JP6082696B2 - 基板レベルのemi遮蔽のための複合フィルム - Google Patents
基板レベルのemi遮蔽のための複合フィルム Download PDFInfo
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- 239000002131 composite material Substances 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 title description 6
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000011231 conductive filler Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 20
- 238000007906 compression Methods 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000002952 polymeric resin Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 239000007771 core particle Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000010420 shell particle Substances 0.000 claims description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 229920001021 polysulfide Polymers 0.000 claims description 4
- 239000005077 polysulfide Substances 0.000 claims description 4
- 150000008117 polysulfides Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 238000013329 compounding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 239000002998 adhesive polymer Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- 239000011258 core-shell material Substances 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 description 20
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000976 ink Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000000935 solvent evaporation Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009474 hot melt extrusion Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
- G21F1/00—Shielding characterised by the composition of the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Description
Claims (14)
- EMI遮蔽のための複合フィルムであって、
全方向に等方性の導電性である上層と、
熱圧縮前は導電性を有さず、熱圧縮後にZ方向にのみ異方性の導電性である下層の、
少なくとも2つの層を有する、複合フィルムであり、
前記下層が、熱圧縮の局所的領域への適用時に、熱圧縮された局所的領域のみ異方性の導電性を確立するのに有効な配合レベルの導電性粒子を充填した、接着性高分子樹脂を含み、
下層は、熱圧縮後に、プリント回路基板上の接地パッドと上層とを相互接続しうるものである、複合フィルム。 - 前記上層が、等方性導電性を確立するのに有効な配合レベルの導電性フィラー粒子を充填した、高分子樹脂を含む、請求項1に記載の複合フィルム。
- 前記上層の高分子樹脂が、少なくとも1つの熱硬化性樹脂、または少なくとも1つの熱可塑性樹脂、または熱硬化性樹脂と熱可塑性樹脂の組合せを含む、請求項2に記載の複合フィルム。
- 前記上層の熱硬化性樹脂が、ビニル樹脂、アクリル樹脂、フェノール樹脂、エポキシ樹脂、マレイミド樹脂、ポリイミド樹脂、またはケイ素含有樹脂からなる群より選択され、そして、前記上層の熱可塑性樹脂が、ポリアクリレート、フェノキシ樹脂、熱可塑性ポリエステル、ポリアミド、ポリウレタン、ポリオレフィン、多硫化ゴム、およびニトリルゴムからなる群より選択される、請求項3に記載の複合フィルム。
- 前記上層の導電性フィラー粒子が、銀、ニッケル、銅、グラファイト、カーボンナノチューブ、およびコア/シェル粒子からなる群より選択され、
該コア/シェル粒子は、コアが、シリカ、ガラス、窒化ホウ素、金属、ポリエチレン、ポリスチレン、フェノール樹脂、エポキシ樹脂、アクリル樹脂、およびベンゾグアナミン樹脂からなる群より選択され、シェルが、銀、ニッケル、および銅からなる群より選択される、請求項2に記載の複合フィルム。 - 前記上層の導電性フィラーの配合が、前記上層の全組成に対して15容量%以上である、請求項1に記載の複合フィルム。
- 前記上層が、金属箔もしくは金属メッシュ、または、金属箔もしくは金属メッシュと、導電性粒子を充填した高分子樹脂との組合せである、請求項1に記載の複合フィルム。
- 前記下層の高分子樹脂が、少なくとも1つの熱硬化性樹脂、または少なくとも1つの熱可塑性樹脂、または熱硬化性樹脂と熱可塑性樹脂の組合せを含み、かつ、前記下層が指触乾燥状態である、請求項1に記載の複合フィルム。
- 前記下層の熱硬化性樹脂が、ビニル樹脂、アクリル樹脂、フェノール樹脂、エポキシ樹脂、マレイミド樹脂、ポリイミド樹脂、およびケイ素含有樹脂からなる群より選択され、そして、前記下層の熱可塑性樹脂が、ポリアクリレート、フェノキシ樹脂、熱可塑性ポリエステル、ポリアミド、ポリウレタン、ポリオレフィン、多硫化ゴム、およびニトリルゴムからなる群より選択される、請求項8に記載の複合フィルム。
- 前記下層の導電性フィラーの配合レベルが、前記下層の全組成に対して、2容量%から20容量%である、請求項1に記載の複合フィルム。
- 前記下層の導電性フィラー粒子の径が、1μmから125μmの範囲内である、請求項1に記載の複合フィルム。
- 前記下層の導電性フィラーが、銀、銅、ニッケル、グラファイト、およびコアシェル粒子からなる群より選択され、
該コア/シェル粒子が、導電性シェルおよび導電性または誘電性コアを有する、請求項1に記載の複合フィルム。 - 前記下層の導電性フィラーが、金被覆ポリマー球体、銀被覆ケイ酸塩、炭化タングステン(WC)被覆アルミニウム、およびグラファイト被覆金属からなる群より選択される、コア/シェル粒子である、請求項12に記載の複合フィルム。
- 前記下層が、誘電性フィラーをさらに含み、該誘電性フィラーが、導電性フィラーの粒子サイズよりも小さい粒子サイズを有し、窒化ホウ素、酸化アルミニウム、窒化アルミニウム、およびこれらの材料を被覆した粒子からなる群より選択され、かつ、前記下層の組成を基準として、10重量%から80重量%の範囲の配合レベルで含まれる、請求項1に記載の複合フィルム。
