JP2013115345A - 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 - Google Patents

部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 Download PDF

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JP2013115345A
JP2013115345A JP2011262217A JP2011262217A JP2013115345A JP 2013115345 A JP2013115345 A JP 2013115345A JP 2011262217 A JP2011262217 A JP 2011262217A JP 2011262217 A JP2011262217 A JP 2011262217A JP 2013115345 A JP2013115345 A JP 2013115345A
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Prior art keywords
substrate
component
electronic component
printed wiring
thermal
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JP2011262217A
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JP5167516B1 (ja
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Kazuhisa Itoi
和久 糸井
Masahiro Okamoto
誠裕 岡本
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Fujikura Ltd
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Fujikura Ltd
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Priority to JP2011262217A priority Critical patent/JP5167516B1/ja
Priority to EP12854222.2A priority patent/EP2787799B1/en
Priority to DK12854222.2T priority patent/DK2787799T3/da
Priority to PCT/JP2012/079463 priority patent/WO2013080790A1/ja
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Publication of JP5167516B1 publication Critical patent/JP5167516B1/ja
Publication of JP2013115345A publication Critical patent/JP2013115345A/ja
Priority to US14/290,173 priority patent/US9591767B2/en
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Abstract

【課題】電子部品と導熱層との密着性を確保し、放熱特性を向上させる。
【解決手段】部品内蔵基板実装体１００は、部品内蔵基板１と、これが実装された実装基板２とからなる。部品内蔵基板１は、第２〜第４プリント配線基材２０〜４０及びカバーレイフィルム３を熱圧着により一括積層した構造を備える。第２プリント配線基材２０の第２樹脂基材２１に形成された開口部２９内には、電子部品９０の裏面９１ａと導熱層２３Ａとが密着し、且つ孔部２３Ｂを介して接着層９により固定された状態で内蔵されている。第４プリント配線基材４０の実装面２ａ側にはバンプ４９が形成されている。電子部品９０の裏面９１ａに接する導熱層２３Ａやサーマルビア２４を介して、各層のサーマルビア及びサーマル配線を通り、バンプ４９から実装基板２に電子部品９０の熱が伝わって、実装基板２にて放熱される。
