FI114054B - LC-elementti, menetelmä LC-elementin käyttämiseksi ja piiri, joka käsittää LC-elementin - Google Patents
LC-elementti, menetelmä LC-elementin käyttämiseksi ja piiri, joka käsittää LC-elementin Download PDFInfo
- Publication number
- FI114054B FI114054B FI943504A FI943504A FI114054B FI 114054 B FI114054 B FI 114054B FI 943504 A FI943504 A FI 943504A FI 943504 A FI943504 A FI 943504A FI 114054 B FI114054 B FI 114054B
- Authority
- FI
- Finland
- Prior art keywords
- gate electrode
- channel
- electrode
- spiral
- gate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 57
- 239000004065 semiconductor Substances 0.000 claims description 37
- 238000009792 diffusion process Methods 0.000 claims description 24
- 230000008054 signal transmission Effects 0.000 claims description 22
- 239000000872 buffer Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 108091006146 Channels Proteins 0.000 description 156
- 238000004519 manufacturing process Methods 0.000 description 26
- 230000006870 function Effects 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 16
- 239000002800 charge carrier Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000012535 impurity Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 238000013016 damping Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000004044 response Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 108010078791 Carrier Proteins Proteins 0.000 description 1
- 229930186657 Lat Natural products 0.000 description 1
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 1
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000005316 response function Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0123—Frequency selective two-port networks comprising distributed impedance elements together with lumped impedance elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0064—Constructional details comprising semiconductor material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0071—Constructional details comprising zig-zag inductor
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0078—Constructional details comprising spiral inductor on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20362393 | 1993-07-26 | ||
| JP20362393 | 1993-07-26 | ||
| JP29428293 | 1993-10-29 | ||
| JP29428293 | 1993-10-29 | ||
| JP34147693 | 1993-12-10 | ||
| JP34147693A JP3597879B2 (ja) | 1993-10-29 | 1993-12-10 | Ｌｃ素子，半導体装置 |
| JP13363994 | 1994-05-24 | ||
| JP13363994A JP3474636B2 (ja) | 1993-07-26 | 1994-05-24 | Ｌｃ素子，半導体装置及びｌｃ素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI943504A0 FI943504A0 (fi) | 1994-07-26 |
| FI943504A FI943504A (fi) | 1995-01-27 |
| FI114054B true FI114054B (fi) | 2004-07-30 |
Family
ID=27471773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI943504A FI114054B (fi) | 1993-07-26 | 1994-07-26 | LC-elementti, menetelmä LC-elementin käyttämiseksi ja piiri, joka käsittää LC-elementin |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5500552A (zh) |
| EP (1) | EP0637842B1 (zh) |
| KR (1) | KR100299714B1 (zh) |
| CN (1) | CN1110096C (zh) |
| DE (1) | DE69430091T2 (zh) |
| FI (1) | FI114054B (zh) |
| TW (1) | TW250591B (zh) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2301706A (en) * | 1995-06-01 | 1996-12-11 | Plessey Semiconductors Ltd | Intergrated inductor arrangement |
| US5831331A (en) * | 1996-11-22 | 1998-11-03 | Philips Electronics North America Corporation | Self-shielding inductor for multi-layer semiconductor integrated circuits |
| US6885275B1 (en) | 1998-11-12 | 2005-04-26 | Broadcom Corporation | Multi-track integrated spiral inductor |
| GB2353139B (en) * | 1999-08-12 | 2001-08-29 | United Microelectronics Corp | Inductor and method of manufacturing the same |
| DE10232642B4 (de) * | 2002-07-18 | 2006-11-23 | Infineon Technologies Ag | Integrierte Transformatoranordnung |
| US7230316B2 (en) | 2002-12-27 | 2007-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having transferred integrated circuit |
