WO2013080790A1 - 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 - Google Patents

部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 Download PDF

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WO2013080790A1
WO2013080790A1 PCT/JP2012/079463 JP2012079463W WO2013080790A1 WO 2013080790 A1 WO2013080790 A1 WO 2013080790A1 JP 2012079463 W JP2012079463 W JP 2012079463W WO 2013080790 A1 WO2013080790 A1 WO 2013080790A1
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Prior art keywords
component
substrate
electronic component
board
thermal
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PCT/JP2012/079463
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English (en)
French (fr)
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和久 糸井
岡本　誠裕
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株式会社フジクラ
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Priority to DK12854222.2T priority Critical patent/DK2787799T3/da
Priority to EP12854222.2A priority patent/EP2787799B1/en
Publication of WO2013080790A1 publication Critical patent/WO2013080790A1/ja
Priority to US14/290,173 priority patent/US9591767B2/en

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    • H—ELECTRICITY
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Definitions

  • the present invention relates to a component built-in board in which an electronic component is built, a manufacturing method thereof, and a component built-in board mounting body.
  • a component-embedded substrate in which electronic components are embedded in a substrate is known.
  • a component-embedded substrate since the electronic component is embedded in an insulating layer formed on the wiring substrate, how to efficiently release the heat generated in the electronic component to the outside becomes a problem.
  • Conventional component-embedded substrates transfer heat generated in electronic components through the insulating layer with excellent thermal conductivity and thermal vias that contact the back surface of the electronic component (the surface opposite to the mounting surface). The heat is transmitted to a heat sink (heat radiator) arranged in the upper layer to dissipate heat (Patent Document 1).
  • the back surface of the electronic component is directly brought into contact with a heat conducting member such as a radiator. Then, moisture that has entered from the outside enters between the back surface of the electronic component with weak adhesion and the radiator. In addition, there is a problem that a gap is generated between them and the reliability of the component-embedded substrate is lowered.
  • the present invention eliminates the problems caused by the prior art described above, secures the adhesion between the electronic component and the heat conductive layer, and improves the heat dissipation characteristics, the manufacturing method thereof, and the component built-in substrate mounting body. For the purpose of provision.
  • a component-embedded substrate is a component-embedded substrate in which a plurality of printed wiring substrates each having a wiring pattern and a via formed on a resin substrate are stacked and an electronic component is built-in. At least a part of the material includes a thermal wiring in the wiring pattern, the via includes a thermal via, and at least one of the plurality of printed wiring substrates has an opening in which the electronic component is incorporated.
  • the surface opposite to the electrode formation surface of the electronic component embedded in the component-embedded substrate is a heat conductive layer made of a metal member having a higher thermal conductivity than the conductive paste in the opening. Adhesion between the electronic component and the heat-conducting layer is ensured by the adhesive layer laminated on the heat-conducting layer through the hole formed in the region facing the opening of the heat-conducting layer. It can be ensured and the heat dissipation characteristics can be improved.
  • the holes are discretely formed in the region.
  • the heat conductive layer is connected to bumps formed on the surface layer of the component-embedded substrate via the thermal via and the thermal wiring.
  • a method for manufacturing a component-embedded substrate according to the present invention is a method for manufacturing a component-embedded substrate in which a plurality of printed wiring substrates in which wiring patterns and vias are formed on a resin substrate are stacked and an electronic component is embedded, An opening for forming the wiring pattern including thermal wiring on the plurality of resin bases and the via including thermal vias, and an opening for incorporating the electronic component in at least one of the plurality of resin bases, and the opening Forming a plurality of printed wiring base materials by forming a heat conductive layer made of a metal member having a hole in a region facing the opening and in close contact with a surface opposite to the electrode forming surface of the electronic component built in And a plurality of the plurality of electronic components so that a surface opposite to the electrode forming surface of the electronic component is fixed in the opening by an adhesive layer laminated on the heat conductive layer through the hole and is in close contact with the heat conductive layer.
  • the printed wiring substrate characterized by comprising the step of batch lamination by
  • the surface opposite to the electrode forming surface of the electronic component embedded in the component-embedded substrate is made of a metal member having a higher thermal conductivity than the conductive paste in the opening. Since it is fixed in the opening by the adhesive layer laminated on the heat conducting layer through the hole formed in the region facing the opening of the heat conducting layer while being in close contact with the heat conducting layer, the same effect as above Can be played.
  • the holes are discretely formed in the region.
  • the method further includes a step of forming a bump connected to the heat conducting layer via the thermal via and the thermal wiring on a surface layer of the component built-in substrate.
  • the component built-in board mounting body is formed by laminating a plurality of printed wiring base materials in which a wiring pattern and vias are formed on a resin base material, and mounting a component built-in board in which an electronic component is built on the mounting board.
  • the component-embedded board mounting body wherein at least a part of the plurality of printed wiring base materials includes thermal wiring in the wiring pattern, the via includes thermal vias, and at least of the plurality of printed wiring base materials.
  • an opening in which the electronic component is built is formed, and a heat conductive layer made of a metal member that is in close contact with the surface opposite to the electrode forming surface of the electronic component built in the opening is formed.
  • the electronic component is fixed in the opening by an adhesive layer laminated on the heat conducting layer through a hole formed in a region facing the opening of the heat conducting layer, and the component is built in.
  • Plate is characterized by being mounted on a mounting substrate via the thermal via and the bump formed on the surface layer of the component-embedded substrate being connected to said heat conducting layer through the thermal wire.
  • the surface opposite to the electrode forming surface of the electronic component built in the component built-in board is formed on the heat conduction layer, the thermal via, the thermal wiring, and the surface layer of the component built-in board.
  • the bumps are connected to the mounting board. For this reason, the heat of the electronic component is transmitted through the heat conducting layer, the thermal via, the thermal wiring, and the bump as a heat dissipation path, and is efficiently and reliably radiated to the mounting substrate. Since the mounting board has a sufficiently large area as compared with the electronic component or the component built-in board, the heat dissipation medium is better than the conventional heatsink, and it is not necessary to provide a heatsink. As a result, the size can be reduced, the degree of freedom in the layout of the electronic components can be increased, and the heat dissipation characteristics of the built-in electronic components can be improved.
  • the holes are discretely formed in the region.
  • the adhesion between the electronic component and the heat conducting layer can be ensured, and the heat dissipation characteristics can be improved.
  • FIG. 1 is a sectional view showing a structure of a component built-in board mounting body according to the first embodiment of the present invention.
  • a component built-in board mounting body 100 according to the first embodiment includes a component built-in board 1 and a mounting board 2 on which the component built-in board 1 is mounted on a mounting surface 2a.
  • the component-embedded substrate 1 is formed by thermocompression bonding the second printed wiring substrate 20, the third printed wiring substrate 30, the fourth printed wiring substrate 40, and the coverlay film 3 replacing the first printed wiring substrate. It has a stacked structure.
