FI109054B - Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn - Google Patents

Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn Download PDF

Info

Publication number
FI109054B
FI109054B FI20001480A FI20001480A FI109054B FI 109054 B FI109054 B FI 109054B FI 20001480 A FI20001480 A FI 20001480A FI 20001480 A FI20001480 A FI 20001480A FI 109054 B FI109054 B FI 109054B
Authority
FI
Finland
Prior art keywords
circuit board
light
marking
exposure
pattern
Prior art date
Application number
FI20001480A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20001480A0 (fi
FI20001480A (fi
Inventor
Rauno Salmi
Original Assignee
Rauno Salmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rauno Salmi filed Critical Rauno Salmi
Publication of FI20001480A0 publication Critical patent/FI20001480A0/fi
Priority to FI20001480A priority Critical patent/FI109054B/fi
Priority to KR1020027017345A priority patent/KR20030025934A/ko
Priority to US10/312,203 priority patent/US20030175625A1/en
Priority to JP2002504532A priority patent/JP2004501518A/ja
Priority to AT01951725T priority patent/ATE382881T1/de
Priority to AU2001272581A priority patent/AU2001272581A1/en
Priority to CNB018113753A priority patent/CN1203371C/zh
Priority to EP01951725A priority patent/EP1297383B1/en
Priority to PCT/FI2001/000597 priority patent/WO2001098829A1/en
Priority to DE60132205T priority patent/DE60132205T2/de
Publication of FI20001480A publication Critical patent/FI20001480A/fi
Application granted granted Critical
Publication of FI109054B publication Critical patent/FI109054B/fi
Priority to HK03108917A priority patent/HK1056611A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C11/00—Auxiliary processes in photography
    • G03C11/02—Marking or applying text
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Heat Sensitive Colour Forming Recording (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Surgical Instruments (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Glass Compositions (AREA)
  • Making Paper Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FI20001480A 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn FI109054B (fi)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FI20001480A FI109054B (fi) 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn
CNB018113753A CN1203371C (zh) 2000-06-21 2001-06-21 用于给电路板做区别标记的方法
US10/312,203 US20030175625A1 (en) 2000-06-21 2001-06-21 Method for individualised marketing of circuit boards
JP2002504532A JP2004501518A (ja) 2000-06-21 2001-06-21 基盤を個別にマーキングするための方法
AT01951725T ATE382881T1 (de) 2000-06-21 2001-06-21 Individualisiertes markierungsverfahren für leiterplatten
AU2001272581A AU2001272581A1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards
KR1020027017345A KR20030025934A (ko) 2000-06-21 2001-06-21 회로기판의 개별적 마킹방법
EP01951725A EP1297383B1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards
PCT/FI2001/000597 WO2001098829A1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards
DE60132205T DE60132205T2 (de) 2000-06-21 2001-06-21 Individualisiertes markierungsverfahren für leiterplatten
HK03108917A HK1056611A1 (en) 2000-06-21 2003-12-09 A method for individualised marking of circuit boards.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20001480 2000-06-21
FI20001480A FI109054B (fi) 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn

Publications (3)

Publication Number Publication Date
FI20001480A0 FI20001480A0 (fi) 2000-06-21
FI20001480A FI20001480A (fi) 2001-12-22
FI109054B true FI109054B (fi) 2002-05-15

Family

ID=8558614

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20001480A FI109054B (fi) 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn

Country Status (11)

Country Link
US (1) US20030175625A1 (zh)
EP (1) EP1297383B1 (zh)
JP (1) JP2004501518A (zh)
KR (1) KR20030025934A (zh)
CN (1) CN1203371C (zh)
AT (1) ATE382881T1 (zh)
AU (1) AU2001272581A1 (zh)
DE (1) DE60132205T2 (zh)
FI (1) FI109054B (zh)
HK (1) HK1056611A1 (zh)
WO (1) WO2001098829A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK176229B1 (da) * 2002-06-18 2007-03-26 Photosolar Aps Optisk element til afskærmning af lys
JP4565916B2 (ja) * 2004-07-23 2010-10-20 三洋電機株式会社 光反応装置
US8492072B2 (en) * 2009-04-30 2013-07-23 Infineon Technologies Ag Method for marking objects
CN103324037B (zh) * 2013-07-04 2015-01-07 北京京东方光电科技有限公司 一种曝光装置及其曝光方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694081A (en) * 1970-02-11 1972-09-26 Pek Inc Method and apparatus for contact printing
DE3147994A1 (de) * 1981-12-04 1983-06-16 Fa. Georg Rothkegel, 5140 Erkelenz "verfahren zur herstellung von ordnungs- oder organisationskennzeichen"
JPS6172216A (ja) * 1984-09-17 1986-04-14 Shinku Lab:Kk 露光方法
JPS6454455A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Aligner
JPH0189771U (zh) * 1987-12-04 1989-06-13
US4853317A (en) * 1988-04-04 1989-08-01 Microfab Technologies, Inc. Method and apparatus for serializing printed circuit boards and flex circuits
JPH03239552A (ja) * 1990-02-15 1991-10-25 Matsushita Electric Works Ltd プリント配線板への印字方法
JPH04359588A (ja) * 1991-06-06 1992-12-11 Mitsubishi Electric Corp プリント配線板の製造方法
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
JPH06255232A (ja) * 1991-09-11 1994-09-13 Cmk Corp プリント配線板の製造方法
JPH10112579A (ja) * 1996-10-07 1998-04-28 M S Tec:Kk レジスト露光方法及びその露光装置
JPH10230382A (ja) * 1997-02-21 1998-09-02 Fuji Print Kogyo Kk プリント基板のダイレクト描画方法
US6251550B1 (en) * 1998-07-10 2001-06-26 Ball Semiconductor, Inc. Maskless photolithography system that digitally shifts mask data responsive to alignment data

Also Published As

Publication number Publication date
ATE382881T1 (de) 2008-01-15
CN1437713A (zh) 2003-08-20
DE60132205T2 (de) 2008-12-18
HK1056611A1 (en) 2004-02-20
JP2004501518A (ja) 2004-01-15
EP1297383B1 (en) 2008-01-02
WO2001098829A1 (en) 2001-12-27
AU2001272581A1 (en) 2002-01-02
US20030175625A1 (en) 2003-09-18
EP1297383A1 (en) 2003-04-02
KR20030025934A (ko) 2003-03-29
FI20001480A0 (fi) 2000-06-21
DE60132205D1 (de) 2008-02-14
CN1203371C (zh) 2005-05-25
FI20001480A (fi) 2001-12-22

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