MXPA04004816A - Metodo de fabricacion de modulo que consta al menos de un componente electronico. - Google Patents

Metodo de fabricacion de modulo que consta al menos de un componente electronico.

Info

Publication number
MXPA04004816A
MXPA04004816A MXPA04004816A MXPA04004816A MXPA04004816A MX PA04004816 A MXPA04004816 A MX PA04004816A MX PA04004816 A MXPA04004816 A MX PA04004816A MX PA04004816 A MXPA04004816 A MX PA04004816A MX PA04004816 A MXPA04004816 A MX PA04004816A
Authority
MX
Mexico
Prior art keywords
electronic component
frame
making
module
binder
Prior art date
Application number
MXPA04004816A
Other languages
English (en)
Inventor
Droz Francois
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of MXPA04004816A publication Critical patent/MXPA04004816A/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

La presente invencion proporciona un procedimiento de fabricacion de modulos electronicos poco costosos que son apropiados para una produccion a gran escala. Este objetivo se alcanza por un procedimiento de fabricacion de un modulo electronico que comprende al menos un componente electronico (4) y una capa formada por un aglomerante, el componente electronico (4) presenta una cara aparente en la superficie del modulo, caracterizado porque un marco (3) se coloca sobre una hoja de proteccion (2) dispuesta sobre una placa de base (1). Al menos un componente electronico (4) se coloca despues sobre la hoja de proteccion (2) y en interior del marco (3). Una placa de prensado (6) se apoya sobre la periferia del marco (3) antes de la introduccion de un aglomerante a traves de orificios (5) perforados en el marco (3). Este aglomerante envuelve el componente electronico (4) llenado el espacio definido por el marco (3), la hoja de proteccion (2) y la placa de prensado (6). Despues de la solidificacion del aglomerante, se quita la placa base (1) y la placa de prensado (6).
MXPA04004816A 2001-11-23 2002-11-21 Metodo de fabricacion de modulo que consta al menos de un componente electronico. MXPA04004816A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH21612001 2001-11-23
PCT/IB2002/004936 WO2003044733A1 (fr) 2001-11-23 2002-11-21 Methode de fabrication d'un module comprenant au moins un composant electronique

Publications (1)

Publication Number Publication Date
MXPA04004816A true MXPA04004816A (es) 2004-08-11

Family

ID=4567767

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA04004816A MXPA04004816A (es) 2001-11-23 2002-11-21 Metodo de fabricacion de modulo que consta al menos de un componente electronico.

Country Status (15)

Country Link
US (1) US20050019989A1 (es)
EP (1) EP1451771B1 (es)
JP (1) JP2005531126A (es)
KR (1) KR20050044323A (es)
CN (1) CN1585960A (es)
AR (1) AR037401A1 (es)
AT (1) ATE302449T1 (es)
AU (1) AU2002347492A1 (es)
BR (1) BR0214395A (es)
CA (1) CA2467815A1 (es)
DE (1) DE60205655D1 (es)
MX (1) MXPA04004816A (es)
RU (1) RU2004117773A (es)
TW (1) TW200300597A (es)
WO (1) WO2003044733A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029985C2 (nl) * 2005-09-20 2007-03-21 Sdu Identification Bv Identiteitsdocument met chip.
ATE438155T1 (de) 2005-09-22 2009-08-15 Gemalto Oy Smartcard mit transparentem rand und herstellungsverfahren hierfür
PL2036007T3 (pl) * 2006-06-19 2013-06-28 Nagravision Sa Sposób wytwarzania kart, z których każda zawiera moduł elektroniczny i produkty pośrednie
AU2007263133B2 (en) * 2006-06-19 2012-04-05 Nagravision S.A. Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product
US20080109309A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Print Advertisements, Product Packaging, and Trading Cards
CA2703805A1 (en) * 2006-10-31 2008-05-08 Solicore, Inc. Powered authenticating cards
JP4860436B2 (ja) 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
US8208262B2 (en) 2006-11-07 2012-06-26 Toppan Forms Co., Ltd. Window base material, card with embedded module, and manufacturing method of card with embedded module
JP4860437B2 (ja) * 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 モジュール内蔵型カード
WO2008082617A2 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
CA2678157C (en) 2007-02-09 2014-04-01 Nagraid S.A. Method of fabricating electronic cards including at least one printed pattern
WO2009000636A1 (fr) * 2007-06-26 2008-12-31 Nagraid S.A. Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire
DE102009009263A1 (de) * 2009-02-17 2010-08-19 Giesecke & Devrient Gmbh Verfahren zur Herstellung einer ein Fenster enthaltenden Abschlußschicht für einen tragbaren Datenträger und Abschlußschicht
CN102815657B (zh) * 2011-06-08 2015-10-21 上海巨哥电子科技有限公司 一种封装结构及其封装方法
US11395411B2 (en) * 2018-03-12 2022-07-19 Jumatech Gmbh Method for producing a printed circuit board using a mould for conductor elements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
JPH04138296A (ja) * 1990-09-29 1992-05-12 Mitsubishi Electric Corp 薄形半導体装置
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JP3199963B2 (ja) * 1994-10-06 2001-08-20 株式会社東芝 半導体装置の製造方法
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
US5819394A (en) * 1995-02-22 1998-10-13 Transition Automation, Inc. Method of making board matched nested support fixture
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
US6256873B1 (en) * 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials

Also Published As

Publication number Publication date
WO2003044733A1 (fr) 2003-05-30
AR037401A1 (es) 2004-11-10
RU2004117773A (ru) 2005-06-10
AU2002347492A1 (en) 2003-06-10
ATE302449T1 (de) 2005-09-15
US20050019989A1 (en) 2005-01-27
TW200300597A (en) 2003-06-01
JP2005531126A (ja) 2005-10-13
CN1585960A (zh) 2005-02-23
EP1451771B1 (fr) 2005-08-17
KR20050044323A (ko) 2005-05-12
EP1451771A1 (fr) 2004-09-01
CA2467815A1 (en) 2003-05-30
DE60205655D1 (de) 2005-09-22
BR0214395A (pt) 2004-11-03

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