PL2036007T3 - Sposób wytwarzania kart, z których każda zawiera moduł elektroniczny i produkty pośrednie - Google Patents

Sposób wytwarzania kart, z których każda zawiera moduł elektroniczny i produkty pośrednie

Info

Publication number
PL2036007T3
PL2036007T3 PL07729900T PL07729900T PL2036007T3 PL 2036007 T3 PL2036007 T3 PL 2036007T3 PL 07729900 T PL07729900 T PL 07729900T PL 07729900 T PL07729900 T PL 07729900T PL 2036007 T3 PL2036007 T3 PL 2036007T3
Authority
PL
Poland
Prior art keywords
electronic module
intermediate products
producing cards
cards
producing
Prior art date
Application number
PL07729900T
Other languages
English (en)
Inventor
François Droz
Original Assignee
Nagravision Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagravision Sa filed Critical Nagravision Sa
Publication of PL2036007T3 publication Critical patent/PL2036007T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
PL07729900T 2006-06-19 2007-06-05 Sposób wytwarzania kart, z których każda zawiera moduł elektroniczny i produkty pośrednie PL2036007T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06012550 2006-06-19
EP07729900A EP2036007B1 (fr) 2006-06-19 2007-06-05 Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires
PCT/EP2007/055520 WO2007147727A1 (fr) 2006-06-19 2007-06-05 Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires

Publications (1)

Publication Number Publication Date
PL2036007T3 true PL2036007T3 (pl) 2013-06-28

Family

ID=37450917

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07729900T PL2036007T3 (pl) 2006-06-19 2007-06-05 Sposób wytwarzania kart, z których każda zawiera moduł elektroniczny i produkty pośrednie

Country Status (14)