【選択図】図１

Description

この発明は、電子部品が内蔵された部品内蔵基板及びその製造方法並びに部品内蔵基板実装体に関する。
電子部品の高密度実装を実現するため、電子部品を基板に内蔵した部品内蔵基板が知られている。このような部品内蔵基板は、電子部品が配線基板に形成された絶縁層に埋設されるため、電子部品で発生する熱を、如何に効率よく外部へ放出するかが課題となる。従来の部品内蔵基板は、熱伝導性に優れた絶縁層と、電子部品の裏面（実装面とは反対側の面）に接するサーマルビアとを介して、電子部品で発生する熱を配線基板の上層に配置したヒートシンク（放熱器）に伝達して放熱させるようにしている（特許文献１）。
特開２００８−３０５９３７号公報
しかしながら、上記特許文献１に開示された従来技術の部品内蔵基板では、電子部品の裏面と放熱器との間が、導熱性樹脂組成物により形成されたサーマルビアを介して接続されているが、一般に導電ペーストの熱伝導率は銅の熱伝導率よりも低いので、銅を接続したものよりも放熱特性が良好ではないという問題がある。
一方で、熱を伝え易くするために、電子部品の裏面を放熱器などの導熱部材に直接接触させると、外部から浸入した水分が密着力の弱い電子部品の裏面と放熱器との間に浸入することでこれらの間に隙間が生じ、部品内蔵基板の信頼性を低下させてしまうという問題もある。
この発明は、上述した従来技術による問題点を解消し、電子部品と導熱層との密着性を確保し、放熱特性を向上させることができる部品内蔵基板及びその製造方法並びに部品内蔵基板実装体を提供することを目的とする。
本発明に係る部品内蔵基板は、樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板であって、前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定されていることを特徴とする。
本発明に係る部品内蔵基板によれば、部品内蔵基板に内蔵された電子部品の電極形成面と反対側の面が、開口部内において導電ペーストよりも熱伝導率の高い金属部材からなる導熱層に密着すると共に、導熱層の開口部に臨む領域に形成された孔部を介して、導熱層上に積層された接着層により開口部内に固定されるので、電子部品と導熱層との密着性を確実なものとし、放熱特性を向上させることができる。
本発明の一つの実施形態においては、前記孔部が、前記領域内で離散的に形成されている。
また、本発明の他の実施形態においては、前記導熱層が、前記サーマルビア及び前記サーマル配線を介して表層に形成されたバンプに接続されている。
本発明に係る部品内蔵基板実装体は、前記導熱層が、前記サーマルビア及び前記サーマル配線を介して表層に形成されたバンプに接続された前記部品内蔵基板を、前記バンプを介して実装基板に実装してなることを特徴とする。
本発明に係る部品内蔵基板実装体によれば、部品内蔵基板に内蔵された電子部品の電極形成面とは反対側の面が、導熱層、サーマルビア、サーマル配線及び部品内蔵基板の表層に形成されたバンプを介して実装基板に接続されている。このため、電子部品の熱が導熱層、サーマルビア、サーマル配線及びバンプを放熱経路として伝わって、効率よく確実に実装基板に放熱される。実装基板は電子部品や部品内蔵基板と比べると十分に面積が広いので、放熱媒体としては従来のような放熱器よりも良好であり、放熱器を設ける必要がない。これにより、小型化が可能であると共に電子部品のレイアウトの自由度を高めることができ、更に内蔵された電子部品の放熱特性の向上を図ることができる。