| JP2004228188A (ja) * | 2003-01-21 | 2004-08-12 | Renesas Technology Corp | 半導体装置 |
| US7425485B2 (en) * | 2005-09-30 | 2008-09-16 | Freescale Semiconductor, Inc. | Method for forming microelectronic assembly |
| US20080251275A1 (en) * | 2007-04-12 | 2008-10-16 | Ralph Morrison | Decoupling Transmission Line |
| US8212155B1 (en) * | 2007-06-26 | 2012-07-03 | Wright Peter V | Integrated passive device |
| KR20090061974A (ko) * | 2007-12-12 | 2009-06-17 | 한국전자통신연구원 | 동작 주파수가 가변되는 자기장 강화 장치 |
| JP2010080926A (ja) * | 2008-08-29 | 2010-04-08 | Toshiba Lighting & Technology Corp | Ｌｅｄ点灯装置および照明器具 |
| KR102072803B1 (ko) * | 2013-04-12 | 2020-02-04 | 삼성디스플레이 주식회사 | 박막 반도체 장치 및 유기 발광 표시 장치 |
| US9461222B1 (en) * | 2015-06-30 | 2016-10-04 | Epistar Corporation | Light-emitting element and the light-emitting module thereof |
| US11164694B2 (en) * | 2019-09-27 | 2021-11-02 | Apple Inc. | Low-spurious electric-field inductor design |
| US11735519B2 (en) * | 2021-06-24 | 2023-08-22 | Xilinx, Inc. | In-package passive inductive element for reflection mitigation |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3504430A (en) * | 1966-06-27 | 1970-04-07 | Hitachi Ltd | Method of making semiconductor devices having insulating films |
| GB2103012A (en) * | 1981-07-03 | 1983-02-09 | Clarion Co Ltd | Variable capacitor |
| JPS594144A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
| US4619001A (en) * | 1983-08-02 | 1986-10-21 | Matsushita Electric Industrial Co., Ltd. | Tuning systems on dielectric substrates |
| US4737830A (en) * | 1986-01-08 | 1988-04-12 | Advanced Micro Devices, Inc. | Integrated circuit structure having compensating means for self-inductance effects |
| US4720467A (en) * | 1986-09-29 | 1988-01-19 | International Business Machines Corporation | Method of forming a capacitor-transistor integrated circuit |
| US4819047A (en) * | 1987-05-15 | 1989-04-04 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
| JP2732089B2 (ja) * | 1988-10-14 | 1998-03-25 | ローム株式会社 | 集積回路のコンデンサ形成方法 |
| US5136357A (en) * | 1989-06-26 | 1992-08-04 | Micron Technology, Inc. | Low-noise, area-efficient, high-frequency clock signal distribution line structure |
| JP3280019B2 (ja) * | 1989-10-26 | 2002-04-30 | 新潟精密株式会社 | Ｌｃノイズフィルタ |
| JPH03190302A (ja) * | 1989-12-19 | 1991-08-20 | Mitsubishi Electric Corp | 電界効果トランジスタを使用した共振回路 |
| US5227659A (en) * | 1990-06-08 | 1993-07-13 | Trustees Of Boston University | Integrated circuit inductor |
| JPH04326607A (ja) * | 1991-04-26 | 1992-11-16 | Sumitomo Electric Ind Ltd | 発振回路 |
| JP3045573B2 (ja) * | 1991-08-19 | 2000-05-29 | 北川工業株式会社 | 電子部品、コンデンサおよび３端子ノイズフィルタの製造方法 |
| US5431987A (en) * | 1992-11-04 | 1995-07-11 | Susumu Okamura | Noise filter |
| US5370766A (en) * | 1993-08-16 | 1994-12-06 | California Micro Devices | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices |
-
1994
- 1994-07-22 US US08/282,046 patent/US5500552A/en not_active Expired - Lifetime
- 1994-07-25 TW TW083106789A patent/TW250591B/zh active
- 1994-07-25 CN CN94114815A patent/CN1110096C/zh not_active Expired - Fee Related
- 1994-07-25 KR KR1019940017946A patent/KR100299714B1/ko not_active IP Right Cessation
- 1994-07-26 FI FI943504A patent/FI114054B/fi not_active IP Right Cessation
- 1994-07-26 EP EP94111622A patent/EP0637842B1/en not_active Expired - Lifetime
- 1994-07-26 DE DE69430091T patent/DE69430091T2/de not_active Expired - Fee Related
-
1995
- 1995-06-07 US US08/476,276 patent/US5846845A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69430091T2 (de) | 2002-10-31 |
| CN1110096C (zh) | 2003-05-28 |
| DE69430091D1 (de) | 2002-04-18 |
| FI943504A (fi) | 1995-01-27 |
| EP0637842B1 (en) | 2002-03-13 |
| EP0637842A1 (en) | 1995-02-08 |
| KR950004609A (ko) | 1995-02-18 |
| CN1110028A (zh) | 1995-10-11 |
| FI943504A0 (fi) | 1994-07-26 |
| US5500552A (en) | 1996-03-19 |
| US5846845A (en) | 1998-12-08 |
| KR100299714B1 (ko) | 2001-10-22 |
| TW250591B (zh) | 1995-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MA | Patent expired |