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US40670510P | 2010-10-26 | 2010-10-26 | |
US61/406,705 | 2010-10-26 | ||
PCT/US2011/057418 WO2012058131A2 (en) | 2010-10-26 | 2011-10-24 | Composite film for board level emi shielding |
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JP2016035811A Division JP2016122859A (ja) | 2010-10-26 | 2016-02-26 | 基板レベルのemi遮蔽のための複合フィルム |
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JP2014502221A JP2014502221A (ja) | 2014-01-30 |
JP2014502221A5 JP2014502221A5 (ja) | 2015-03-26 |
JP6082696B2 true JP6082696B2 (ja) | 2017-02-15 |
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JP2013536689A Active JP6082696B2 (ja) | 2010-10-26 | 2011-10-24 | 基板レベルのemi遮蔽のための複合フィルム |
JP2016035811A Withdrawn JP2016122859A (ja) | 2010-10-26 | 2016-02-26 | 基板レベルのemi遮蔽のための複合フィルム |
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US (1) | US8847184B2 (ja) |
EP (1) | EP2633746B1 (ja) |
JP (2) | JP6082696B2 (ja) |
KR (1) | KR101584872B1 (ja) |
CN (1) | CN103190209B (ja) |
FI (1) | FI2633746T3 (ja) |
TW (1) | TWI507120B (ja) |
WO (1) | WO2012058131A2 (ja) |
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KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
JP2007073547A (ja) * | 2005-09-02 | 2007-03-22 | Yuji Suda | 電子部品の加圧装置 |
JP5185922B2 (ja) * | 2006-03-28 | 2013-04-17 | パーカー.ハニフィン.コーポレイション | 施用可能な硬化樹脂 |
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WO2008126690A1 (ja) * | 2007-03-29 | 2008-10-23 | Kabushiki Kaisha Asahi Rubber | 電磁波シールドシート及びrfidプレート |
GB0710425D0 (en) | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
JP5487419B2 (ja) * | 2008-02-12 | 2014-05-07 | タツタ電線株式会社 | 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法 |
JP5139156B2 (ja) | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | 電磁波シールド材及びプリント配線板 |
US20110014356A1 (en) * | 2009-06-12 | 2011-01-20 | Lord Corporation | Method for protecting a substrate from lightning strikes |
KR101332362B1 (ko) | 2012-09-21 | 2013-12-02 | 재단법인 철원플라즈마 산업기술연구원 | 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법 |
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2011
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- 2011-10-24 FI FIEP11836909.9T patent/FI2633746T3/fi active
- 2011-10-24 KR KR1020137013255A patent/KR101584872B1/ko active IP Right Grant
- 2011-10-24 EP EP11836909.9A patent/EP2633746B1/en active Active
- 2011-10-24 WO PCT/US2011/057418 patent/WO2012058131A2/en active Application Filing
- 2011-10-24 JP JP2013536689A patent/JP6082696B2/ja active Active
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Also Published As
Publication number | Publication date |
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EP2633746A4 (en) | 2017-11-29 |
FI2633746T3 (fi) | 2023-07-24 |
TWI507120B (zh) | 2015-11-01 |
WO2012058131A3 (en) | 2012-06-28 |
JP2016122859A (ja) | 2016-07-07 |
JP2014502221A (ja) | 2014-01-30 |
KR20130132450A (ko) | 2013-12-04 |
CN103190209A (zh) | 2013-07-03 |
EP2633746A2 (en) | 2013-09-04 |
EP2633746B1 (en) | 2023-07-19 |
TW201228589A (en) | 2012-07-01 |
US20130207005A1 (en) | 2013-08-15 |
CN103190209B (zh) | 2016-05-18 |
KR101584872B1 (ko) | 2016-01-13 |
US8847184B2 (en) | 2014-09-30 |
WO2012058131A2 (en) | 2012-05-03 |
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