本発明に係る部品内蔵基板の製造方法は、樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板の製造方法であって、複数の樹脂基材にサーマル配線を含む前記配線パターン及びサーマルビアを含む前記ビアを形成すると共に、前記複数の樹脂基材のうちの少なくとも一つに前記電子部品を内蔵する開口部及びこの開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着し前記開口部に臨む領域に孔部を有する金属部材からなる導熱層を形成して複数のプリント配線基材を形成する工程と、前記電子部品の電極形成面と反対側の面が、前記孔部を介して前記導熱層上に積層される接着層により前記開口部内に固定されて前記導熱層と密着するように前記複数のプリント配線基材を熱圧着して一括積層する工程とを備えたことを特徴とする。
本発明に係る部品内蔵基板の製造方法によれば、部品内蔵基板に内蔵された電子部品の電極形成面とは反対側の面が、開口部内において導電ペーストよりも熱伝導率の高い金属部材からなる導熱層に密着すると共に、導熱層の開口部に臨む領域に形成された孔部を介して、導熱層上に積層された接着層により開口部内に固定されるので、上記と同様の作用効果を奏することができる。
本発明によれば、電子部品と導熱層との密着性を確保し、放熱特性を向上させることができる。
本発明の第１の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体の製造工程を示すフローチャートである。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体を製造工程毎に示す断面図である。 同部品内蔵基板実装体の導熱層の平面図である。 同部品内蔵基板実装体の他の導熱層の平面図である。 同部品内蔵基板実装体の更に他の導熱層の平面図である。 本発明の第２の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。
以下、添付の図面を参照して、この発明の実施の形態に係る部品内蔵基板及びその実装体並びに部品内蔵基板の製造方法を詳細に説明する。
［第１の実施形態］
図１は、本発明の第１の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。図１に示すように、第１の実施形態に係る部品内蔵基板実装体１００は、部品内蔵基板１と、この部品内蔵基板１が実装面２ａに実装された実装基板２とからなる。
部品内蔵基板１は、第２プリント配線基材２０と、第３プリント配線基材３０と、第４プリント配線基材４０と、第１プリント配線基材に代わるカバーレイフィルム３とを熱圧着により一括積層した構造を備えている。また、部品内蔵基板１は、第２プリント配線基材２０の第２樹脂基材２１に形成された開口部２９内に、第３プリント配線基材３０及びカバーレイフィルム３に挟まれた状態で内蔵された電子部品９０を備えている。更に、部品内蔵基板１は、第４プリント配線基材４０の実装面２ａ側に形成されたバンプ４９を備えている。
第３及び第４プリント配線基材３０，４０は、それぞれ第３及び第４樹脂基材３１，４１と、これら第３及び第４樹脂基材３１，４１の少なくとも片面に形成された信号用配線３２，４２及びサーマル配線３３，４３とを備える。また、第３及び第４プリント配線基材３０，４０は、それぞれ第３及び第４樹脂基材３１，４１に形成されたビアホール内に充填形成されたサーマルビア３４，４４及び信号用ビア３５，４５を備える。
一方、第２プリント配線基材２０は、第２樹脂基材２１の一方の面に形成されたサーマル配線２３と、他方の面に形成された孔部を有する導体層８と、第２樹脂基材２１に形成されたビアホール内に第２樹脂基材２１の両面を導通するように形成されたサーマルビア２４とを備える。これら第２〜第４プリント配線基材２０〜４０は、例えば片面銅張積層板（片面ＣＣＬ）や両面銅張積層板（両面ＣＣＬ）などを用いてもよい。
本例では、第２プリント配線基材２０が両面ＣＣＬに基づき形成され、第３及び第４プリント配線基材３０，４０が片面ＣＣＬに基づき形成されている。従って、第２プリント配線基材２０の導体層８及びサーマル配線２３は第２樹脂基材２１の両面に形成され、サーマルビア２４はこれら両面の導体層８及びサーマル配線２３を層間接続している。