  • the component-embedded substrate 1 is sandwiched between the third printed wiring substrate 30 and the coverlay film 3 in the opening 29 formed in the second resin substrate 21 of the second printed wiring substrate 20.
  • a built-in electronic component 90 is provided. Further, the component-embedded substrate 1 includes bumps 49 formed on the mounting surface 2a side of the fourth printed wiring substrate 40.
  • the third and fourth printed wiring base materials 30 and 40 are the third and fourth resin base materials 31 and 41, and signal wirings formed on at least one side of the third and fourth resin base materials 31 and 41, respectively. 32 and 42 and thermal wirings 33 and 43.
  • the third and fourth printed wiring base materials 30 and 40 are filled with via holes formed in via holes formed in the third and fourth resin base materials 31 and 41, and signal vias 35 and 44, respectively. 45.
  • the second printed wiring substrate 20 includes a thermal wiring 23 formed on one surface of the second resin substrate 21, a conductor layer 8 having a hole formed on the other surface, and a second resin substrate.
  • a thermal via 24 formed so as to conduct both surfaces of the second resin substrate 21 is provided in a via hole formed in the material 21.
  • a single-sided copper-clad laminate single-sided CCL
  • a double-sided copper-clad laminate double-sided CCL
  • double-sided CCL double-sided CCL
  • the second printed wiring substrate 20 is formed based on the double-sided CCL, and the third and fourth printed wiring substrates 30 and 40 are formed based on the single-sided CCL. Therefore, the conductor layer 8 and the thermal wiring 23 of the second printed wiring substrate 20 are formed on both surfaces of the second resin substrate 21, and the thermal via 24 connects the conductor layers 8 and the thermal wiring 23 on both surfaces with each other. .
  • the thermal via 24 has a structure in which plating is performed in a through hole formed from the thermal wiring 23 side without penetrating the conductor layer 8, and is formed by, for example, copper plating. At this time, it is good also as a structure filled with the electrically conductive paste instead of plating the inside of a through-hole.
  • the conductor layer 8 and the plating layer 23a formed thereon constitute a heat conducting layer 23A that conducts heat from the electronic component 90.
  • the second to fourth resin base materials 21 to 41 and the coverlay film 3 are each composed of a resin film having a thickness of about 25 ⁇ m, for example.
  • a resin film for example, a resin film made of polyimide, polyolefin, liquid crystal polymer, or the like, a resin film made of a thermosetting epoxy resin, or the like can be used.
  • the electronic component 90 is, for example, a semiconductor component such as an IC chip or a passive component, and the electronic component 90 shown in FIG. 1 indicates a WLP (Wafer Level Package) subjected to rewiring.
  • a plurality of rewiring electrodes 91 formed on the pad 91c are provided on the electrode forming surface 91b of the electronic component 90, and an insulating layer 91d is formed around the rewiring electrodes 91b.
  • the signal wirings 32 and 42 and the thermal wirings 23, 33 and 43 are formed by patterning a conductive material such as a copper foil having a thickness of about 12 ⁇ m, for example.
  • the signal vias 35 and 45 and the thermal vias 34 and 44 are made of conductive paste filled in the via holes, respectively, and the thermal via 24 is formed by plating as described above.
  • the thermal wiring and the thermal via are formed so as to be arranged on the outer peripheral side of the electronic component 90 except for a part thereof.
  • the conductive paste is, for example, at least one kind of low electrical resistance metal particles selected from nickel, gold, silver, copper, aluminum, iron and the like, and at least one kind selected from tin, bismuth, indium, lead and the like. And a metal paste having a melting point and a paste in which a binder component mainly composed of epoxy, acrylic, urethane or the like is mixed.
  • the conductive paste thus configured has a low thermal conductivity of, for example, 5 to 13.5 W / (m ⁇ K), and the contained low melting point metal can be melted at 200 ° C. or less to form an alloy.
  • copper and silver have the property of forming an intermetallic compound.
  • the conductive paste can also be formed of a nanopaste in which fillers such as gold, silver, copper, and nickel having a nanometer particle size are mixed with the binder component as described above.
  • the conductive paste can be composed of a paste in which metal particles such as nickel are mixed with the binder component as described above.
  • the conductive paste has a characteristic that electrical connection is made when metal particles come into contact with each other.
  • a method for filling the via holes with the conductive paste for example, a printing method, a spin coating method, a spray coating method, a dispensing method, a laminating method, and a method using these in combination can be used.
  • the bump 49 is made of solder or the like, and is not covered with the signal wiring 42 and the solder resist 48 on the thermal wiring 43 formed on the mounting surface 2a side of the fourth resin base 41 of the fourth printed wiring base 40. It is formed in the part.
  • the component built-in substrate 1 is mounted on the mounting surface 2 a of the mounting substrate 2 through these bumps 49.
  • the second to fourth printed wiring base materials 20 to 40 and the coverlay film 3 are laminated with an adhesive layer 9 interposed therebetween.
  • the adhesive layer 9 is made of, for example, an organic adhesive containing a volatile component such as an epoxy adhesive or an acrylic adhesive.
  • the back surface 91a opposite to the electrode forming surface 91b is in close contact with the conductor layer 8 of the heat conducting layer 23A.
  • the back surface 91a is bonded by the adhesive layer 9 of the coverlay film 3 through the hole 23B formed in the region facing the opening 29 of the heat conducting layer 23A.
  • the electronic component 90 is fixed in the opening part 29 in the state which the back surface 91a and the conductor layer 8 contact
  • the thermal conductivity of pure copper is very high at 403 W / (m ⁇ K) at 0 ° C. and 395 W / (m ⁇ K) at 100 ° C. Adhering is very effective in improving the heat dissipation characteristics. Note that, when the electronic component 90 is fixed in the opening 29 without providing the hole 23B, the conductor layer 8 and the back surface of the electronic component 90 cannot be directly bonded, so some adhesive medium is required between them, Compared with the case where the electronic component 90 is brought into close contact with the conductor layer 8 having a hole, the heat conduction characteristics are inferior.
  • the component built-in substrate mounting body 100 configured in this manner has a structure in which the electronic component 90 is disposed between the heat conducting layer 23A and the mounting substrate 2.
  • the heat of the electronic component 90 built in the component built-in substrate 1 is transferred to the mounting substrate 2 along the following heat dissipation path. That is, the heat of the electronic component 90 is transmitted from the back surface 91 a of the electronic component 90 to the heat conductive layer 23 ⁇ / b> A of the second printed wiring substrate 20.
  • the heat transmitted to the heat conducting layer 23A is transmitted to the thermal via 34 and the thermal wiring 33 of the third printed wiring substrate 30 through the thermal via 24 formed on the outer peripheral side of the electronic component 90, and further to the fourth printed wiring board.
  • the heat is transmitted to the thermal via 44 and the thermal wiring 43 of the material 40 and then to the bump 49.
  • the heat transmitted to the bumps 49 is transmitted to the mounting substrate 2 having a larger area than the component-embedded substrate 1 through the bumps 49 and is radiated from the mounting substrate 2.
