample) | ||
| CN104194664A (zh) | 一种导电胶带 | |
| JP6276576B2 (ja) | 半導体モジュール用熱伝導性シート | |
| JP4900396B2 (ja) | 導電性シート材料及び電気的接続構造 | |
| Chenari et al. | Hybrid network formation of silicon carbide and expanded graphene nanoplatelets in epoxy resin for thermal management | |
| Lee et al. | Epoxy composites produced via sodium alginate‐mediated Ca crosslinking of MXene and boron nitride fillers with excellent thermal conductivity and electromagnetic interference shielding effectiveness | |
| JP2013064224A (ja) | 放熱シートの製造方法 | |
| Ren et al. | Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives | |
| JP3210737U (ja) | 三次元複合熱平衡放熱器 |