FI121909B - Piirilevy ja menetelmä sen valmistamiseksi - Google Patents
Piirilevy ja menetelmä sen valmistamiseksi Download PDFInfo
- Publication number
- FI121909B FI121909B FI20085332A FI20085332A FI121909B FI 121909 B FI121909 B FI 121909B FI 20085332 A FI20085332 A FI 20085332A FI 20085332 A FI20085332 A FI 20085332A FI 121909 B FI121909 B FI 121909B
- Authority
- FI
- Finland
- Prior art keywords
- structural
- temporary
- electrical component
- circuit board
- component
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 34
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H05K1/00—Printed circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20085332A FI121909B (fi) | 2008-04-18 | 2008-04-18 | Piirilevy ja menetelmä sen valmistamiseksi |
CN2009801134848A CN102007825B (zh) | 2008-04-18 | 2009-04-06 | 一种线路板及其制造方法 |
JP2011504491A JP5551680B2 (ja) | 2008-04-18 | 2009-04-06 | 配線板およびその配線板を製造するための方法 |
PCT/FI2009/050256 WO2009127780A1 (en) | 2008-04-18 | 2009-04-06 | Wiring board and method for manufacturing the same |
EP09732413.1A EP2274962B1 (de) | 2008-04-18 | 2009-04-06 | Leiterplatte und verfahren zu ihrer herstellung |
US12/420,617 US8286341B2 (en) | 2008-04-18 | 2009-04-08 | Method of manufacturing a wiring board |
KR1020090033075A KR101260908B1 (ko) | 2008-04-18 | 2009-04-16 | 배선판 및 이의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FI20085332 | 2008-04-18 | ||
FI20085332A FI121909B (fi) | 2008-04-18 | 2008-04-18 | Piirilevy ja menetelmä sen valmistamiseksi |
Publications (2)
Publication Number | Publication Date |
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FI20085332A0 FI20085332A0 (de) | 2008-04-18 |
FI121909B true FI121909B (fi) | 2011-05-31 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FI20085332A FI121909B (fi) | 2008-04-18 | 2008-04-18 | Piirilevy ja menetelmä sen valmistamiseksi |
Country Status (7)
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US (1) | US8286341B2 (de) |
EP (1) | EP2274962B1 (de) |
JP (1) | JP5551680B2 (de) |
KR (1) | KR101260908B1 (de) |
CN (1) | CN102007825B (de) |
FI (1) | FI121909B (de) |
WO (1) | WO2009127780A1 (de) |
Families Citing this family (22)
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KR100796522B1 (ko) | 2006-09-05 | 2008-01-21 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판의 제조방법 |
WO2009145727A1 (en) * | 2008-05-28 | 2009-12-03 | Agency For Science, Technology And Research | A semiconductor structure and a method of manufacturing a semiconductor structure |
DE102009058764A1 (de) | 2009-12-15 | 2011-06-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe |
KR101055462B1 (ko) | 2010-01-07 | 2011-08-08 | 삼성전기주식회사 | 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법 |
US8735735B2 (en) | 2010-07-23 | 2014-05-27 | Ge Embedded Electronics Oy | Electronic module with embedded jumper conductor |
TWI446497B (zh) * | 2010-08-13 | 2014-07-21 | Unimicron Technology Corp | 嵌埋被動元件之封裝基板及其製法 |
KR101417264B1 (ko) * | 2012-04-25 | 2014-07-08 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
TWI463620B (zh) * | 2012-08-22 | 2014-12-01 | 矽品精密工業股份有限公司 | 封裝基板之製法 |
JP2014130856A (ja) * | 2012-12-28 | 2014-07-10 | Kyocer Slc Technologies Corp | 配線基板の製造方法 |
DE102013102542A1 (de) * | 2013-03-13 | 2014-09-18 | Schweizer Electronic Ag | Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils |
US9941229B2 (en) * | 2013-10-31 | 2018-04-10 | Infineon Technologies Ag | Device including semiconductor chips and method for producing such device |
