FI20001480A0 - Menetelmä merkinnän tekemiseksi - Google Patents
Menetelmä merkinnän tekemiseksiInfo
- Publication number
- FI20001480A0 FI20001480A0 FI20001480A FI20001480A FI20001480A0 FI 20001480 A0 FI20001480 A0 FI 20001480A0 FI 20001480 A FI20001480 A FI 20001480A FI 20001480 A FI20001480 A FI 20001480A FI 20001480 A0 FI20001480 A0 FI 20001480A0
- Authority
- FI
- Finland
- Prior art keywords
- blanks
- manufacture
- marking procedure
- marking
- individualising
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C11/00—Auxiliary processes in photography
- G03C11/02—Marking or applying text
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0551—Exposure mask directly printed on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Heat Sensitive Colour Forming Recording (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Surgical Instruments (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Glass Compositions (AREA)
- Making Paper Articles (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001480A FI109054B (fi) | 2000-06-21 | 2000-06-21 | Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn |
CNB018113753A CN1203371C (zh) | 2000-06-21 | 2001-06-21 | 用于给电路板做区别标记的方法 |
US10/312,203 US20030175625A1 (en) | 2000-06-21 | 2001-06-21 | Method for individualised marketing of circuit boards |
JP2002504532A JP2004501518A (ja) | 2000-06-21 | 2001-06-21 | 基盤を個別にマーキングするための方法 |
AT01951725T ATE382881T1 (de) | 2000-06-21 | 2001-06-21 | Individualisiertes markierungsverfahren für leiterplatten |
AU2001272581A AU2001272581A1 (en) | 2000-06-21 | 2001-06-21 | A method for individualised marking of circuit boards |
KR1020027017345A KR20030025934A (ko) | 2000-06-21 | 2001-06-21 | 회로기판의 개별적 마킹방법 |
EP01951725A EP1297383B1 (en) | 2000-06-21 | 2001-06-21 | A method for individualised marking of circuit boards |
PCT/FI2001/000597 WO2001098829A1 (en) | 2000-06-21 | 2001-06-21 | A method for individualised marking of circuit boards |
DE60132205T DE60132205T2 (de) | 2000-06-21 | 2001-06-21 | Individualisiertes markierungsverfahren für leiterplatten |
HK03108917A HK1056611A1 (en) | 2000-06-21 | 2003-12-09 | A method for individualised marking of circuit boards. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001480 | 2000-06-21 | ||
FI20001480A FI109054B (fi) | 2000-06-21 | 2000-06-21 | Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20001480A0 true FI20001480A0 (fi) | 2000-06-21 |
FI20001480A FI20001480A (fi) | 2001-12-22 |
FI109054B FI109054B (fi) | 2002-05-15 |
Family
ID=8558614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20001480A FI109054B (fi) | 2000-06-21 | 2000-06-21 | Menetelmä yksilöivän merkinnän tekemiseksi piirilevyyn |
Country Status (11)
Country | Link |
---|---|
US (1) | US20030175625A1 (fi) |
EP (1) | EP1297383B1 (fi) |
JP (1) | JP2004501518A (fi) |
KR (1) | KR20030025934A (fi) |
CN (1) | CN1203371C (fi) |
AT (1) | ATE382881T1 (fi) |
AU (1) | AU2001272581A1 (fi) |
DE (1) | DE60132205T2 (fi) |
FI (1) | FI109054B (fi) |
HK (1) | HK1056611A1 (fi) |
WO (1) | WO2001098829A1 (fi) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK176229B1 (da) * | 2002-06-18 | 2007-03-26 | Photosolar Aps | Optisk element til afskærmning af lys |