この場合、サーマルビア２４は、例えば導体層８を貫通させることなくサーマル配線２３側から形成した貫通孔内にめっきを施した構造からなり、例えば銅めっきにより形成される。このとき、貫通孔内をめっきする代わりに導電ペーストを充填させた構造としてもよい。なお、導体層８は、その上に形成されためっき層２３ａと共に電子部品９０からの熱を伝導する導熱層２３Ａを構成する。
第２〜第４樹脂基材２１〜４１及びカバーレイフィルム３は、それぞれ例えば厚さ２５μｍ程度の樹脂フィルムにより構成されている。ここで、樹脂フィルムとしては、例えば熱可塑性のポリイミド、ポリオレフィン、液晶ポリマーなどからなる樹脂フィルムや、熱硬化性のエポキシ樹脂からなる樹脂フィルムなどを用いることができる。
電子部品９０は、例えばＩＣチップなどの半導体部品や受動部品等であり、図１に示す電子部品９０は、再配線を施したＷＬＰ（Ｗａｆｅｒ Ｌｅｖｅｌ Ｐａｃｋａｇｅ）を示している。電子部品９０の電極形成面９１ｂには、パッド９１ｃ上に形成された複数の再配線電極９１が設けられ、その周囲には絶縁層９１ｄが形成されている。
なお、信号用配線３２，４２及びサーマル配線２３，３３，４３は、例えば厚さ１２μｍ程度の銅箔などの導電材をパターン形成してなる。信号用ビア３５，４５及びサーマルビア３４，４４は、ビアホール内にそれぞれ充填された導電ペーストからなり、サーマルビア２４は、上記のようにめっきにより形成される。サーマル配線及びサーマルビアは、一部を除いて電子部品９０の外周側に配置されるように形成されている。
導電ペーストは、例えばニッケル、金、銀、銅、アルミニウム、鉄などから選択される少なくとも１種類の低電気抵抗の金属粒子と、錫、ビスマス、インジウム、鉛などから選択される少なくとも１種類の低融点の金属粒子とを含み、エポキシ、アクリル、ウレタンなどを主成分とするバインダ成分を混合したペーストからなる。
このように構成された導電ペーストは、熱伝導率が例えば５〜１３．５Ｗ／（ｍ・Ｋ）と低く、含有された低融点の金属が２００℃以下で溶融し合金を形成することができ、特に銅や銀などとは金属間化合物を形成することができる特性を備える。なお、導電ペーストは、例えば粒子径がナノレベルの金、銀、銅、ニッケル等のフィラーが、上記のようなバインダ成分に混合されたナノペーストで構成することもできる。
その他、導電ペーストは、上記ニッケル等の金属粒子が、上記のようなバインダ成分に混合されたペーストで構成することもできる。この場合、導電ペーストは、金属粒子同士が接触することで電気的接続が行われる特性となる。導電ペーストのビアホールへの充填方法としては、例えば印刷工法、スピン塗布工法、スプレー塗布工法、ディスペンス工法、ラミネート工法、及びこれらを併用した工法などを用いることができる。
バンプ４９は、半田などからなり、第４プリント配線基材４０の第４樹脂基材４１の実装面２ａ側に形成された信号用配線４２及びサーマル配線４３上のソルダーレジスト４８が被覆していない部分に形成されている。部品内蔵基板１は、これらバンプ４９を介して実装基板２の実装面２ａ上に実装されている。なお、第２〜第４プリント配線基材２０〜４０及びカバーレイフィルム３は、接着層９を介して積層されている。接着層９は、例えばエポキシ系やアクリル系接着材など、揮発成分が含まれた有機系接着材などからなる。
第２プリント配線基材２０の開口部２９内に配置された電子部品９０は、電極形成面９１ｂとは反対側の裏面９１ａが、導熱層２３Ａの導体層８と密着する。これと共に、裏面９１ａは、導熱層２３Ａの開口部２９に臨む領域に形成された孔部２３Ｂを介して、カバーレイフィルム３の接着層９により接着される。これにより、電子部品９０は、裏面９１ａと導体層８とが密着した状態で開口部２９内に固定される。