  • FIGS. 1 and 9 are cross-sectional views showing the component built-in board mounting body for each manufacturing process.
  • 2 and 6 show the third and fourth printed wiring substrates 30, 40
  • FIGS. 3 and 7 show the second printed wiring substrate 20
  • FIGS. 4 and 8 show the electronic components
  • FIGS. FIG. 9 shows details of each manufacturing process for the component built-in board mounting body.
  • the manufacturing process of the 3rd and 4th printed wiring base materials 30 and 40 is demonstrated. Since these can be manufactured in the same process, here, the manufacturing process of the fourth printed wiring substrate 40 will be described as a representative with reference to FIG. 2, but the third printed wiring substrate 30 is also described. It is the same.
  • a single-sided copper-clad laminate (single-sided CCL) in which the conductor layer 8 is formed on one side of the fourth resin base 41 is prepared (step S100).
  • etching is performed to form wiring patterns such as the signal wiring 42 and the thermal wiring 43 as shown in FIG. 6B (step S102). ).
  • the single-sided CCL used in step S100 has a structure in which a fourth resin base 41 having a thickness of about 25 ⁇ m is bonded to a conductor layer 8 made of, for example, a copper foil having a thickness of about 12 ⁇ m.
  • a fourth resin base 41 having a thickness of about 25 ⁇ m is bonded to a conductor layer 8 made of, for example, a copper foil having a thickness of about 12 ⁇ m.
  • a polyimide varnish to copper foil by the casting method, for example, and hardening the varnish can be used.
  • the resin melted by the extruder is extruded from a linear slit provided on a flat die, and the molten film is rapidly cooled with a cooled roll and rolled up while being rolled. It is a known method for forming a simple film or sheet. This method is highly reliable and frequently used.
  • a seed layer is formed on a polyimide film by sputtering and copper is grown by plating to form a conductor layer 8, or a rolled or electrolytic copper foil and a polyimide film are bonded together with an adhesive. It is also possible to use the one produced by the above.
  • the fourth resin base material 41 is not necessarily made of polyimide, and may be made of a plastic film such as a liquid crystal polymer.
  • an etchant mainly composed of ferric chloride, an etchant mainly composed of cupric chloride, or the like can be used.
  • step S104 the adhesive material 9a and the mask material 7 are heated on the surface of the fourth resin base 41 opposite to the signal wiring 42 and thermal wiring 43 forming surface side.
  • Affixing is performed by pressure bonding (step S104).
  • an epoxy thermosetting film having a thickness of about 25 ⁇ m can be used as the adhesive material 9a attached in step S104.
  • a vacuum laminator is used, and these are bonded together by pressing at a pressure of 0.3 MPa at a temperature lower than the curing temperature of the adhesive 9a in an atmosphere under reduced pressure.
  • interlayer adhesive used for the adhesive layer 9 and the adhesive 9a examples include not only an epoxy thermosetting film but also an acrylic adhesive, a thermoplastic adhesive typified by thermoplastic polyimide, and the like. It is done. Further, the interlayer adhesive does not necessarily need to be in the form of a film, and may be obtained by applying a varnish-like resin.
  • the mask material various films that can be bonded and peeled off by UV irradiation can be used in addition to the above-described resin films and plastic films such as PET and PEN.
  • via holes that penetrate the mask material 7, the adhesive material 9 a, and the fourth resin base material 41 toward the signal wiring 42 and the thermal wiring 43 from the attached mask material 7 side. 6 is formed at a predetermined location (step S106), and for example, plasma desmear treatment is performed in the via hole 6.
  • the via hole 6 formed in step S106 has a diameter of about ⁇ 100 ⁇ m and is formed at a predetermined location using a UV laser.
  • the via hole 6 may be formed by a carbon dioxide laser, an excimer laser, or the like, or may be formed by drilling or chemical etching.
  • the plasma desmear treatment can be performed with a mixed gas of CF 4 and O 2 (tetrafluoromethane + oxygen), but other inert gas such as Ar (argon) can also be used, so-called dry treatment. Instead, it may be wet desmear treatment using a chemical solution.
  • a conductive paste is filled by, for example, screen printing to form various vias of the signal via 45 and the thermal via 44 (step S108), and a mask material 7 is peeled off to form a fourth printed wiring substrate 40 having a fourth resin substrate 41 provided with the adhesive layer 9.
  • the thermal via 44 may be formed by plating instead of the conductive paste in order to improve the thermal conductivity.
  • Step S110 a double-sided copper-clad laminate (double-sided CCL) in which the conductor layer 8 is formed over the entire surface (in a solid state) on both sides of the second resin base material 21 is prepared ( Step S110), as shown in FIG. 7B, a via hole 6 is formed at a predetermined location (step S112), and a plasma desmear process is performed.
  • step S114 panel plating is performed on the entire surface of the second resin base material 21 (step S114) to form a plating layer 23a on the conductor layer 8 and in the via hole 6.
  • the plated layer 23 a in the via hole 6 is a plated via that will be used later as the thermal via 24, and electrically connects the conductor layers 8 on both surfaces of the second resin base material 21.
  • wiring patterns such as a heat conductive layer 23A composed of the conductor layer 8 and the plating layer 23a, the thermal wiring 23, and the thermal via 24 are formed on both surfaces of the second resin base material 21 by etching or the like.
  • a hole 23B for bonding the electronic component 90 is formed in the heat conducting layer 23A (step S116).
  • the hole 23B formed in the heat conducting layer 23A in step S116 is rectangular within a range narrower than the region to be the opening 29 and smaller than the area of the electronic component 90, for example, as shown in FIG. A plurality of patterns are formed in a shape and mesh shape. Since the holes 23B are discretely arranged and the adhesive material that has entered the hole 23B is bonded to the back surface 91a of the electronic component 90, the space between the back surface 91a of the electronic component 90 and the heat conductive layer 23A having a low adhesion force.
  • the hole 23B may be formed in a circular and mesh shape as shown in FIG. 11, or may be formed in a single rectangular shape as shown in FIG. Further, although not shown in the drawings, the hole 23B has various areas such as a plurality of patterns having different sizes or a lattice pattern so as to leave an area where the back surface 91a of the electronic component 90 and the heat conducting layer 23A are in close contact with each other. It may be formed in a pattern.
  • the second resin base material 21 where the electronic component 90 is embedded is removed by a UV laser or the like to form an opening 29 (step S118), and the second The printed wiring board 20 is formed.
  • the electronic component 90 built in the opening part 29 of the 2nd printed wiring base material 20 formed in this way is manufactured as follows, for example.
  • the manufacturing process of the electronic component 90 will be described with reference to FIG. First, as shown in FIG. 8A, a wafer 92 before dicing on which an inorganic insulating layer such as silicon oxide or silicon nitride is formed is prepared (step S120).
