FI20011247A - Radiofrekvensmodul - Google Patents

Radiofrekvensmodul Download PDF

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Publication number
FI20011247A
FI20011247A FI20011247A FI20011247A FI20011247A FI 20011247 A FI20011247 A FI 20011247A FI 20011247 A FI20011247 A FI 20011247A FI 20011247 A FI20011247 A FI 20011247A FI 20011247 A FI20011247 A FI 20011247A
Authority
FI
Finland
Prior art keywords
radio frequency
frequency module
module
radio
frequency
Prior art date
Application number
FI20011247A
Other languages
English (en)
Finnish (fi)
Other versions
FI20011247A0 (sv
FI119582B (sv
Inventor
Toshifumi Oida
Takahiro Watanabe
Eigoro Ina
Norio Nakajima
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of FI20011247A0 publication Critical patent/FI20011247A0/sv
Publication of FI20011247A publication Critical patent/FI20011247A/sv
Application granted granted Critical
Publication of FI119582B publication Critical patent/FI119582B/sv

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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    • H01L2223/6688—Mixed frequency adaptations, i.e. for operation at different frequencies
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Signal Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transceivers (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FI20011247A 2000-06-20 2001-06-13 Radiofrekvensmodul FI119582B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000184046A JP3582460B2 (ja) 2000-06-20 2000-06-20 高周波モジュール
JP2000184046 2000-06-20

Publications (3)

Publication Number Publication Date
FI20011247A0 FI20011247A0 (sv) 2001-06-13
FI20011247A true FI20011247A (sv) 2001-12-21
FI119582B FI119582B (sv) 2008-12-31

Family

ID=18684534

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20011247A FI119582B (sv) 2000-06-20 2001-06-13 Radiofrekvensmodul

Country Status (7)

Country Link
US (1) US7245884B2 (sv)
JP (1) JP3582460B2 (sv)
DE (1) DE10129032A1 (sv)
FI (1) FI119582B (sv)
FR (1) FR2810495B1 (sv)
GB (1) GB2365629B (sv)
SE (1) SE522867C2 (sv)

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JP4043242B2 (ja) 2002-01-23 2008-02-06 アルプス電気株式会社 面実装型の電子回路ユニット
US20040001985A1 (en) * 2002-06-28 2004-01-01 Hydrogenics Corporation Fuel cell cooling system
EP1394857A3 (en) 2002-08-28 2004-04-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device
DE10256945A1 (de) * 2002-12-05 2004-06-17 Epcos Ag Elektronisches Bauelement mit mehreren Chips und Verfahren zur Herstellung
TWM248187U (en) * 2003-01-15 2004-10-21 Abocom Sys Inc Printed circuit board structure of RF transmission device
FR2852190B1 (fr) * 2003-03-03 2005-09-23 Procede de fabrication d'un composant ou d'un module electronique et composant ou module correspondant
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GB2365629A (en) 2002-02-20
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FI20011247A0 (sv) 2001-06-13
SE0102167L (sv) 2001-12-21
JP3582460B2 (ja) 2004-10-27
US20020049042A1 (en) 2002-04-25
US7245884B2 (en) 2007-07-17
GB2365629B (en) 2003-01-15
FR2810495A1 (fr) 2001-12-21
FI119582B (sv) 2008-12-31
SE522867C2 (sv) 2004-03-16
DE10129032A1 (de) 2002-01-10
SE0102167D0 (sv) 2001-06-19
FR2810495B1 (fr) 2006-12-29

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