JP4565916B2 (ja) * | 2004-07-23 | 2010-10-20 | 三洋電機株式会社 | 光反応装置 |
US8492072B2 (en) * | 2009-04-30 | 2013-07-23 | Infineon Technologies Ag | Method for marking objects |
CN103324037B (zh) * | 2013-07-04 | 2015-01-07 | 北京京东方光电科技有限公司 | 一种曝光装置及其曝光方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694081A (en) * | 1970-02-11 | 1972-09-26 | Pek Inc | Method and apparatus for contact printing |
DE3147994A1 (de) * | 1981-12-04 | 1983-06-16 | Fa. Georg Rothkegel, 5140 Erkelenz | "verfahren zur herstellung von ordnungs- oder organisationskennzeichen" |
JPS6172216A (ja) * | 1984-09-17 | 1986-04-14 | Shinku Lab:Kk | 露光方法 |
JPS6454455A (en) * | 1987-08-25 | 1989-03-01 | Mitsubishi Electric Corp | Aligner |
JPH0189771U (fi) * | 1987-12-04 | 1989-06-13 | ||
US4853317A (en) * | 1988-04-04 | 1989-08-01 | Microfab Technologies, Inc. | Method and apparatus for serializing printed circuit boards and flex circuits |
JPH03239552A (ja) * | 1990-02-15 | 1991-10-25 | Matsushita Electric Works Ltd | プリント配線板への印字方法 |
JPH04359588A (ja) * | 1991-06-06 | 1992-12-11 | Mitsubishi Electric Corp | プリント配線板の製造方法 |
CA2075026A1 (en) * | 1991-08-08 | 1993-02-09 | William E. Nelson | Method and apparatus for patterning an imaging member |
JPH06255232A (ja) * | 1991-09-11 | 1994-09-13 | Cmk Corp | プリント配線板の製造方法 |
JPH10112579A (ja) * | 1996-10-07 | 1998-04-28 | M S Tec:Kk | レジスト露光方法及びその露光装置 |
JPH10230382A (ja) * | 1997-02-21 | 1998-09-02 | Fuji Print Kogyo Kk | プリント基板のダイレクト描画方法 |
US6251550B1 (en) * | 1998-07-10 | 2001-06-26 | Ball Semiconductor, Inc. | Maskless photolithography system that digitally shifts mask data responsive to alignment data |
-
2000
- 2000-06-21 FI FI20001480A patent/FI109054B/fi active
-
2001
- 2001-06-21 KR KR1020027017345A patent/KR20030025934A/ko not_active Application Discontinuation
- 2001-06-21 US US10/312,203 patent/US20030175625A1/en not_active Abandoned
- 2001-06-21 CN CNB018113753A patent/CN1203371C/zh not_active Expired - Fee Related
- 2001-06-21 AT AT01951725T patent/ATE382881T1/de not_active IP Right Cessation
- 2001-06-21 DE DE60132205T patent/DE60132205T2/de not_active Expired - Lifetime
- 2001-06-21 JP JP2002504532A patent/JP2004501518A/ja active Pending
- 2001-06-21 WO PCT/FI2001/000597 patent/WO2001098829A1/en active IP Right Grant
- 2001-06-21 EP EP01951725A patent/EP1297383B1/en not_active Expired - Lifetime
- 2001-06-21 AU AU2001272581A patent/AU2001272581A1/en not_active Abandoned
-
2003
- 2003-12-09 HK HK03108917A patent/HK1056611A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE382881T1 (de) | 2008-01-15 |
CN1437713A (zh) | 2003-08-20 |
DE60132205T2 (de) | 2008-12-18 |
HK1056611A1 (en) | 2004-02-20 |
JP2004501518A (ja) | 2004-01-15 |
EP1297383B1 (en) | 2008-01-02 |
WO2001098829A1 (en) | 2001-12-27 |
AU2001272581A1 (en) | 2002-01-02 |
US20030175625A1 (en) | 2003-09-18 |
EP1297383A1 (en) | 2003-04-02 |
KR20030025934A (ko) | 2003-03-29 |
FI109054B (fi) | 2002-05-15 |
DE60132205D1 (de) | 2008-02-14 |
CN1203371C (zh) | 2005-05-25 |
FI20001480A (fi) | 2001-12-22 |
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