JP6082696B2 - 基板レベルのｅｍｉ遮蔽のための複合フィルム - Google Patents

基板レベルのｅｍｉ遮蔽のための複合フィルム Download PDF

Info

Publication number
JP6082696B2
JP6082696B2 JP2013536689A JP2013536689A JP6082696B2 JP 6082696 B2 JP6082696 B2 JP 6082696B2 JP 2013536689 A JP2013536689 A JP 2013536689A JP 2013536689 A JP2013536689 A JP 2013536689A JP 6082696 B2 JP6082696 B2 JP 6082696B2
Authority
JP
Japan
Prior art keywords
resin
composite film
lower layer
conductive
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013536689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014502221A5 (enExample
JP2014502221A (ja
Inventor
チー−ミン・チェン
ボ・シア
ジョージ・トーマス
Original Assignee
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング, ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2014502221A publication Critical patent/JP2014502221A/ja
Publication of JP2014502221A5 publication Critical patent/JP2014502221A5/ja
Application granted granted Critical
Publication of JP6082696B2 publication Critical patent/JP6082696B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00—Shielding characterised by the composition of the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
JP2013536689A 2010-10-26 2011-10-24 基板レベルのｅｍｉ遮蔽のための複合フィルム Expired - Fee Related JP6082696B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40670510P 2010-10-26 2010-10-26
US61/406,705 2010-10-26
PCT/US2011/057418 WO2012058131A2 (en) 2010-10-26 2011-10-24 Composite film for board level emi shielding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016035811A Division JP2016122859A (ja) 2010-10-26 2016-02-26 基板レベルのｅｍｉ遮蔽のための複合フィルム

Publications (3)

Publication Number Publication Date
JP2014502221A JP2014502221A (ja) 2014-01-30
JP2014502221A5 JP2014502221A5 (enExample) 2015-03-26
JP6082696B2 true JP6082696B2 (ja) 2017-02-15

Family

ID=45994675

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013536689A Expired - Fee Related JP6082696B2 (ja) 2010-10-26 2011-10-24 基板レベルのｅｍｉ遮蔽のための複合フィルム
JP2016035811A Withdrawn JP2016122859A (ja) 2010-10-26 2016-02-26 基板レベルのｅｍｉ遮蔽のための複合フィルム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016035811A Withdrawn JP2016122859A (ja) 2010-10-26 2016-02-26 基板レベルのｅｍｉ遮蔽のための複合フィルム

Country Status (8)

Country Link
US (1) US8847184B2 (enExample)
EP (1) EP2633746B1 (enExample)
JP (2) JP6082696B2 (enExample)
KR (1) KR101584872B1 (enExample)
CN (1) CN103190209B (enExample)
FI (1) FI2633746T3 (enExample)
TW (1) TWI507120B (enExample)
WO (1) WO2012058131A2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9678499B2 (en) 2012-06-27 2017-06-13 Mitsubishi Electric Research Laboratories, Inc. Method for controlling redundantly actuated machines for cutting a pattern of disconnected contours
TWI573523B (zh) * 2014-04-10 2017-03-01 Joinsoon Electronic Manufacturing Co Ltd Prevention and control of electrical signals are disturbed by the method and its circuit structure
CN106465568B (zh) * 2014-06-02 2019-01-01 大自达电线股份有限公司 导电性接合膜、印刷布线板及电子设备
KR102314774B1 (ko) 2014-11-26 2021-10-21 삼성전자주식회사 반도체 패키지
US9635789B2 (en) 2015-01-30 2017-04-25 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with increased under-shield space
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
EP3075798A1 (en) * 2015-04-01 2016-10-05 Ronald R. Savin Coating compositions
JP3216710U (ja) 2015-06-12 2018-06-21 グラフテック インターナショナル ホールディングス インコーポレイティド グラファイト複合材料及び熱管理システム
US9968004B2 (en) 2015-09-25 2018-05-08 Laird Technologies, Inc. Thermal interface materials including electrically-conductive material
CN213951063U (zh) 2016-03-31 2021-08-13 新格拉夫解决方案有限责任公司 噪声抑制石墨物品和组件
JP6528733B2 (ja) 2016-06-21 2019-06-12 株式会社デンソー エジェクタ式冷凍サイクル
US10080317B2 (en) 2016-06-29 2018-09-18 Microsoft Technology Licensing, Llc Polymeric electromagnetic shield for electronic components
TWI619561B (zh) * 2016-07-28 2018-04-01 Rotating target
US10477738B2 (en) 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
KR20190076250A (ko) 2017-12-22 2019-07-02 삼성전자주식회사 반도체 패키지 및 반도체 모듈
KR102616814B1 (ko) * 2018-03-09 2023-12-21 삼성전자주식회사 반도체 패키지 및 반도체 모듈
CN111972051A (zh) 2018-03-16 2020-11-20 华为技术有限公司 用于电磁干扰屏蔽的组件及方法
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102869375B1 (ko) * 2020-07-28 2025-10-14 삼성전자주식회사 Fpcb 조립체 및 이를 포함하는 전자 기기
KR102521564B1 (ko) * 2021-01-14 2023-04-12 성균관대학교산학협력단 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3157344B2 (ja) * 1993-04-27 2001-04-16 三洋電機株式会社 導電シート及び表示器の製造方法
US5639989A (en) 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JPH087658A (ja) * 1994-06-22 1996-01-12 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP2002223094A (ja) 2001-01-25 2002-08-09 Yokohama Rubber Co Ltd:The 電波吸収体の構造
US6900383B2 (en) 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US6674652B2 (en) * 2002-01-29 2004-01-06 3Com Corporation Integrated shield wrap
US20060225874A1 (en) * 2005-04-11 2006-10-12 Shives Gary D Sandwiched thermal article
US20060247352A1 (en) * 2005-04-29 2006-11-02 Ariel - University Research And Development Ltd. EMI shielding material
JP4319167B2 (ja) 2005-05-13 2009-08-26 タツタ システム・エレクトロニクス株式会社 シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
JP2007073547A (ja) * 2005-09-02 2007-03-22 Yuji Suda 電子部品の加圧装置
KR101367040B1 (ko) * 2006-03-28 2014-02-24 파커-한니핀 코포레이션 분배성 경화 수지
JP4914262B2 (ja) * 2006-03-29 2012-04-11 タツタ電線株式会社 シールドフィルム及びシールドプリント配線板
JP2007324161A (ja) * 2006-05-30 2007-12-13 Yuji Suda ビルドアップ多層配線板の製造方法
JP5129935B2 (ja) * 2006-06-13 2013-01-30 日東電工株式会社 シート状複合材料及びその製造方法
US20100096181A1 (en) * 2007-03-29 2010-04-22 Munetomo Nakamura Electromagnetic shield sheet and rfid plate
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
JP5487419B2 (ja) * 2008-02-12 2014-05-07 タツタ電線株式会社 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法
JP5139156B2 (ja) 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
BR112012000203B1 (pt) * 2009-06-12 2020-01-28 Lord Corp método para proteção de um substrato contra relâmpagos
KR101332362B1 (ko) 2012-09-21 2013-12-02 재단법인 철원플라즈마 산업기술연구원 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법