  • a conductor circuit (not shown) or a pad 91c is formed on the surface of the prepared wafer 92 on the pad 91c and the inorganic insulating layer of the electronic component 90 by, for example, a semi-additive method.
  • a rewiring electrode 91 is formed to cover (step S122).
  • a liquid photosensitive polyimide precursor is spin-coated, contact holes are formed by photolithography, and then fired to form an insulating layer 91d (step S124).
  • inspection is performed by probing, and as shown in FIG. 8D, the electronic component 90 is made into individual pieces by thinning and dicing (step S126).
  • the resin of the insulating layer 91d formed in step S124 for example, benzocyclobutene (BCB), polybenzoxazole (PBO), or the like can be used.
  • the photosensitive resin is not necessarily applied by spin coating, and may be applied by curtain coating, screen printing, spray coating, or the like.
  • the electronic component 90 manufactured in this way can be provided with functions such as an inductor, a capacitor, and a resistor in addition to a normal conductive circuit.
  • the rewiring electrode 91 of the electronic component 90 and the signal via 35 of the third printed wiring base material 30 are obtained.
  • the electronic component 90 is mounted on the third printed wiring base material in a state where the adhesive paste 9 of the third printed wiring base material 30 and the conductive paste of the signal via 35 are not cured. 30 is temporarily bonded.
  • the coverlay film 3 on which the printed wiring substrates 20 to 40, the electronic component 90, and the adhesive layer 9 are formed is positioned and laminated (step S130).
  • step S130 For example, by using a vacuum press machine and heating and pressurizing in a reduced pressure atmosphere of 1 kPa or less, stacking is performed by thermocompression bonding (step S132).
  • step S132 the component built-in substrate 1 as shown in FIG. 1 is manufactured.
  • the conductive paste filled in the via hole 6 is cured and alloyed simultaneously with the curing of the adhesive layers 9 between the layers and the resin base materials 21 and 31. Therefore, an alloy layer of an intermetallic compound is formed between the wiring and the like in contact with the conductive paste.
  • a solder resist 48 is patterned on the signal wiring 42 of the fourth printed wiring substrate 40 and the fourth resin substrate 41 on the thermal wiring 43 side in the component-embedded substrate 1 (step S134).
  • bumps 49 are formed on the wirings 42 and 43 by solder or the like (step S136), and the component-embedded substrate 1 is mounted on the mounting surface 2a of the mounting substrate 2 (step S138).
  • the component built-in board mounting body 100 according to the first embodiment as shown in FIG. 1 is manufactured.
  • FIG. 13 is sectional drawing which shows the structure of the component built-in board mounting body based on the 2nd Embodiment of this invention.
  • the first printed wiring substrate 10 is laminated instead of the coverlay film 3, and the heat dissipation of the electronic component 90 is performed only on the mounting substrate 2.
  • it is different from the component-embedded board mounting body 100 according to the first embodiment in that it is also performed from the first printed wiring substrate 10 side.
  • the first printed wiring board 10 can be basically manufactured in the same process as the fourth printed wiring board 40 described with reference to FIGS. 2 and 6.
  • the material 11 has a structure in which a solid pattern conductor layer 8 is formed on one surface of the material 11.