Country Link
US (3) US8733662B2 (pl)
EP (1) EP2036007B1 (pl)
JP (1) JP5059854B2 (pl)
KR (2) KR101175830B1 (pl)
CN (2) CN101490702B (pl)
AU (1) AU2007263131B2 (pl)
CA (1) CA2654878C (pl)
ES (1) ES2402781T3 (pl)
MX (1) MX2008016267A (pl)
PL (1) PL2036007T3 (pl)
PT (1) PT2036007E (pl)
SG (1) SG172718A1 (pl)
SI (1) SI2036007T1 (pl)
WO (1) WO2007147727A1 (pl)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2959581B1 (fr) 2010-04-28 2012-08-17 Arjowiggins Security Insert fibreux constitue en une seule couche et equipe d'un dispositif electronique a communication sans contact.
FR2966317B1 (fr) * 2010-10-18 2013-08-09 Archos Appareil electronique a accessoire amovible.
EP2644376B1 (fr) * 2012-03-26 2015-03-04 Nagravision S.A. Carte incorporant un objet de valeur visible et son procédé de fabrication
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
KR101303861B1 (ko) * 2012-07-03 2013-09-04 김희숙 디스플레이카드의 가공방법
EP2973236B1 (en) 2013-03-15 2019-01-09 X-Card Holdings, LLC Methods of making a core layer for an information carrying card, and resulting products
US10773503B2 (en) * 2013-08-21 2020-09-15 X-Card Holdings, Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products
JP2016048492A (ja) * 2014-08-28 2016-04-07 トッパン・フォームズ株式会社 情報媒体
KR101658033B1 (ko) * 2015-07-10 2016-09-30 룩씨스 주식회사 칩형 전자부품의 하드코팅 제조방법
CN105538949B (zh) * 2015-12-15 2017-07-07 深圳神盾卫民警用设备有限公司 临时身份证制作机
FR3045891A1 (fr) * 2015-12-22 2017-06-23 Oberthur Technologies Procede de fabrication par lamination a chaud d'une carte a microcircuit comportant un flex dans une cavite et carte ainsi obtenue
USD868888S1 (en) 2016-03-03 2019-12-03 Fine Swiss Metals Ag Transaction card
CN107273962B (zh) * 2016-06-15 2021-08-06 苏州海博智能系统有限公司 智能卡中料制作方法及中料结构
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
CN109564634B (zh) 2016-07-27 2026-04-14 安全创造有限责任公司 用于交易卡的经包覆模制的电子部件及其制造方法
FR3061406B1 (fr) * 2016-12-23 2019-05-31 Idemia France Procede de fabrication d'une couche centrale d'une carte a microcircuit
NZ762589A (en) 2017-09-07 2022-05-27 Composecure Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
JP6831821B2 (ja) 2017-10-02 2021-02-17 エンゼルプレイングカード株式会社 プレイングカード
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
WO2019127371A1 (zh) * 2017-12-29 2019-07-04 林武旭 电子模组预备层及其制造方法
WO2020075958A1 (ko) * 2018-10-11 2020-04-16 코나아이 주식회사 전자 카드 및 전자 카드 제조 방법
KR102138682B1 (ko) * 2019-06-12 2020-07-28 (주)비티비엘 양품율을 향상시킨 스마트카드의 제조방법 및 그 스마트카드
KR102138684B1 (ko) * 2019-07-03 2020-07-28 (주)비티비엘 향상된 평탄도를 갖는 스마트카드의 제조방법 및 그 스마트카드
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2625000B1 (fr) * 1987-12-22 1991-08-16 Sgs Thomson Microelectronics Structure de carte a puce
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
US6817532B2 (en) * 1992-02-12 2004-11-16 Lenscard U.S., Llc Wallet card with built-in light
FR2691563B1 (fr) 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
GB2309933B (en) * 1996-02-12 2000-02-23 Plessey Telecomm Contact card
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
JPH10244792A (ja) * 1997-03-06 1998-09-14 Isel Kk 非接触型ｉｃカード
JPH11296646A (ja) * 1998-04-07 1999-10-29 Dainippon Printing Co Ltd Ｉｃカードおよびｉｃカードの作成方法
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
US7093767B2 (en) * 1999-09-07 2006-08-22 American Express Travel Related Services Company, Inc. System and method for manufacturing a punch-out RFID transaction device
JP2002279384A (ja) * 2001-03-19 2002-09-27 Toshiba Corp 携帯可能電子媒体及びその製造方法
AU2002337402B2 (en) * 2001-09-18 2007-08-16 Nagravision S.A. Thin electronic label and method for making same
RU2004117773A (ru) * 2001-11-23 2005-06-10 Награид Са (Ch) Способ изготовления модуля, содержащего, по меньшей мере, один электронный компонент
AU2002364255A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
AU2002361855A1 (en) * 2001-12-24 2003-07-15 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
US6851617B2 (en) 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
JP4109039B2 (ja) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
US20040144472A1 (en) 2003-01-24 2004-07-29 G & D Cardtech, Inc. Process for manufacturing laminated plastic products
NL1022766C2 (nl) 2003-02-24 2004-09-21 Enschede Sdu Bv Identiteitskaart alsmede reisdocument.
MY148205A (en) 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP2005011190A (ja) * 2003-06-20 2005-01-13 Fuji Xerox Co Ltd 表示機能付き情報媒体及び表示機能付き情報媒体の製造方法
WO2005062388A1 (en) * 2003-12-19 2005-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP4829529B2 (ja) * 2005-04-28 2011-12-07 株式会社小森コーポレーション 印刷機
CN100386897C (zh) * 2005-05-31 2008-05-07 李锋 一种发光二极管支架的制作方法

Also Published As

Publication number Publication date
SG172718A1 (en) 2011-07-28
AU2007263131A1 (en) 2007-12-27
KR20090018847A (ko) 2009-02-23
MX2008016267A (es) 2009-03-31
US20160132762A1 (en) 2016-05-12
JP2010501910A (ja) 2010-01-21
EP2036007B1 (fr) 2013-01-16
CN101490702A (zh) 2009-07-22
JP5059854B2 (ja) 2012-10-31
US9471867B2 (en) 2016-10-18
SI2036007T1 (sl) 2013-05-31
AU2007263131B2 (en) 2012-02-16
WO2007147727A1 (fr) 2007-12-27
CA2654878A1 (en) 2007-12-27
CA2654878C (en) 2014-09-02
CN101490702B (zh) 2013-07-17
PT2036007E (pt) 2013-04-11
EP2036007A1 (fr) 2009-03-18
CN101473338A (zh) 2009-07-01
ES2402781T3 (es) 2013-05-08
KR20090024210A (ko) 2009-03-06
US20120206869A1 (en) 2012-08-16
CN101473338B (zh) 2012-06-06
KR101175830B1 (ko) 2012-08-24
HK1135496A1 (en) 2010-06-04
US8733662B2 (en) 2014-05-27
US20100012731A1 (en) 2010-01-21
KR101174182B1 (ko) 2012-08-20

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