導体層８が純銅の銅箔からなる場合、純銅の熱伝導率は０℃にて４０３Ｗ／（ｍ・Ｋ）、１００℃にて３９５Ｗ／（ｍ・Ｋ）と非常に高いので、裏面９１ａと密着させることは放熱特性を向上させるのに非常に有効である。なお、孔部２３Ｂを設けずに開口部２９内に電子部品９０を固定させる場合、導体層８と電子部品９０の裏面とは直接接着できないので、これらの間には何らかの接着媒体が必要となり、孔部を有する導体層８に電子部品９０を密着させる場合に比べて、熱伝導特性が劣る。
このように構成された部品内蔵基板実装体１００では、電子部品９０が、導熱層２３Ａと実装基板２との間に配置される構造となる。そして、部品内蔵基板１に内蔵された電子部品９０の熱は、次のような放熱経路を辿って実装基板２に伝えられる。すなわち、電子部品９０の熱は、電子部品９０の裏面９１ａから、第２プリント配線基材２０の導熱層２３Ａに伝わる。
導熱層２３Ａに伝わった熱は、電子部品９０の外周側に形成されたサーマルビア２４を通って、第３プリント配線基材３０のサーマルビア３４及びサーマル配線３３に伝わり、更に第４プリント配線基材４０のサーマルビア４４及びサーマル配線４３に伝わって、バンプ４９に伝わる。こうしてバンプ４９に伝わった熱は、このバンプ４９を介して部品内蔵基板１よりも面積の大きな実装基板２に伝わり、実装基板２から放熱される。
このような構造により、部品内蔵基板１に内蔵された電子部品９０で発生した熱の殆どが、従来のような放熱器が不要な構造の部品内蔵基板１から実装基板２に伝わって放熱されることとなる。
次に、第１の実施形態に係る部品内蔵基板の製造方法について説明する。
図２〜図５は、部品内蔵基板実装体の製造工程を示すフローチャートである。図６〜図９は、部品内蔵基板実装体を製造工程毎に示す断面図である。なお、図２及び図６は第３及び第４プリント配線基材３０，４０について、図３及び図７は第２プリント配線基材２０について、図４及び図８は電子部品について、図５及び図９は部品内蔵基板実装体についてそれぞれの製造工程の詳細を示している。
まず、第３及び第４プリント配線基材３０，４０の製造工程について説明する。なお、これらは同様の工程で製造することができるので、ここでは図２を参照しながら代表して第４プリント配線基材４０の製造工程について説明するが、第３プリント配線基材３０についても同様である。
図６（ａ）に示すように、第４樹脂基材４１の一方の面に導体層８が形成された片面銅張積層板（片面ＣＣＬ）を準備する（ステップＳ１００）。次に、導体層８上にフォトリソグラフィによりエッチングレジストを形成した後にエッチングを行って、図６（ｂ）に示すように、信号用配線４２やサーマル配線４３等の配線パターンを形成する（ステップＳ１０２）。
ステップＳ１００にて使用する片面ＣＣＬは、例えば厚さ１２μｍ程度の銅箔からなる導体層８に、厚さ２５μｍ程度の第４樹脂基材４１を貼り合わせた構造からなる。なお、この片面ＣＣＬとしては、例えばキャスティング法により、銅箔にポリイミドのワニスを塗布してそのワニスを硬化させて作製されたものを使用することができる。
キャスティング法は、押出機によって溶融された樹脂を、平坦なダイに設けられた直線状のスリットから押し出して、その溶融膜を冷却されたロールで急速に冷やして圧延しながら巻き取ることで、平坦なフィルムやシートを成形する公知の方法である。この方法は、信頼性が高く多用されている。
その他、片面ＣＣＬとしては、ポリイミドフィルム上にシード層をスパッタリングにより形成し、めっきにより銅を成長させて導体層８を形成したものや、圧延或いは電解銅箔とポリイミドフィルムとを接着材により貼り合わせて作製されたものなどを使用することもできる。なお、第４樹脂基材４１は必ずしもポリイミドからなるものである必要はなく、液晶ポリマー等のプラスチックフィルムからなるものであってもよい。また、ステップＳ１０２でのエッチングには塩化第二鉄を主成分とするエッチャントや、塩化第二銅を主成分とするエッチャントなどを用いることができる。
配線パターンを形成したら、図６（ｃ）に示すように、第４樹脂基材４１の信号用配線４２及びサーマル配線４３形成面側と反対側の面に、接着材９ａ及びマスク材７を加熱圧着により貼り付ける（ステップＳ１０４）。ステップＳ１０４にて貼り付けられる接着材９ａとしては、例えば厚さ２５μｍ程度のエポキシ系熱硬化性フィルムを使用することができる。加熱圧着には真空ラミネータを用い、減圧下の雰囲気中にて、接着材９ａの硬化温度以下の温度で０．３ＭＰａの圧力によりプレスしてこれらを貼り合わせることが挙げられる。