  • the difference from the fourth printed wiring board 40 is that the conductive layer 8 of the single-sided CCL is used as it is without forming a wiring pattern in step S102, and the lamination mode is reversed.
  • a plurality of thermal vias 14 connected to the conductor layer 8 are formed, and each thermal via 14 is connected to the heat conductive layer 23A of the second printed wiring board 20.
  • the heat generated in the electronic component 90 is radiated from the mounting substrate 2 through the heat conducting layer 23A and also radiated from the heat radiation fin 80 through the thermal via 14 and the conductor layer 8. Thereby, a heat dissipation characteristic can be improved more.

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Abstract

部品内蔵基板実装体（１００）は、部品内蔵基板（１）と、これが実装された実装基板（２）とからなる。部品内蔵基板（１）は、第２～第４プリント配線基材（２０）～（４０）及びカバーレイフィルム（３）を熱圧着により一括積層した構造を備える。第２プリント配線基材（２０）の第２樹脂基材（２１）に形成された開口部（２９）内には、電子部品（９０）の裏面（９１ａ）と導熱層（２３Ａ）とが密着し、且つ孔部（２３Ｂ）を介して接着層（９）により固定された状態で内蔵されている。第４プリント配線基材（４０）の実装面（２ａ）側にはバンプ（４９）が形成されている。電子部品（９０）の裏面（９１ａ）に接する導熱層（２３Ａ）やサーマルビア（２４）を介して、各層のサーマルビア及びサーマル配線を通り、バンプ（４９）から実装基板（２）に電子部品（９０）の熱が伝わって、実装基板（２）にて放熱される。

Description

部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
　この発明は、電子部品が内蔵された部品内蔵基板及びその製造方法並びに部品内蔵基板実装体に関する。
　電子部品の高密度実装を実現するため、電子部品を基板に内蔵した部品内蔵基板が知られている。このような部品内蔵基板は、電子部品が配線基板に形成された絶縁層に埋設されるため、電子部品で発生する熱を、如何に効率よく外部へ放出するかが課題となる。従来の部品内蔵基板は、熱伝導性に優れた絶縁層と、電子部品の裏面（実装面とは反対側の面）に接するサーマルビアとを介して、電子部品で発生する熱を配線基板の上層に配置したヒートシンク（放熱器）に伝達して放熱させるようにしている（特許文献１）。
特開２００８－３０５９３７号公報
　上記特許文献１に開示された従来技術の部品内蔵基板では、電子部品の裏面と放熱器との間が、導熱性樹脂組成物により形成されたサーマルビアを介して接続されている。しかしながら、一般に導電ペーストの熱伝導率は銅の熱伝導率よりも低いので、銅を接続したものよりも放熱特性が良好ではないという問題がある。
　一方で、熱を伝え易くするために、電子部品の裏面を放熱器などの導熱部材に直接接触させる。すると、外部から浸入した水分が、密着力の弱い電子部品の裏面と放熱器との間に浸入する。そして、これらの間に隙間が生じ、部品内蔵基板の信頼性を低下させてしまうという問題もある。
　この発明は、上述した従来技術による問題点を解消し、電子部品と導熱層との密着性を確保し、放熱特性を向上させることができる部品内蔵基板及びその製造方法並びに部品内蔵基板実装体の提供を目的とする。
　本発明に係る部品内蔵基板は、樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板であって、前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定されていることを特徴とする。
　本発明に係る部品内蔵基板によれば、部品内蔵基板に内蔵された電子部品の電極形成面と反対側の面が、開口部内において導電ペーストよりも熱伝導率の高い金属部材からなる導熱層に密着すると共に、導熱層の開口部に臨む領域に形成された孔部を介して、導熱層上に積層された接着層により開口部内に固定されるので、電子部品と導熱層との密着性を確実なものとし、放熱特性を向上させることができる。
　本発明の一つの実施形態においては、前記孔部が、前記領域内で離散的に形成されている。
　また、本発明の他の実施形態においては、前記導熱層が、前記サーマルビア及び前記サーマル配線を介して部品内蔵基板の表層に形成されたバンプに接続されている。
　本発明に係る部品内蔵基板の製造方法は、樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板の製造方法であって、複数の樹脂基材にサーマル配線を含む前記配線パターン及びサーマルビアを含む前記ビアを形成すると共に、前記複数の樹脂基材のうちの少なくとも一つに前記電子部品を内蔵する開口部及びこの開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着し前記開口部に臨む領域に孔部を有する金属部材からなる導熱層を形成して複数のプリント配線基材を形成する工程と、前記電子部品の電極形成面と反対側の面が、前記孔部を介して前記導熱層上に積層される接着層により前記開口部内に固定されて前記導熱層と密着するように前記複数のプリント配線基材を熱圧着して一括積層する工程とを備えたことを特徴とする。
　本発明に係る部品内蔵基板の製造方法によれば、部品内蔵基板に内蔵された電子部品の電極形成面とは反対側の面が、開口部内において導電ペーストよりも熱伝導率の高い金属部材からなる導熱層に密着すると共に、導熱層の開口部に臨む領域に形成された孔部を介して、導熱層上に積層された接着層により開口部内に固定されるので、上記と同様の作用効果を奏することができる。
　本発明の一つの実施形態においては、前記孔部が、前記領域内で離散的に形成されている。
　本発明の他の実施形態においては、前記サーマルビア及び前記サーマル配線を介して前記導熱層に接続されるバンプを、部品内蔵基板の表層に形成する工程を更に備える。
　本発明に係る部品内蔵基板実装体は、樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板を実装基板に実装してなる部品内蔵基板実装体であって、前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定され、前記部品内蔵基板は、前記サーマルビア及び前記サーマル配線を介して前記導熱層に接続される部品内蔵基板の表層に形成されたバンプを介して実装基板に実装してなることを特徴とする。
　本発明に係る部品内蔵基板実装体によれば、部品内蔵基板に内蔵された電子部品の電極形成面とは反対側の面が、導熱層、サーマルビア、サーマル配線及び部品内蔵基板の表層に形成されたバンプを介して実装基板に接続されている。このため、電子部品の熱が導熱層、サーマルビア、サーマル配線及びバンプを放熱経路として伝わって、効率よく確実に実装基板に放熱される。実装基板は電子部品や部品内蔵基板と比べると十分に面積が広いので、放熱媒体としては従来のような放熱器よりも良好であり、放熱器を設ける必要がない。これにより、小型化が可能であると共に電子部品のレイアウトの自由度を高めることができ、更に内蔵された電子部品の放熱特性の向上を図ることができる。
　本発明の一つの実施形態においては、前記孔部が、前記領域内で離散的に形成されている。
