AR037401A1 - Metodo de fabricacion de un modulo electronico que comprende al menos un componente electronico y una capa formada por un aglomerante - Google Patents

Metodo de fabricacion de un modulo electronico que comprende al menos un componente electronico y una capa formada por un aglomerante

Info

Publication number
AR037401A1
AR037401A1 ARP020104491A ARP020104491A AR037401A1 AR 037401 A1 AR037401 A1 AR 037401A1 AR P020104491 A ARP020104491 A AR P020104491A AR P020104491 A ARP020104491 A AR P020104491A AR 037401 A1 AR037401 A1 AR 037401A1
Authority
AR
Argentina
Prior art keywords
binder
electronic component
frame
electronic
manufacture
Prior art date
Application number
ARP020104491A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of AR037401A1 publication Critical patent/AR037401A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Un método de fabricación de módulos electrónicos poco costosos que son apropiados para una producción a gran escala. Este objetivo es alcanzado por un método de fabricación de un módulo electrónico que comprende al menos un componente electrónico (4) y una capa formada por un aglomerante, el componente, electrónico (4) presenta una cara aparente en la superficie del módulo, en donde un marco (3) es colocado sobre una hoja de protección (2) dispuesta sobre una placa base (1). Al menos un componente electrónico (4) es después colocado sobre la hoja de protección (2) y en el interior del marco (3) Una placa de prensado (6) es apoyada sobre la periferia del marco (3) antes de la introducción de un aglomerante a través de orificios (5) perforados en el marco (3). Este aglomerante envuelve el componente electrónico (4) llenando el espacio definido por el marco (3), la hoja de protección (2) y la placa de prensado (6) Después de la solidificación del aglomerante, se quita la placa base (1) y la placa de prensado (6).
ARP020104491A 2001-11-23 2002-11-22 Metodo de fabricacion de un modulo electronico que comprende al menos un componente electronico y una capa formada por un aglomerante AR037401A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH21612001 2001-11-23

Publications (1)

Publication Number Publication Date
AR037401A1 true AR037401A1 (es) 2004-11-10

Family

ID=4567767

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP020104491A AR037401A1 (es) 2001-11-23 2002-11-22 Metodo de fabricacion de un modulo electronico que comprende al menos un componente electronico y una capa formada por un aglomerante

Country Status (15)

Country Link
US (1) US20050019989A1 (es)
EP (1) EP1451771B1 (es)
JP (1) JP2005531126A (es)
KR (1) KR20050044323A (es)
CN (1) CN1585960A (es)
AR (1) AR037401A1 (es)
AT (1) ATE302449T1 (es)
AU (1) AU2002347492A1 (es)
BR (1) BR0214395A (es)
CA (1) CA2467815A1 (es)
DE (1) DE60205655D1 (es)
MX (1) MXPA04004816A (es)
RU (1) RU2004117773A (es)
TW (1) TW200300597A (es)
WO (1) WO2003044733A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029985C2 (nl) * 2005-09-20 2007-03-21 Sdu Identification Bv Identiteitsdocument met chip.
EP1770608B1 (en) 2005-09-22 2009-07-29 Gemalto Oy Smartcard with transparent rim and a method of producing the same
JP5059854B2 (ja) * 2006-06-19 2012-10-31 ナグライデ・エス アー 電子モジュールおよび中間製品を含むカードの製造方法
ES2537081T3 (es) * 2006-06-19 2015-06-02 Nagravision S.A. Procedimiento de fabricación de tarjetas que comprenden por lo menos un módulo electrónico, conjunto que interviene en este procedimiento y producto intermedio
US20080109309A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Print Advertisements, Product Packaging, and Trading Cards
US20080105751A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Authenticating Cards
JP4860437B2 (ja) * 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 モジュール内蔵型カード
JP4860436B2 (ja) * 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
EP2085914B1 (en) 2006-11-07 2014-03-12 Toppan Forms Co., Ltd. Window base material, card having module housed therein, and method for manufacturing card having module housed therein
WO2008082617A2 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
MX2009007905A (es) * 2007-02-09 2009-07-31 Nagraid Sa Metodo para producir tarjetas electronicas que incluyen al menos un patron impreso.
WO2009000636A1 (fr) * 2007-06-26 2008-12-31 Nagraid S.A. Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire
DE102009009263A1 (de) * 2009-02-17 2010-08-19 Giesecke & Devrient Gmbh Verfahren zur Herstellung einer ein Fenster enthaltenden Abschlußschicht für einen tragbaren Datenträger und Abschlußschicht
CN102815657B (zh) * 2011-06-08 2015-10-21 上海巨哥电子科技有限公司 一种封装结构及其封装方法
WO2019175090A1 (de) * 2018-03-12 2019-09-19 Jumatech Gmbh Verfahren zur herstellung einer leiterplatte unter verwendung einer form für leiterelemente

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
JPH04138296A (ja) * 1990-09-29 1992-05-12 Mitsubishi Electric Corp 薄形半導体装置
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JP3199963B2 (ja) * 1994-10-06 2001-08-20 株式会社東芝 半導体装置の製造方法
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
US5819394A (en) * 1995-02-22 1998-10-13 Transition Automation, Inc. Method of making board matched nested support fixture
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
US6256873B1 (en) * 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials

Also Published As

Publication number Publication date
MXPA04004816A (es) 2004-08-11
DE60205655D1 (de) 2005-09-22
US20050019989A1 (en) 2005-01-27
AU2002347492A1 (en) 2003-06-10
TW200300597A (en) 2003-06-01
CA2467815A1 (en) 2003-05-30
WO2003044733A1 (fr) 2003-05-30
EP1451771A1 (fr) 2004-09-01
JP2005531126A (ja) 2005-10-13
RU2004117773A (ru) 2005-06-10
ATE302449T1 (de) 2005-09-15
EP1451771B1 (fr) 2005-08-17
CN1585960A (zh) 2005-02-23
BR0214395A (pt) 2004-11-03
KR20050044323A (ko) 2005-05-12

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