なお、接着層９や接着材９ａに用いられる層間接着材は、エポキシ系の熱硬化性フィルムのみならず、アクリル系の接着材や、熱可塑性ポリイミドなどに代表される熱可塑性接着材などが挙げられる。また、層間接着材は必ずしもフィルム状である必要はなく、ワニス状の樹脂を塗布したものであってもよい。マスク材は、上述した樹脂フィルムやＰＥＴ，ＰＥＮなどのプラスチックフィルムの他、ＵＶ照射によって接着や剥離が可能な各種フィルムを用いることができる。
その後、図６（ｄ）に示すように、貼り付けたマスク材７側から、信号用配線４２及びサーマル配線４３に向かってマスク材７、接着材９ａ及び第４樹脂基材４１を貫通するビアホール６を所定箇所に形成し（ステップＳ１０６）、ビアホール６内に例えばプラズマデスミア処理を施す。
ステップＳ１０６にて形成されるビアホール６は、直径φ１００μｍ程度であり、ＵＶレーザを使用して所定箇所に形成される。ビアホール６は、その他、炭酸ガスレーザやエキシマレーザなどで形成してもよいし、ドリル加工や化学的なエッチングなどにより形成してもよい。また、プラズマデスミア処理は、ＣＦ４及びＯ２（四フッ化メタン＋酸素）の混合ガスにより行うことができるが、Ａｒ（アルゴン）などのその他の不活性ガスを用いることもでき、いわゆるドライ処理ではなく、薬液を用いたウェットデスミア処理としてもよい。
そして、図６（ｅ）に示すように、形成したビアホール６内に、例えばスクリーン印刷により導電ペーストを充填して信号用ビア４５及びサーマルビア４４の各種ビアを形成し（ステップＳ１０８）、マスク材７を剥離して、接着層９が備えられた第４樹脂基材４１を有する第４プリント配線基材４０を形成する。なお、サーマルビア４４は、熱伝導率の向上を図るため、導電ペーストではなくめっきにより形成するようにしてもよい。このような処理を行って、第３プリント配線基材３０や、更に多層の場合はその他のプリント配線基材を形成して準備しておく。
次に、図３を参照しながら第２プリント配線基材２０の製造工程について説明する。なお、既に説明した箇所には同一の符号を附して説明を割愛する場合があり、各ステップの具体的な処理内容については上述した内容を適用可能であるとする。まず、図７（ａ）に示すように、第２樹脂基材２１の両面に全面に亘って（ベタ状態で）導体層８が形成された両面銅張積層板（両面ＣＣＬ）を準備し（ステップＳ１１０）、図７（ｂ）に示すように、所定箇所にビアホール６を形成して（ステップＳ１１２）、プラズマデスミア処理を行う。
次に、図７（ｃ）に示すように、第２樹脂基材２１の全面にパネルめっき処理を施して（ステップＳ１１４）、導体層８上及びビアホール６内にめっき層２３ａを形成する。なお、ビアホール６内のめっき層２３ａは後にサーマルビア２４として用いられるめっきビアであり、第２樹脂基材２１の両面の導体層８を電気的に導通している。
そして、図７（ｄ）に示すように、第２樹脂基材２１の両面にエッチング等により導体層８及びめっき層２３ａからなる導熱層２３Ａやサーマル配線２３及びサーマルビア２４などの配線パターンを形成すると共に、電子部品９０を接着するための孔部２３Ｂを導熱層２３Ａに形成する（ステップＳ１１６）。
なお、このステップＳ１１６にて導熱層２３Ａに形成される孔部２３Ｂは、例えば図１０に示すように、開口部２９となる領域よりも狭く、且つ電子部品９０の面積よりも狭い範囲内に矩形状且つメッシュ状に複数個パターン形成される。孔部２３Ｂが離散的に配され、孔部２３Ｂ内に入り込んだ接着材と電子部品９０の裏面９１aとが接着されるため、密着力の弱い電子部品９０の裏面９１ａと導熱層２３Ａとの間で、水分が留まり、実装時のリフロー等による加熱や電子部品チップの発熱等で水分が蒸発して、これらの間で隙間が生じ、部品内蔵基板の信頼性を低下させてしまうことを防止できる。その他、孔部２３Ｂは、図１１に示すように、円形状且つメッシュ状に形成されたり、図１２に示すように、一つの矩形状に形成されたりしてもよい。更に、図示は省略するが、孔部２３Ｂは、複数個のそれぞれのサイズが異なるパターンや、格子状パターンなど、電子部品９０の裏面９１ａと導熱層２３Ａとが密着する面積を残すように種々のパターンで形成されてもよい。