　本発明によれば、電子部品と導熱層との密着性を確保し、放熱特性を向上させることができる。
本発明の第１の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体の導熱層の平面図である。 同部品内蔵基板実装体の他の導熱層の平面図である。 同部品内蔵基板実装体の更に他の導熱層の平面図である。 本発明の第２の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。
　以下、添付の図面を参照して、この発明の実施の形態に係る部品内蔵基板及びその実装体並びに部品内蔵基板の製造方法を詳細に説明する。
［第１の実施形態］
　図１は、本発明の第１の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。図１に示すように、第１の実施形態に係る部品内蔵基板実装体１００は、部品内蔵基板１と、この部品内蔵基板１が実装面２ａに実装された実装基板２とからなる。
　部品内蔵基板１は、第２プリント配線基材２０と、第３プリント配線基材３０と、第４プリント配線基材４０と、第１プリント配線基材に代わるカバーレイフィルム３とを熱圧着により一括積層した構造を備えている。また、部品内蔵基板１は、第２プリント配線基材２０の第２樹脂基材２１に形成された開口部２９内に、第３プリント配線基材３０及びカバーレイフィルム３に挟まれた状態で内蔵された電子部品９０を備えている。更に、部品内蔵基板１は、第４プリント配線基材４０の実装面２ａ側に形成されたバンプ４９を備えている。
　第３及び第４プリント配線基材３０，４０は、それぞれ第３及び第４樹脂基材３１，４１と、これら第３及び第４樹脂基材３１，４１の少なくとも片面に形成された信号用配線３２，４２及びサーマル配線３３，４３とを備える。また、第３及び第４プリント配線基材３０，４０は、それぞれ第３及び第４樹脂基材３１，４１に形成されたビアホール内に充填形成されたサーマルビア３４，４４及び信号用ビア３５，４５を備える。
　一方、第２プリント配線基材２０は、第２樹脂基材２１の一方の面に形成されたサーマル配線２３と、他方の面に形成された孔部を有する導体層８と、第２樹脂基材２１に形成されたビアホール内に第２樹脂基材２１の両面を導通するように形成されたサーマルビア２４とを備える。これら第２～第４プリント配線基材２０～４０は、例えば片面銅張積層板（片面ＣＣＬ）や両面銅張積層板（両面ＣＣＬ）などを用いてもよい。
　本例では、第２プリント配線基材２０が両面ＣＣＬに基づき形成され、第３及び第４プリント配線基材３０，４０が片面ＣＣＬに基づき形成されている。従って、第２プリント配線基材２０の導体層８及びサーマル配線２３は第２樹脂基材２１の両面に形成され、サーマルビア２４はこれら両面の導体層８及びサーマル配線２３を層間接続している。
　この場合、サーマルビア２４は、例えば導体層８を貫通させることなくサーマル配線２３側から形成した貫通孔内にめっきを施した構造からなり、例えば銅めっきにより形成される。このとき、貫通孔内をめっきする代わりに導電ペーストを充填させた構造としてもよい。なお、導体層８は、その上に形成されためっき層２３ａと共に電子部品９０からの熱を伝導する導熱層２３Ａを構成する。
　第２～第４樹脂基材２１～４１及びカバーレイフィルム３は、それぞれ例えば厚さ２５μｍ程度の樹脂フィルムにより構成されている。ここで、樹脂フィルムとしては、例えばポリイミド、ポリオレフィン、液晶ポリマーなどからなる樹脂フィルムや、熱硬化性のエポキシ樹脂からなる樹脂フィルムなどを用いることができる。
　電子部品９０は、例えばＩＣチップなどの半導体部品や受動部品等であり、図１に示す電子部品９０は、再配線を施したＷＬＰ（Ｗａｆｅｒ　Ｌｅｖｅｌ　Ｐａｃｋａｇｅ）を示している。電子部品９０の電極形成面９１ｂには、パッド９１ｃ上に形成された複数の再配線電極９１が設けられ、その周囲には絶縁層９１ｄが形成されている。
　なお、信号用配線３２，４２及びサーマル配線２３，３３，４３は、例えば厚さ１２μｍ程度の銅箔などの導電材をパターン形成してなる。信号用ビア３５，４５及びサーマルビア３４，４４は、ビアホール内にそれぞれ充填された導電ペーストからなり、サーマルビア２４は、上記のようにめっきにより形成される。サーマル配線及びサーマルビアは、一部を除いて電子部品９０の外周側に配置されるように形成されている。
　導電ペーストは、例えばニッケル、金、銀、銅、アルミニウム、鉄などから選択される少なくとも１種類の低電気抵抗の金属粒子と、錫、ビスマス、インジウム、鉛などから選択される少なくとも１種類の低融点の金属粒子とを含み、エポキシ、アクリル、ウレタンなどを主成分とするバインダ成分を混合したペーストからなる。
　このように構成された導電ペーストは、熱伝導率が例えば５～１３．５Ｗ／（ｍ・Ｋ）と低く、含有された低融点の金属が２００℃以下で溶融し合金を形成することができ、特に銅や銀などとは金属間化合物を形成することができる特性を備える。なお、導電ペーストは、例えば粒子径がナノレベルの金、銀、銅、ニッケル等のフィラーが、上記のようなバインダ成分に混合されたナノペーストで構成することもできる。
　その他、導電ペーストは、上記ニッケル等の金属粒子が、上記のようなバインダ成分に混合されたペーストで構成することもできる。この場合、導電ペーストは、金属粒子同士が接触することで電気的接続が行われる特性となる。導電ペーストのビアホールへの充填方法としては、例えば印刷工法、スピン塗布工法、スプレー塗布工法、ディスペンス工法、ラミネート工法、及びこれらを併用した工法などを用いることができる。
　バンプ４９は、半田などからなり、第４プリント配線基材４０の第４樹脂基材４１の実装面２ａ側に形成された信号用配線４２及びサーマル配線４３上のソルダーレジスト４８が被覆していない部分に形成されている。部品内蔵基板１は、これらバンプ４９を介して実装基板２の実装面２ａ上に実装されている。なお、第２～第４プリント配線基材２０～４０及びカバーレイフィルム３は、接着層９を介して積層されている。接着層９は、例えばエポキシ系やアクリル系接着材など、揮発成分が含まれた有機系接着材などからなる。
　第２プリント配線基材２０の開口部２９内に配置された電子部品９０は、電極形成面９１ｂとは反対側の裏面９１ａが、導熱層２３Ａの導体層８と密着する。これと共に、裏面９１ａは、導熱層２３Ａの開口部２９に臨む領域に形成された孔部２３Ｂを介して、カバーレイフィルム３の接着層９により接着される。これにより、電子部品９０は、裏面９１ａと導体層８とが密着した状態で開口部２９内に固定される。
　導体層８が純銅の銅箔からなる場合、純銅の熱伝導率は０℃にて４０３Ｗ／（ｍ・Ｋ）、１００℃にて３９５Ｗ／（ｍ・Ｋ）と非常に高いので、裏面９１ａと密着させることは放熱特性を向上させるのに非常に有効である。なお、孔部２３Ｂを設けずに開口部２９内に電子部品９０を固定させる場合、導体層８と電子部品９０の裏面とは直接接着できないので、これらの間には何らかの接着媒体が必要となり、孔部を有する導体層８に電子部品９０を密着させる場合に比べて、熱伝導特性が劣る。
　このように構成された部品内蔵基板実装体１００では、電子部品９０が、導熱層２３Ａと実装基板２との間に配置される構造となる。そして、部品内蔵基板１に内蔵された電子部品９０の熱は、次のような放熱経路を辿って実装基板２に伝えられる。すなわち、電子部品９０の熱は、電子部品９０の裏面９１ａから、第２プリント配線基材２０の導熱層２３Ａに伝わる。
　導熱層２３Ａに伝わった熱は、電子部品９０の外周側に形成されたサーマルビア２４を通って、第３プリント配線基材３０のサーマルビア３４及びサーマル配線３３に伝わり、更に第４プリント配線基材４０のサーマルビア４４及びサーマル配線４３に伝わって、バンプ４９に伝わる。こうしてバンプ４９に伝わった熱は、このバンプ４９を介して部品内蔵基板１よりも面積の大きな実装基板２に伝わり、実装基板２から放熱される。
　このような構造により、部品内蔵基板１に内蔵された電子部品９０で発生した熱の殆どが、従来のような放熱器が不要な構造の部品内蔵基板１から実装基板２に伝わって放熱されることとなる。
　次に、第１の実施形態に係る部品内蔵基板の製造方法について説明する。
