JP6125431B2 - Uv硬化性導電性組成物を形成するための方法およびそれにより形成される組成物 - Google Patents
Uv硬化性導電性組成物を形成するための方法およびそれにより形成される組成物 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/04—Carbon
- C08K3/044—Carbon nanohorns or nanobells
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electric Cables (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Description
1.貯蔵寿命およびポットライフの根本的な制御が可能となる。
2.急速である。
3.熱が損傷を引き起こす場合に適用することができる。
UV硬化性であり導電層を生じることができる、接着性ポリマー組成物などのポリマー組成物を提供することが、本発明の目的である。
前述の目的は本発明によって達成され、本発明は、本発明の第1の態様によると、請求項1により定義されるような、UV光によって硬化されて異方導電性層となる能力を有するポリマー組成物を製造するための方法に関する。
Claims (12)
- UV光によって硬化して異方導電性ポリマー層となる能力を有するポリマー組成物を製造する方法であって:
固有の光硬化性を有する流動性ポリマー組成物の非導電性マトリックスを提供する工程と、
前記非導電性マトリックスに、少なくとも90%の導電性粒子について20未満のアスペクト比を有する導電性粒子を、前記導電性粒子の濃度が等方性混合物のパーコレーション閾値よりも低いレベルで維持されることを可能にするために十分少ない量で添加する工程と、
このようにして形成された組成物を、UV光への暴露が防止される貯蔵庫に入れる工程と、
を含み、
前記導電性粒子が、主に非水性分散液として添加され、前記非導電性マトリックス中に0.1〜2体積%の範囲内の濃度で存在することを特徴とする方法。 - 前記導電性粒子の大半のアスペクト比が5未満の範囲内にあり、少なくとも75%の前記導電性粒子のアスペクト比が10未満の範囲内にあることを特徴とする、請求項1に記載の方法。
- 前記非導電性マトリックスが本質的に接着性であることを特徴とする、請求項1又は請求項2に記載の方法。
- 前記導電性粒子が前記非導電性マトリックス中に0.1〜1.5体積%の範囲内の濃度で存在することを特徴とする、請求項1〜請求項3のいずれか1項に記載の方法。
- 前記導電性粒子が非水性分散液として添加されることを特徴とする、請求項1〜請求項4のいずれか1項に記載の方法。
- 前記導電性粒子が、炭素粒子、金属粒子、金属被覆粒子、および金属酸化物粒子、またはそれらの任意の組み合わせから選択されることを特徴とする、請求項1〜請求項5のいずれか1項に記載の方法。
- 前記炭素粒子が、カーボンブラック粒子またはカーボンナノコーンまたはグラファイト粒子またはグラフェンまたはそれらの任意の組み合わせを含むことを特徴とする、請求項6に記載の方法。
- 異方導電性経路を設けるために有用であり、UV光への暴露が防止される貯蔵庫に貯蔵可能な等方性ポリマー組成物であって、固有の光硬化性を有する流動性ポリマー組成物の非導電性マトリックスを含み、更に、少なくとも90%の導電性粒子が20未満のアスペクト比を有する導電性粒子をパーコレーション閾値よりも低い濃度で含み、前記導電性粒子が前記非導電性マトリックス中に0.1〜2体積%の範囲内の濃度で存在することを特徴とする、ポリマー組成物。
- 前記ポリマー組成物が本質的に接着性であることを特徴とする、請求項8に記載のポリマー組成物。
- 異方導電性であり所望により熱伝導性である層を設けるための方法であって:請求項8又は請求項9に記載のポリマー組成物の層を基体に付与することと、
所望により、第2の基体を前記層の上に配置することと、
接着性の前記ポリマー組成物に、意図する導電性の方向によって決定される方向で電場を付与し、
それにより前記導電性粒子を整列させて集合体とし、異方性導電性経路を形成することと、
前記ポリマー組成物をUV光による影響下で硬化させて、自立したフィルムを提供し、前記異方性導電性経路を保持することと、
を含むことを特徴とする方法。 - 異方導電性であり所望により熱伝導性である層を設けるための方法であって:
請求項9に記載の接着性ポリマー組成物の層を基体に付与することと、
所望により、第2の基体を前記層の上に配置することと、
接着性の前記ポリマー組成物に、意図する導電性の方向によって決定される方向で電場を付与し、
それにより前記導電性粒子を整列させて集合体とし、異方性導電性経路を形成することと、
接着性の前記ポリマー組成物をUV光による影響下で硬化させて、接着性層と基体との間に恒久的な接着をもたらし、前記異方性導電性経路を保持することと、
を含むことを特徴とする方法。 - AC場を付与して、主に互いに平行な導電性経路を得ることを特徴とする、請求項10または請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20101761 | 2010-12-15 | ||
NO20101761 | 2010-12-15 | ||
PCT/NO2011/000345 WO2012081992A2 (en) | 2010-12-15 | 2011-12-14 | Method for forming uv-curable conductive compositions and a domposition thus formed |
Publications (2)
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JP2014506271A JP2014506271A (ja) | 2014-03-13 |
JP6125431B2 true JP6125431B2 (ja) | 2017-05-10 |
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EP (1) | EP2652059A2 (ja) |
JP (1) | JP6125431B2 (ja) |
KR (1) | KR101892198B1 (ja) |
CN (3) | CN113462316A (ja) |
WO (1) | WO2012081992A2 (ja) |
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US20140150970A1 (en) | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
US8673184B2 (en) | 2011-10-13 | 2014-03-18 | Flexcon Company, Inc. | Systems and methods for providing overcharge protection in capacitive coupled biomedical electrodes |
US9818499B2 (en) | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
CA2872477C (en) * | 2012-05-03 | 2018-01-23 | Ppg Industries Ohio, Inc. | Adhesive compositions containing graphenic carbon particles |
US10973981B2 (en) * | 2012-08-31 | 2021-04-13 | Sanofi-Aventis Deutschland Gmbh | Medical device with impact resistant housing |
EP2947662A1 (en) * | 2014-05-21 | 2015-11-25 | Condalign AS | A method for arranging particles at an interface |
DE102015207814A1 (de) * | 2015-04-28 | 2016-11-03 | Benecke-Kaliko Ag | Elektrisch leitfähige Materialzusammensetzung |
CN107059415A (zh) * | 2017-04-12 | 2017-08-18 | 三元控股集团有限公司 | 一种基于光固化技术的多功能导电织物的制备方法 |
CN107090252A (zh) * | 2017-04-19 | 2017-08-25 | 无锡云亭石墨烯技术有限公司 | 一种石墨烯uv固化胶的制备及其复合加热玻璃的应用 |
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US5328087A (en) | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US5769996A (en) * | 1994-01-27 | 1998-06-23 | Loctite (Ireland) Limited | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
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JPH10502677A (ja) * | 1994-06-29 | 1998-03-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 異方性導電性の接着剤及び異方性導電性の接着剤の製造方法 |
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CN110256984A (zh) | 2019-09-20 |
JP2014506271A (ja) | 2014-03-13 |
WO2012081992A2 (en) | 2012-06-21 |
KR20130129235A (ko) | 2013-11-27 |
KR101892198B1 (ko) | 2018-08-27 |
CN113462316A (zh) | 2021-10-01 |
EP2652059A2 (en) | 2013-10-23 |
CN103517958A (zh) | 2014-01-15 |
WO2012081992A3 (en) | 2012-08-16 |
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