最後に、図７（ｅ）に示すように、電子部品９０が内蔵される部分の第２樹脂基材２１をＵＶレーザなどにより除去し、開口部２９を形成して（ステップＳ１１８）、第２プリント配線基材２０を形成する。
なお、このように形成された第２プリント配線基材２０の開口部２９に内蔵される電子部品９０は、例えば次のように製造される。図４を参照しながら電子部品９０の製造工程について説明する。まず、図８（ａ）に示すように、酸化ケイ素や窒化ケイ素などの無機絶縁層が形成されたダイシング前のウェハ９２を準備する（ステップＳ１２０）。
次に、図８（ｂ）に示すように、準備したウェハ９２の表面に、例えばセミアディティブ法によって、電子部品９０のパッド９１ｃ上及び無機絶縁層上に導体回路（図示せず）やパッド９１ｃを覆う再配線電極９１を形成する（ステップＳ１２２）。
そして、図８（ｃ）に示すように、例えば液状の感光性ポリイミド前駆体をスピンコートし、フォトリソグラフィによってコンタクトホールを形成した後に、焼成することで絶縁層９１ｄを形成する（ステップＳ１２４）。最後に、プロービングにより検査を行って、図８（ｄ）に示すように、薄型化及びダイシングにより電子部品９０を個片化して作製する（ステップＳ１２６）。
なお、ステップＳ１２４にて形成される絶縁層９１ｄの樹脂は、例えばベンゾシクロブテン（ＢＣＢ）や、ポリベンゾオキサゾール（ＰＢＯ）などを用いることができる。また、感光性樹脂は必ずしもスピンコートによって塗布される必要はなく、カーテンコートやスクリーン印刷、或いはスプレーコートなどによって塗布されてもよい。このようにして作製された電子部品９０には、通常の導電用回路の他、インダクタ、キャパシタ、抵抗などの各機能を付与させることもできる。
こうして、第２〜第４プリント配線基材２０〜４０及び電子部品９０を作製したら、図９に示すように、電子部品９０の再配線電極９１と第３プリント配線基材３０の信号用ビア３５を、電子部品用実装機で位置合わせして、第３プリント配線基材３０の接着層９及び信号用ビア３５の導電ペーストが硬化していない状態で、電子部品９０を第３プリント配線基材３０に仮留め接着する。
その後、図５に示すように、各プリント配線基材２０〜４０、電子部品９０及び接着層９が形成されたカバーレイフィルム３を位置決めし、積層する（ステップＳ１３０）。例えば真空プレス機を用いて、１ｋＰａ以下の減圧雰囲気中にて加熱加圧することで熱圧着により一括積層し（ステップＳ１３２）、まず、図１に示すような部品内蔵基板１を製造する。このとき、層間の各接着層９や各樹脂基材２１，３１等の硬化と同時に、ビアホール６に充填された導電ペーストの硬化及び合金化が行われる。従って、導電ペーストと接する配線等との間には、金属間化合物の合金層が形成される。
そして、部品内蔵基板１における第４プリント配線基材４０の信号用配線４２及びサーマル配線４３側の第４樹脂基材４１上に、ソルダーレジスト４８をパターン形成する（ステップＳ１３４）。ソルダーレジスト４８を形成したら、各配線４２，４３上に半田などによりバンプ４９を形成して（ステップＳ１３６）、部品内蔵基板１を実装基板２の実装面２ａ上に実装することで（ステップＳ１３８）、図１に示すような第１の実施形態に係る部品内蔵基板実装体１００を製造する。
［第２の実施形態］
図１３は、本発明の第２の実施形態に係る部品内蔵基板実装体の構造を示す断面図である。図１３に示すように、第２の実施形態に係る部品内蔵基板実装体１００Ａは、カバーレイフィルム３の代わりに第１プリント配線基材１０が積層され、電子部品９０の放熱が実装基板２のみならず第１プリント配線基材１０側からも行われる点が、第１の実施形態に係る部品内蔵基板実装体１００と相違している。
