HK1056611A1 - A method for individualised marking of circuit boards. - Google Patents

A method for individualised marking of circuit boards.

Info

Publication number
HK1056611A1
HK1056611A1 HK03108917A HK03108917A HK1056611A1 HK 1056611 A1 HK1056611 A1 HK 1056611A1 HK 03108917 A HK03108917 A HK 03108917A HK 03108917 A HK03108917 A HK 03108917A HK 1056611 A1 HK1056611 A1 HK 1056611A1
Authority
HK
Hong Kong
Prior art keywords
individualised
marking
circuit boards
blanks
manufacture
Prior art date
Application number
HK03108917A
Other languages
English (en)
Inventor
Rauno Salmi
Original Assignee
Rauno Salmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rauno Salmi filed Critical Rauno Salmi
Publication of HK1056611A1 publication Critical patent/HK1056611A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C11/00—Auxiliary processes in photography
    • G03C11/02—Marking or applying text
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0551—Exposure mask directly printed on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Heat Sensitive Colour Forming Recording (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Glass Compositions (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Surgical Instruments (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Making Paper Articles (AREA)
HK03108917A 2000-06-21 2003-12-09 A method for individualised marking of circuit boards. HK1056611A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20001480A FI109054B (fi) 2000-06-21 2000-06-21 Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn
PCT/FI2001/000597 WO2001098829A1 (en) 2000-06-21 2001-06-21 A method for individualised marking of circuit boards

Publications (1)

Publication Number Publication Date
HK1056611A1 true HK1056611A1 (en) 2004-02-20

Family

ID=8558614

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03108917A HK1056611A1 (en) 2000-06-21 2003-12-09 A method for individualised marking of circuit boards.

Country Status (11)

Country Link
US (1) US20030175625A1 (zh)
EP (1) EP1297383B1 (zh)
JP (1) JP2004501518A (zh)
KR (1) KR20030025934A (zh)
CN (1) CN1203371C (zh)
AT (1) ATE382881T1 (zh)
AU (1) AU2001272581A1 (zh)
DE (1) DE60132205T2 (zh)
FI (1) FI109054B (zh)
HK (1) HK1056611A1 (zh)
WO (1) WO2001098829A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK176229B1 (da) * 2002-06-18 2007-03-26 Photosolar Aps Optisk element til afskærmning af lys
JP4565916B2 (ja) * 2004-07-23 2010-10-20 三洋電機株式会社 光反応装置
US8492072B2 (en) * 2009-04-30 2013-07-23 Infineon Technologies Ag Method for marking objects
CN103324037B (zh) 2013-07-04 2015-01-07 北京京东方光电科技有限公司 一种曝光装置及其曝光方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694081A (en) * 1970-02-11 1972-09-26 Pek Inc Method and apparatus for contact printing
DE3147994A1 (de) * 1981-12-04 1983-06-16 Fa. Georg Rothkegel, 5140 Erkelenz "verfahren zur herstellung von ordnungs- oder organisationskennzeichen"
JPS6172216A (ja) * 1984-09-17 1986-04-14 Shinku Lab:Kk 露光方法
JPS6454455A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Aligner
JPH0189771U (zh) * 1987-12-04 1989-06-13
US4853317A (en) * 1988-04-04 1989-08-01 Microfab Technologies, Inc. Method and apparatus for serializing printed circuit boards and flex circuits
JPH03239552A (ja) * 1990-02-15 1991-10-25 Matsushita Electric Works Ltd プリント配線板への印字方法
JPH04359588A (ja) * 1991-06-06 1992-12-11 Mitsubishi Electric Corp プリント配線板の製造方法
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
JPH06255232A (ja) * 1991-09-11 1994-09-13 Cmk Corp プリント配線板の製造方法
JPH10112579A (ja) * 1996-10-07 1998-04-28 M S Tec:Kk レジスト露光方法及びその露光装置
JPH10230382A (ja) * 1997-02-21 1998-09-02 Fuji Print Kogyo Kk プリント基板のダイレクト描画方法
US6251550B1 (en) * 1998-07-10 2001-06-26 Ball Semiconductor, Inc. Maskless photolithography system that digitally shifts mask data responsive to alignment data

Also Published As

Publication number Publication date
DE60132205D1 (de) 2008-02-14
AU2001272581A1 (en) 2002-01-02
EP1297383B1 (en) 2008-01-02
KR20030025934A (ko) 2003-03-29
CN1203371C (zh) 2005-05-25
CN1437713A (zh) 2003-08-20
FI109054B (fi) 2002-05-15
FI20001480A0 (fi) 2000-06-21
FI20001480A (fi) 2001-12-22
WO2001098829A1 (en) 2001-12-27
DE60132205T2 (de) 2008-12-18
EP1297383A1 (en) 2003-04-02
ATE382881T1 (de) 2008-01-15
US20030175625A1 (en) 2003-09-18
JP2004501518A (ja) 2004-01-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110621