　図２～図５は、部品内蔵基板実装体の製造工程を示すフローチャートである。図６～図９は、部品内蔵基板実装体を製造工程毎に示す断面図である。なお、図２及び図６は第３及び第４プリント配線基材３０，４０について、図３及び図７は第２プリント配線基材２０について、図４及び図８は電子部品について、図５及び図９は部品内蔵基板実装体についてそれぞれの製造工程の詳細を示している。
　まず、第３及び第４プリント配線基材３０，４０の製造工程について説明する。なお、これらは同様の工程で製造することができるので、ここでは図２を参照しながら代表して第４プリント配線基材４０の製造工程について説明するが、第３プリント配線基材３０についても同様である。
　図６（ａ）に示すように、第４樹脂基材４１の一方の面に導体層８が形成された片面銅張積層板（片面ＣＣＬ）を準備する（ステップＳ１００）。次に、導体層８上にフォトリソグラフィによりエッチングレジストを形成した後にエッチングを行って、図６（ｂ）に示すように、信号用配線４２やサーマル配線４３等の配線パターンを形成する（ステップＳ１０２）。
　ステップＳ１００にて使用する片面ＣＣＬは、例えば厚さ１２μｍ程度の銅箔からなる導体層８に、厚さ２５μｍ程度の第４樹脂基材４１を貼り合わせた構造からなる。なお、この片面ＣＣＬとしては、例えばキャスティング法により、銅箔にポリイミドのワニスを塗布してそのワニスを硬化させて作製されたものを使用することができる。
　キャスティング法は、押出機によって溶融された樹脂を、平坦なダイに設けられた直線状のスリットから押し出して、その溶融膜を冷却されたロールで急速に冷やして圧延しながら巻き取ることで、平坦なフィルムやシートを成形する公知の方法である。この方法は、信頼性が高く多用されている。
　その他、片面ＣＣＬとしては、ポリイミドフィルム上にシード層をスパッタリングにより形成し、めっきにより銅を成長させて導体層８を形成したものや、圧延或いは電解銅箔とポリイミドフィルムとを接着材により貼り合わせて作製されたものなどを使用することもできる。なお、第４樹脂基材４１は必ずしもポリイミドからなるものである必要はなく、液晶ポリマー等のプラスチックフィルムからなるものであってもよい。また、ステップＳ１０２でのエッチングには塩化第二鉄を主成分とするエッチャントや、塩化第二銅を主成分とするエッチャントなどを用いることができる。
　配線パターンを形成したら、図６（ｃ）に示すように、第４樹脂基材４１の信号用配線４２及びサーマル配線４３形成面側と反対側の面に、接着材９ａ及びマスク材７を加熱圧着により貼り付ける（ステップＳ１０４）。ステップＳ１０４にて貼り付けられる接着材９ａとしては、例えば厚さ２５μｍ程度のエポキシ系熱硬化性フィルムを使用することができる。加熱圧着には真空ラミネータを用い、減圧下の雰囲気中にて、接着材９ａの硬化温度以下の温度で０．３ＭＰａの圧力によりプレスしてこれらを貼り合わせることが挙げられる。
　なお、接着層９や接着材９ａに用いられる層間接着材は、エポキシ系の熱硬化性フィルムのみならず、アクリル系の接着材や、熱可塑性ポリイミドなどに代表される熱可塑性接着材などが挙げられる。また、層間接着材は必ずしもフィルム状である必要はなく、ワニス状の樹脂を塗布したものであってもよい。マスク材は、上述した樹脂フィルムやＰＥＴ，ＰＥＮなどのプラスチックフィルムの他、ＵＶ照射によって接着や剥離が可能な各種フィルムを用いることができる。
　その後、図６（ｄ）に示すように、貼り付けたマスク材７側から、信号用配線４２及びサーマル配線４３に向かってマスク材７、接着材９ａ及び第４樹脂基材４１を貫通するビアホール６を所定箇所に形成し（ステップＳ１０６）、ビアホール６内に例えばプラズマデスミア処理を施す。
　ステップＳ１０６にて形成されるビアホール６は、直径φ１００μｍ程度であり、ＵＶレーザを使用して所定箇所に形成される。ビアホール６は、その他、炭酸ガスレーザやエキシマレーザなどで形成してもよいし、ドリル加工や化学的なエッチングなどにより形成してもよい。また、プラズマデスミア処理は、ＣＦ４及びＯ２（四フッ化メタン＋酸素）の混合ガスにより行うことができるが、Ａｒ（アルゴン）などのその他の不活性ガスを用いることもでき、いわゆるドライ処理ではなく、薬液を用いたウェットデスミア処理としてもよい。
　そして、図６（ｅ）に示すように、形成したビアホール６内に、例えばスクリーン印刷により導電ペーストを充填して信号用ビア４５及びサーマルビア４４の各種ビアを形成し（ステップＳ１０８）、マスク材７を剥離して、接着層９が備えられた第４樹脂基材４１を有する第４プリント配線基材４０を形成する。なお、サーマルビア４４は、熱伝導率の向上を図るため、導電ペーストではなくめっきにより形成するようにしてもよい。このような処理を行って、第３プリント配線基材３０や、更に多層の場合はその他のプリント配線基材を形成して準備しておく。
　次に、図３を参照しながら第２プリント配線基材２０の製造工程について説明する。なお、既に説明した箇所には同一の符号を附して説明を割愛する場合があり、各ステップの具体的な処理内容については上述した内容を適用可能であるとする。まず、図７（ａ）に示すように、第２樹脂基材２１の両面に全面に亘って（ベタ状態で）導体層８が形成された両面銅張積層板（両面ＣＣＬ）を準備し（ステップＳ１１０）、図７（ｂ）に示すように、所定箇所にビアホール６を形成して（ステップＳ１１２）、プラズマデスミア処理を行う。
　次に、図７（ｃ）に示すように、第２樹脂基材２１の全面にパネルめっき処理を施して（ステップＳ１１４）、導体層８上及びビアホール６内にめっき層２３ａを形成する。なお、ビアホール６内のめっき層２３ａは後にサーマルビア２４として用いられるめっきビアであり、第２樹脂基材２１の両面の導体層８を電気的に導通している。
　そして、図７（ｄ）に示すように、第２樹脂基材２１の両面にエッチング等により導体層８及びめっき層２３ａからなる導熱層２３Ａやサーマル配線２３及びサーマルビア２４などの配線パターンを形成すると共に、電子部品９０を接着するための孔部２３Ｂを導熱層２３Ａに形成する（ステップＳ１１６）。
　なお、このステップＳ１１６にて導熱層２３Ａに形成される孔部２３Ｂは、例えば図１０に示すように、開口部２９となる領域よりも狭く、且つ電子部品９０の面積よりも狭い範囲内に矩形状且つメッシュ状に複数個パターン形成される。孔部２３Ｂが離散的に配され、孔部２３Ｂ内に入り込んだ接着材と電子部品９０の裏面９１aとが接着されるため、密着力の弱い電子部品９０の裏面９１ａと導熱層２３Ａとの間で、水分が留まり、実装時のリフロー等による加熱や電子部品チップの発熱等で水分が蒸発して、これらの間で隙間が生じ、部品内蔵基板の信頼性を低下させてしまうことを防止できる。その他、孔部２３Ｂは、図１１に示すように、円形状且つメッシュ状に形成されたり、図１２に示すように、一つの矩形状に形成されたりしてもよい。更に、図示は省略するが、孔部２３Ｂは、複数個のそれぞれのサイズが異なるパターンや、格子状パターンなど、電子部品９０の裏面９１ａと導熱層２３Ａとが密着する面積を残すように種々のパターンで形成されてもよい。
　最後に、図７（ｅ）に示すように、電子部品９０が内蔵される部分の第２樹脂基材２１をＵＶレーザなどにより除去し、開口部２９を形成して（ステップＳ１１８）、第２プリント配線基材２０を形成する。
　なお、このように形成された第２プリント配線基材２０の開口部２９に内蔵される電子部品９０は、例えば次のように製造される。図４を参照しながら電子部品９０の製造工程について説明する。まず、図８（ａ）に示すように、酸化ケイ素や窒化ケイ素などの無機絶縁層が形成されたダイシング前のウェハ９２を準備する（ステップＳ１２０）。
　次に、図８（ｂ）に示すように、準備したウェハ９２の表面に、例えばセミアディティブ法によって、電子部品９０のパッド９１ｃ上及び無機絶縁層上に導体回路（図示せず）やパッド９１ｃを覆う再配線電極９１を形成する（ステップＳ１２２）。
　そして、図８（ｃ）に示すように、例えば液状の感光性ポリイミド前駆体をスピンコートし、フォトリソグラフィによってコンタクトホールを形成した後に、焼成することで絶縁層９１ｄを形成する（ステップＳ１２４）。最後に、プロービングにより検査を行って、図８（ｄ）に示すように、薄型化及びダイシングにより電子部品９０を個片化して作製する（ステップＳ１２６）。