US9922844B2 (en) | 2014-03-12 | 2018-03-20 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
CN104103529A (zh) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型方片级半导体三维芯片封装工艺 |
CN104103527B (zh) * | 2014-07-22 | 2017-10-24 | 华进半导体封装先导技术研发中心有限公司 | 一种改进的扇出型方片级半导体芯片封装工艺 |
CN104103528A (zh) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型方片级半导体芯片封装工艺 |
CN104103526B (zh) * | 2014-07-22 | 2017-10-24 | 华进半导体封装先导技术研发中心有限公司 | 一种改进的扇出型方片级三维半导体芯片封装工艺 |
WO2017026195A1 (ja) * | 2015-08-11 | 2017-02-16 | 株式会社村田製作所 | キャパシタ内蔵基板の製造方法 |
EP3206229B1 (de) | 2016-02-09 | 2020-10-07 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Verfahren zur herstellung von flexiblen elektronischen vorrichtungen |
EP3255665B1 (de) * | 2016-06-08 | 2022-01-12 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Elektronisches bauteil mit komponententräger und seine herstellung |
CN109637981B (zh) * | 2018-11-20 | 2021-10-12 | 奥特斯科技(重庆)有限公司 | 制造部件承载件的方法、部件承载件以及半制成产品 |
WO2021146894A1 (zh) * | 2020-01-21 | 2021-07-29 | 鹏鼎控股(深圳)股份有限公司 | 内埋电子元件的电路板及制作方法 |
CN111315158A (zh) * | 2020-03-27 | 2020-06-19 | 深圳市景旺电子股份有限公司 | 线路板制造方法及线路板 |
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US3739438A (en) * | 1970-02-25 | 1973-06-19 | Union Carbide Corp | System for molding electronic components |
US3650648A (en) * | 1970-02-25 | 1972-03-21 | Union Carbide Corp | System for molding electronic components |
JPH01248685A (ja) | 1988-03-30 | 1989-10-04 | Shin Kobe Electric Mach Co Ltd | 片面金属箔張積層板の製造法および片面印刷回路板の製造法 |
JPH07273424A (ja) * | 1994-03-29 | 1995-10-20 | Ibiden Co Ltd | 片面プリント配線板の製造方法 |
KR100302652B1 (ko) | 1998-09-11 | 2001-11-30 | 구자홍 | 플렉시블인쇄회로기판의제조방법및그방법으로생산한플렉시블인쇄회로기판 |
US6838750B2 (en) | 2001-07-12 | 2005-01-04 | Custom One Design, Inc. | Interconnect circuitry, multichip module, and methods of manufacturing thereof |
JP2004335641A (ja) * | 2003-05-06 | 2004-11-25 | Canon Inc | 半導体素子内蔵基板の製造方法 |
CN100524734C (zh) | 2003-09-09 | 2009-08-05 | 三洋电机株式会社 | 含有电路元件和绝缘膜的半导体模块及其制造方法以及其应用 |
JP4541763B2 (ja) | 2004-01-19 | 2010-09-08 | 新光電気工業株式会社 | 回路基板の製造方法 |
JP4575071B2 (ja) | 2004-08-02 | 2010-11-04 | 新光電気工業株式会社 | 電子部品内蔵基板の製造方法 |
JP4334005B2 (ja) * | 2005-12-07 | 2009-09-16 | 新光電気工業株式会社 | 配線基板の製造方法及び電子部品実装構造体の製造方法 |
JP2007173727A (ja) * | 2005-12-26 | 2007-07-05 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
US7353591B2 (en) * | 2006-04-18 | 2008-04-08 | Kinsus Interconnect Technology Corp. | Method of manufacturing coreless substrate |
-
2008
- 2008-04-18 FI FI20085332A patent/FI121909B/fi active IP Right Grant
-
2009
- 2009-04-06 CN CN2009801134848A patent/CN102007825B/zh active Active
- 2009-04-06 WO PCT/FI2009/050256 patent/WO2009127780A1/en active Application Filing
- 2009-04-06 EP EP09732413.1A patent/EP2274962B1/de active Active
- 2009-04-06 JP JP2011504491A patent/JP5551680B2/ja active Active
- 2009-04-08 US US12/420,617 patent/US8286341B2/en active Active
- 2009-04-16 KR KR1020090033075A patent/KR101260908B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2009127780A1 (en) | 2009-10-22 |
EP2274962A4 (de) | 2017-06-28 |
CN102007825B (zh) | 2013-05-08 |
JP2011517858A (ja) | 2011-06-16 |
JP5551680B2 (ja) | 2014-07-16 |
FI20085332A0 (de) | 2008-04-18 |
EP2274962A1 (de) | 2011-01-19 |
US20090260866A1 (en) | 2009-10-22 |
EP2274962B1 (de) | 2018-07-11 |
US8286341B2 (en) | 2012-10-16 |
KR101260908B1 (ko) | 2013-05-07 |
KR20090110790A (ko) | 2009-10-22 |
CN102007825A (zh) | 2011-04-06 |
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