Also Published As

Publication number Publication date
JP2016122859A (ja) 2016-07-07
TWI507120B (zh) 2015-11-01
KR20130132450A (ko) 2013-12-04
US8847184B2 (en) 2014-09-30
EP2633746B1 (en) 2023-07-19
WO2012058131A3 (en) 2012-06-28
EP2633746A2 (en) 2013-09-04
WO2012058131A2 (en) 2012-05-03
CN103190209B (zh) 2016-05-18
KR101584872B1 (ko) 2016-01-13
US20130207005A1 (en) 2013-08-15
FI2633746T3 (fi) 2023-07-24
CN103190209A (zh) 2013-07-03
JP2014502221A (ja) 2014-01-30
TW201228589A (en) 2012-07-01
EP2633746A4 (en) 2017-11-29

Similar Documents

Publication Publication Date Title
JP6082696B2 (ja) 基板レベルのｅｍｉ遮蔽のための複合フィルム
JP6803401B2 (ja) 放熱基板、放熱回路構成体、及びその製造方法
JP2000239542A (ja) 粉体組成物及びその製造方法、並びに、熱伝導基板及びその製造方法
WO2020090726A1 (ja) 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板
KR20190078843A (ko) 전도성 열경화성 접착제 조성물, 이를 포함하는 전도성 열경화성 접착 필름 및 이의 제조방법
KR102522785B1 (ko) 실장 구조체의 제조 방법 및 이것에 이용되는 적층 시트
WO2017164174A1 (ja) 電磁波シールドフィルム
JP6932475B2 (ja) 有機樹脂基板の製造方法、有機樹脂基板および半導体装置
US20100116431A1 (en) Thermoconductive composition for rf shielding
JP4421081B2 (ja) パワーモジュールとその製造方法
JP6307191B2 (ja) プレス接着用金属箔及び電子部品パッケージ
CN110784992B (zh) 自由接地膜、线路板及自由接地膜的制备方法
JP5696302B2 (ja) インターポーザ用の金属張積層板とそれを用いた半導体パッケージ
KR102643880B1 (ko) 전력반도체 패키지용 다이 어태치 페이스트 및 그의 제조방법
US12218085B2 (en) Substrate, electronic device, and method for manufacturing substrate
JP4354047B2 (ja) ビア充填用導電ペースト組成物
JP6321944B2 (ja) プレス接着用金属箔及び電子部品パッケージ
CN110784983B (zh) 自由接地膜、线路板及自由接地膜的制备方法
JP2001274300A (ja) 接着材およびこれを用いた電子部品
WO2023190423A1 (ja) 導電性接着剤層及び放熱構造
KR20230059251A (ko) 바이모달 은나노입자를 포함하는 전력반도체 패키지용 다이 어태치 페이스트 및 그의 제조방법
CN103188864A (zh) 印刷电路板和用于制造该印刷电路板的方法
CN103287012A (zh) 基于复合材料的介质基板及其制造方法
KR20200017722A (ko) 전자부품 패키지용 전자파 차폐 복합필름, 이를 포함하는 전자부품 패키지 및 이의 제조방법
JP6196132B2 (ja) プレス接着用金属箔及び電子部品パッケージ

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20140815

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141023

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150130

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20150202

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150410

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20150410

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150421

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150710

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20151027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160226

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20160307

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20160513

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20161116

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161201

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170123

R150 Certificate of patent or registration of utility model

Ref document number: 6082696

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees