TWI507120B - 用於板層電磁干擾（ｅｍｉ）屏蔽之複合膜 - Google Patents

用於板層電磁干擾（ｅｍｉ）屏蔽之複合膜 Download PDF

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Publication number
TWI507120B
TWI507120B TW100138733A TW100138733A TWI507120B TW I507120 B TWI507120 B TW I507120B TW 100138733 A TW100138733 A TW 100138733A TW 100138733 A TW100138733 A TW 100138733A TW I507120 B TWI507120 B TW I507120B
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TW
Taiwan
Prior art keywords
resin
composite film
group
resins
conductive
Prior art date
Application number
TW100138733A
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English (en)
Chinese (zh)
Other versions
TW201228589A (en
Inventor
Chih-Min Cheng
Bo Xia
George Thomas
Original Assignee
Henkel IP & Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel IP & Holding GmbH filed Critical Henkel IP & Holding GmbH
Publication of TW201228589A publication Critical patent/TW201228589A/zh
Application granted granted Critical
Publication of TWI507120B publication Critical patent/TWI507120B/zh

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Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00—Shielding characterised by the composition of the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
TW100138733A 2010-10-26 2011-10-25 用於板層電磁干擾（ｅｍｉ）屏蔽之複合膜 TWI507120B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40670510P 2010-10-26 2010-10-26

Publications (2)

Publication Number Publication Date
TW201228589A TW201228589A (en) 2012-07-01
TWI507120B true TWI507120B (zh) 2015-11-01

Family

ID=45994675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100138733A TWI507120B (zh) 2010-10-26 2011-10-25 用於板層電磁干擾（ｅｍｉ）屏蔽之複合膜

Country Status (8)

Country Link
US (1) US8847184B2 (enExample)
EP (1) EP2633746B1 (enExample)
JP (2) JP6082696B2 (enExample)
KR (1) KR101584872B1 (enExample)
CN (1) CN103190209B (enExample)
FI (1) FI2633746T3 (enExample)
TW (1) TWI507120B (enExample)
WO (1) WO2012058131A2 (enExample)

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US10744736B2 (en) 2015-06-12 2020-08-18 Neograf Solutions, Llc Graphite composites and thermal management systems
US9968004B2 (en) 2015-09-25 2018-05-08 Laird Technologies, Inc. Thermal interface materials including electrically-conductive material
EP3436512A4 (en) 2016-03-31 2019-12-11 NeoGraf Solutions, LLC NOISE REDUCTION MEASURES
JP6528733B2 (ja) 2016-06-21 2019-06-12 株式会社デンソー エジェクタ式冷凍サイクル
US10080317B2 (en) 2016-06-29 2018-09-18 Microsoft Technology Licensing, Llc Polymeric electromagnetic shield for electronic components
TWI619561B (zh) * 2016-07-28 2018-04-01 Rotating target
US10477738B2 (en) 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
KR20190076250A (ko) 2017-12-22 2019-07-02 삼성전자주식회사 반도체 패키지 및 반도체 모듈
KR102616814B1 (ko) * 2018-03-09 2023-12-21 삼성전자주식회사 반도체 패키지 및 반도체 모듈
EP3729916A1 (en) 2018-03-16 2020-10-28 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102869375B1 (ko) * 2020-07-28 2025-10-14 삼성전자주식회사 Fpcb 조립체 및 이를 포함하는 전자 기기
KR102521564B1 (ko) * 2021-01-14 2023-04-12 성균관대학교산학협력단 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법

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WO2006132695A2 (en) * 2005-04-11 2006-12-14 Advanced Energy Technology Inc. Sandwiched thermal article
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9678499B2 (en) 2012-06-27 2017-06-13 Mitsubishi Electric Research Laboratories, Inc. Method for controlling redundantly actuated machines for cutting a pattern of disconnected contours

Also Published As

Publication number Publication date
WO2012058131A3 (en) 2012-06-28
US20130207005A1 (en) 2013-08-15
WO2012058131A2 (en) 2012-05-03
EP2633746A2 (en) 2013-09-04
JP2016122859A (ja) 2016-07-07
JP6082696B2 (ja) 2017-02-15
FI2633746T3 (fi) 2023-07-24
JP2014502221A (ja) 2014-01-30
US8847184B2 (en) 2014-09-30
KR20130132450A (ko) 2013-12-04
KR101584872B1 (ko) 2016-01-13
EP2633746B1 (en) 2023-07-19
CN103190209B (zh) 2016-05-18
EP2633746A4 (en) 2017-11-29
TW201228589A (en) 2012-07-01
CN103190209A (zh) 2013-07-03

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