KR101584872B1 - 기판 수준 emi 차폐를 위한 복합 필름 - Google Patents

기판 수준 emi 차폐를 위한 복합 필름 Download PDF

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Publication number
KR101584872B1
KR101584872B1 KR1020137013255A KR20137013255A KR101584872B1 KR 101584872 B1 KR101584872 B1 KR 101584872B1 KR 1020137013255 A KR1020137013255 A KR 1020137013255A KR 20137013255 A KR20137013255 A KR 20137013255A KR 101584872 B1 KR101584872 B1 KR 101584872B1
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KR
South Korea
Prior art keywords
resin
layer
composite film
lower layer
conductive
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Expired - Fee Related
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KR1020137013255A
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English (en)
Korean (ko)
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KR20130132450A (ko
Inventor
치-민 쳉
보 시아
조지 토마스
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헨켈 아이피 앤드 홀딩 게엠베하
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Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00—Shielding characterised by the composition of the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
KR1020137013255A 2010-10-26 2011-10-24 기판 수준 emi 차폐를 위한 복합 필름 Expired - Fee Related KR101584872B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40670510P 2010-10-26 2010-10-26
US61/406,705 2010-10-26
PCT/US2011/057418 WO2012058131A2 (en) 2010-10-26 2011-10-24 Composite film for board level emi shielding

Publications (2)

Publication Number Publication Date
KR20130132450A KR20130132450A (ko) 2013-12-04
KR101584872B1 true KR101584872B1 (ko) 2016-01-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137013255A Expired - Fee Related KR101584872B1 (ko) 2010-10-26 2011-10-24 기판 수준 emi 차폐를 위한 복합 필름

Country Status (8)

Country Link
US (1) US8847184B2 (enExample)
EP (1) EP2633746B1 (enExample)
JP (2) JP6082696B2 (enExample)
KR (1) KR101584872B1 (enExample)
CN (1) CN103190209B (enExample)
FI (1) FI2633746T3 (enExample)
TW (1) TWI507120B (enExample)
WO (1) WO2012058131A2 (enExample)

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KR101850809B1 (ko) 2014-06-02 2018-04-20 다츠다 덴센 가부시키가이샤 도전성 접착 필름, 프린트 회로 기판, 및 전자 기기
KR102314774B1 (ko) 2014-11-26 2021-10-21 삼성전자주식회사 반도체 패키지
US9635789B2 (en) 2015-01-30 2017-04-25 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with increased under-shield space
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
EP3075798A1 (en) * 2015-04-01 2016-10-05 Ronald R. Savin Coating compositions
US10744736B2 (en) 2015-06-12 2020-08-18 Neograf Solutions, Llc Graphite composites and thermal management systems
US9968004B2 (en) 2015-09-25 2018-05-08 Laird Technologies, Inc. Thermal interface materials including electrically-conductive material
EP3436512A4 (en) 2016-03-31 2019-12-11 NeoGraf Solutions, LLC NOISE REDUCTION MEASURES
JP6528733B2 (ja) 2016-06-21 2019-06-12 株式会社デンソー エジェクタ式冷凍サイクル
US10080317B2 (en) 2016-06-29 2018-09-18 Microsoft Technology Licensing, Llc Polymeric electromagnetic shield for electronic components
TWI619561B (zh) * 2016-07-28 2018-04-01 Rotating target
US10477738B2 (en) 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
KR20190076250A (ko) 2017-12-22 2019-07-02 삼성전자주식회사 반도체 패키지 및 반도체 모듈
KR102616814B1 (ko) * 2018-03-09 2023-12-21 삼성전자주식회사 반도체 패키지 및 반도체 모듈
EP3729916A1 (en) 2018-03-16 2020-10-28 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102869375B1 (ko) * 2020-07-28 2025-10-14 삼성전자주식회사 Fpcb 조립체 및 이를 포함하는 전자 기기
KR102521564B1 (ko) * 2021-01-14 2023-04-12 성균관대학교산학협력단 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법

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JP2007332224A (ja) * 2006-06-13 2007-12-27 Nitto Denko Corp シート状複合材料及びその製造方法
JP2009191099A (ja) * 2008-02-12 2009-08-27 Tatsuta System Electronics Kk 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法
KR101332362B1 (ko) 2012-09-21 2013-12-02 재단법인 철원플라즈마 산업기술연구원 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법

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US6900383B2 (en) 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US6674652B2 (en) * 2002-01-29 2004-01-06 3Com Corporation Integrated shield wrap
US20060225874A1 (en) * 2005-04-11 2006-10-12 Shives Gary D Sandwiched thermal article
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JP4319167B2 (ja) 2005-05-13 2009-08-26 タツタ システム・エレクトロニクス株式会社 シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
JP2007073547A (ja) * 2005-09-02 2007-03-22 Yuji Suda 電子部品の加圧装置
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JP2007324161A (ja) * 2006-05-30 2007-12-13 Yuji Suda ビルドアップ多層配線板の製造方法
US20100096181A1 (en) * 2007-03-29 2010-04-22 Munetomo Nakamura Electromagnetic shield sheet and rfid plate
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
US20110014356A1 (en) * 2009-06-12 2011-01-20 Lord Corporation Method for protecting a substrate from lightning strikes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294918A (ja) * 2006-03-29 2007-11-08 Tatsuta System Electronics Kk シールドフィルム及びシールドプリント配線板
JP2007332224A (ja) * 2006-06-13 2007-12-27 Nitto Denko Corp シート状複合材料及びその製造方法
JP2009191099A (ja) * 2008-02-12 2009-08-27 Tatsuta System Electronics Kk 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法
KR101332362B1 (ko) 2012-09-21 2013-12-02 재단법인 철원플라즈마 산업기술연구원 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법

Also Published As

Publication number Publication date
WO2012058131A3 (en) 2012-06-28
US20130207005A1 (en) 2013-08-15
WO2012058131A2 (en) 2012-05-03
EP2633746A2 (en) 2013-09-04
JP2016122859A (ja) 2016-07-07
JP6082696B2 (ja) 2017-02-15
FI2633746T3 (fi) 2023-07-24
JP2014502221A (ja) 2014-01-30
US8847184B2 (en) 2014-09-30
KR20130132450A (ko) 2013-12-04
EP2633746B1 (en) 2023-07-19
CN103190209B (zh) 2016-05-18
EP2633746A4 (en) 2017-11-29
TW201228589A (en) 2012-07-01
TWI507120B (zh) 2015-11-01
CN103190209A (zh) 2013-07-03

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