　なお、ステップＳ１２４にて形成される絶縁層９１ｄの樹脂は、例えばベンゾシクロブテン（ＢＣＢ）や、ポリベンゾオキサゾール（ＰＢＯ）などを用いることができる。また、感光性樹脂は必ずしもスピンコートによって塗布される必要はなく、カーテンコートやスクリーン印刷、或いはスプレーコートなどによって塗布されてもよい。このようにして作製された電子部品９０には、通常の導電用回路の他、インダクタ、キャパシタ、抵抗などの各機能を付与させることもできる。
　こうして、第２～第４プリント配線基材２０～４０及び電子部品９０を作製したら、図９に示すように、電子部品９０の再配線電極９１と第３プリント配線基材３０の信号用ビア３５を、電子部品用実装機で位置合わせして、第３プリント配線基材３０の接着層９及び信号用ビア３５の導電ペーストが硬化していない状態で、電子部品９０を第３プリント配線基材３０に仮留め接着する。
　その後、図５に示すように、各プリント配線基材２０～４０、電子部品９０及び接着層９が形成されたカバーレイフィルム３を位置決めし、積層する（ステップＳ１３０）。例えば真空プレス機を用いて、１ｋＰａ以下の減圧雰囲気中にて加熱加圧することで熱圧着により一括積層し（ステップＳ１３２）、まず、図１に示すような部品内蔵基板１を製造する。このとき、層間の各接着層９や各樹脂基材２１，３１等の硬化と同時に、ビアホール６に充填された導電ペーストの硬化及び合金化が行われる。従って、導電ペーストと接する配線等との間には、金属間化合物の合金層が形成される。
　そして、部品内蔵基板１における第４プリント配線基材４０の信号用配線４２及びサーマル配線４３側の第４樹脂基材４１上に、ソルダーレジスト４８をパターン形成する（ステップＳ１３４）。ソルダーレジスト４８を形成したら、各配線４２，４３上に半田などによりバンプ４９を形成して（ステップＳ１３６）、部品内蔵基板１を実装基板２の実装面２ａ上に実装することで（ステップＳ１３８）、図１に示すような第１の実施形態に係る部品内蔵基板実装体１００を製造する。
［第２の実施形態］
　図１３は、本発明の第２の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。図１３に示すように、第２の実施形態に係る部品内蔵基板実装体１００Ａは、カバーレイフィルム３の代わりに第１プリント配線基材１０が積層され、電子部品９０の放熱が実装基板２のみならず第１プリント配線基材１０側からも行われる点が、第１の実施形態に係る部品内蔵基板実装体１００と相違している。
　具体的には、第１プリント配線基材１０は、基本的には図２及び図６を用いて説明した第４プリント配線基材４０と同様の工程で製造することができ、第１樹脂基材１１の片面にベタパターンの導体層８を形成した構造からなる。第４プリント配線基材４０との相違点としては、ステップＳ１０２にて配線パターンを形成することなく、片面ＣＣＬの導体層８をそのまま利用し、積層態様が表裏逆になる点である。
　このように構成された第１プリント配線基材１０は、導体層８と接続するサーマルビア１４が複数形成され、各サーマルビア１４が第２プリント配線基材２０の導熱層２３Ａと接続された状態で積層される。また、導体層８上には、別途形成された熱伝導率が高い部材からなる放熱用フィン８０が全面にわたって密着接続される。
　従って、電子部品９０で発生した熱は、導熱層２３Ａを通って実装基板２から放熱されると共に、サーマルビア１４及び導体層８を通って放熱用フィン８０からも放熱される。これにより、放熱特性をより向上させることができる。
　１　　　　　部品内蔵基板
　２　　　　　実装基板
　２ａ　　　　実装面
　３　　　　　カバーレイフィルム
　６　　　　　ビアホール
　７　　　　　マスク材
　８　　　　　導体層
　９　　　　　接着層
　９ａ　　　　接着材
　１０　　　　第１プリント配線基材
　１１　　　　第１樹脂基材
　１４　　　　サーマルビア
　２０　　　　第２プリント配線基材
　２１　　　　第２樹脂基材
　２３　　　　サーマル配線
　２３ａ　　　めっき層
　２３Ａ　　　導熱層
　２３Ｂ　　　孔部
　２４　　　　サーマルビア
　２９　　　　開口部
　３０　　　　第３プリント配線基材
　３１　　　　第３樹脂基材
　３２　　　　信号用配線
　３３　　　　サーマル配線
　３４　　　　サーマルビア
　３５　　　　信号用ビア
　４０　　　　第４プリント配線基材
　４１　　　　第４樹脂基材
　４２　　　　信号用配線
　４３　　　　サーマル配線
　４４　　　　サーマルビア
　４５　　　　信号用ビア
　４８　　　　ソルダーレジスト
　４９　　　　バンプ
　８０　　　　放熱用フィン
　９０　　　　電子部品
　９１　　　　再配線電極
　９１ａ　　　裏面
　９１ｂ　　　電極形成面
　９１ｃ　　　パッド
　９１ｄ　　　絶縁層
　１００　　　部品内蔵基板実装体

Claims (8)

  1. 　樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板であって、
    　前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、
    　前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、
    　前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定されている
    　ことを特徴とする部品内蔵基板。
  2. 　前記孔部は、前記領域内で離散的に形成されていることを特徴とする請求項１記載の部品内蔵基板。
  3. 　前記導熱層は、前記サーマルビア及び前記サーマル配線を介して部品内蔵基板の表層に形成されたバンプに接続されていることを特徴とする請求項１記載の部品内蔵基板。
  4. 　樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板の製造方法であって、
    　複数の樹脂基材にサーマル配線を含む前記配線パターン及びサーマルビアを含む前記ビアを形成すると共に、前記複数の樹脂基材のうちの少なくとも一つに前記電子部品を内蔵する開口部及びこの開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着し前記開口部に臨む領域に孔部を有する金属部材からなる導熱層を形成して複数のプリント配線基材を形成する工程と、
    　前記電子部品の電極形成面と反対側の面が、前記孔部を介して前記導熱層上に積層される接着層により前記開口部内に固定されて前記導熱層と密着するように前記複数のプリント配線基材を熱圧着して一括積層する工程とを備えた
    　ことを特徴とする部品内蔵基板の製造方法。
  5. 　前記孔部は、前記領域内で離散的に形成されていることを特徴とする請求項４記載の部品内蔵基板の製造方法。
  6. 　前記サーマルビア及び前記サーマル配線を介して前記導熱層に接続されるバンプを、部品内蔵基板の表層に形成する工程を更に備えたことを特徴とする請求項４記載の部品内蔵基板の製造方法。
  7. 　樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板を実装基板に実装してなる部品内蔵基板実装体であって、
    　前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、
    　前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、
    　前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定され、
    　前記部品内蔵基板は、前記サーマルビア及び前記サーマル配線を介して前記導熱層に接続される部品内蔵基板の表層に形成されたバンプを介して実装基板に実装してなることを特徴とする部品内蔵基板実装体。
  8. 　前記孔部は、前記領域内で離散的に形成されていることを特徴とする請求項７記載の部品内蔵基板実装体。
PCT/JP2012/079463 2011-11-30 2012-11-14 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 WO2013080790A1 (ja)

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