具体的には、第１プリント配線基材１０は、基本的には図２及び図６を用いて説明した第４プリント配線基材４０と同様の工程で製造することができ、第１樹脂基材１１の片面にベタパターンの導体層８を形成した構造からなる。第４プリント配線基材４０との相違点としては、ステップＳ１０２にて配線パターンを形成することなく、片面ＣＣＬの導体層８をそのまま利用し、積層態様が表裏逆になる点である。
このように構成された第１プリント配線基材１０は、導体層８と接続するサーマルビア１４が複数形成され、各サーマルビア１４が第２プリント配線基材２０の導熱層２３Ａと接続された状態で積層される。また、導体層８上には、別途形成された熱伝導率が高い部材からなる放熱用フィン８０が全面にわたって密着接続される。
従って、電子部品９０で発生した熱は、導熱層２３Ａを通って実装基板２から放熱されると共に、サーマルビア１４及び導体層８を通って放熱用フィン８０からも放熱される。これにより、放熱特性をより向上させることができる。
１ 部品内蔵基板
２ 実装基板
２ａ 実装面
３ カバーレイフィルム
６ ビアホール
７ マスク材
８ 導体層
９ 接着層
９ａ 接着材
１０ 第１プリント配線基材
１１ 第１樹脂基材
１４ サーマルビア
２０ 第２プリント配線基材
２１ 第２樹脂基材
２３ サーマル配線
２３ａ めっき層
２３Ａ 導熱層
２３Ｂ 孔部
２４ サーマルビア
２９ 開口部
３０ 第３プリント配線基材
３１ 第３樹脂基材
３２ 信号用配線
３３ サーマル配線
３４ サーマルビア
３５ 信号用ビア
４０ 第４プリント配線基材
４１ 第４樹脂基材
４２ 信号用配線
４３ サーマル配線
４４ サーマルビア
４５ 信号用ビア
４８ ソルダーレジスト
４９ バンプ
８０ 放熱用フィン
９０ 電子部品
９１ 再配線電極
９１ａ 裏面
９１ｂ 電極形成面
９１ｃ パッド
９１ｄ 絶縁層
１００ 部品内蔵基板実装体

Claims (5)

  1. 樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板であって、
    前記複数のプリント配線基材の少なくとも一部が、前記配線パターンにサーマル配線を含み、前記ビアにサーマルビアを含み、
    前記複数のプリント配線基材のうちの少なくとも一つには、前記電子部品が内蔵される開口部が形成されると共に、この開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着する金属部材からなる導熱層が形成され、
    前記電子部品は、前記導熱層の前記開口部に臨む領域に形成された孔部を介して、前記導熱層上に積層された接着層により前記開口部内に固定されている
    ことを特徴とする部品内蔵基板。
  2. 前記孔部は、前記領域内で離散的に形成されていることを特徴とする請求項１記載の部品内蔵基板。
  3. 前記導熱層は、前記サーマルビア及び前記サーマル配線を介して表層に形成されたバンプに接続されていることを特徴とする請求項１又は２記載の部品内蔵基板。
  4. 請求項３記載の部品内蔵基板を、前記バンプを介して実装基板に実装してなることを特徴とする部品内蔵基板実装体。
  5. 樹脂基材に配線パターン及びビアが形成されたプリント配線基材を複数積層すると共に電子部品を内蔵してなる部品内蔵基板の製造方法であって、
    複数の樹脂基材にサーマル配線を含む前記配線パターン及びサーマルビアを含む前記ビアを形成すると共に、前記複数の樹脂基材のうちの少なくとも一つに前記電子部品を内蔵する開口部及びこの開口部に内蔵される前記電子部品の電極形成面と反対側の面と密着し前記開口部に臨む領域に孔部を有する金属部材からなる導熱層を形成して複数のプリント配線基材を形成する工程と、
    前記電子部品の電極形成面と反対側の面が、前記孔部を介して前記導熱層上に積層される接着層により前記開口部内に固定されて前記導熱層と密着するように前記複数のプリント配線基材を熱圧着して一括積層する工程とを備えた
    ことを特徴とする部品内蔵基板の製造方法。
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