TW200501845A - Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board - Google Patents

Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board

Info

Publication number
TW200501845A
TW200501845A TW093107799A TW93107799A TW200501845A TW 200501845 A TW200501845 A TW 200501845A TW 093107799 A TW093107799 A TW 093107799A TW 93107799 A TW93107799 A TW 93107799A TW 200501845 A TW200501845 A TW 200501845A
Authority
TW
Taiwan
Prior art keywords
circuit board
layered circuit
electromagnetic shielding
layer
shielding method
Prior art date
Application number
TW093107799A
Other languages
Chinese (zh)
Inventor
Toshikazu Konno
Shigenori Miyagawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200501845A publication Critical patent/TW200501845A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A multi-layered circuit board comprises a first layer (20) having an external interface parts mounting portion, a second layer (16, 18) having a signal pattern wired to the mounting portion, and a third layer (19) provided beneath the first layer, a ground pattern being provided beneath the mounting portion.
TW093107799A 2003-03-28 2004-03-23 Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board TW200501845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003092357A JP2004303812A (en) 2003-03-28 2003-03-28 Multilayer circuit board and electromagnetic shield method thereof

Publications (1)

Publication Number Publication Date
TW200501845A true TW200501845A (en) 2005-01-01

Family

ID=33405480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107799A TW200501845A (en) 2003-03-28 2004-03-23 Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board

Country Status (3)

Country Link
JP (1) JP2004303812A (en)
CN (1) CN1551713A (en)
TW (1) TW200501845A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845894B (en) * 2022-02-17 2024-06-21 緯創資通股份有限公司 Strip line structure, method for fabricating strip line structure and electronic device thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101576665A (en) 2008-05-09 2009-11-11 群康科技(深圳)有限公司 Liquid crystal display panel
JP5132522B2 (en) * 2008-10-31 2013-01-30 三菱電機株式会社 Electronics
CN102271455A (en) * 2010-06-03 2011-12-07 鸿富锦精密工业（深圳）有限公司 Circuit board
JP2012038911A (en) * 2010-08-06 2012-02-23 Jtekt Corp Multilayer circuit board
JP2014013847A (en) * 2012-07-05 2014-01-23 Keihin Corp Electronic control board
KR102053828B1 (en) * 2012-12-12 2019-12-09 엘지이노텍 주식회사 Printed Circuit Board
CN104144598B (en) * 2013-05-08 2018-02-02 鸿富锦精密工业（深圳）有限公司 Radome and circuit board fixation structure
KR102580988B1 (en) * 2016-05-02 2023-09-21 엘지이노텍 주식회사 Printed circuit board and Electronic Component package including the same
KR102060739B1 (en) * 2017-07-03 2019-12-31 (주)잉크테크 Printed circuit board having emi shielding function and method for manufacturing of the same, and flat cable using the same
KR102616482B1 (en) * 2018-07-26 2023-12-26 삼성전자주식회사 printed circuit board including a ground wiring for canceling the electromagnetic wave generated in the power wiring and electronic device with the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241790A (en) * 1990-02-20 1991-10-28 Hitachi Maxell Ltd Multilayer circuit substrate
JP3091020B2 (en) * 1992-06-08 2000-09-25 新光電気工業株式会社 High frequency wiring board
JPH08242078A (en) * 1994-12-07 1996-09-17 Sony Corp Printed board
JP2000183541A (en) * 1998-12-11 2000-06-30 Toshiba Iyo System Engineering Kk Multilayer printed board
JP2000286587A (en) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd Electromagnetic shield structure at connector part with external cable
JP3745276B2 (en) * 2001-01-17 2006-02-15 キヤノン株式会社 Multilayer printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845894B (en) * 2022-02-17 2024-06-21 緯創資通股份有限公司 Strip line structure, method for fabricating strip line structure and electronic device thereof

Also Published As

Publication number Publication date
CN1551713A (en) 2004-12-01
JP2004303812A (en) 2004-10-28

Similar Documents

Publication Publication Date Title
AU2003260274A1 (en) Printed circuit board and method for producing the same
AU2003303968A8 (en) An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
EP1698218A4 (en) Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same
EP0669792A3 (en) Drill coordinate optimization for multi-layer printed circuit board.
DE60104140D1 (en) METHOD FOR PRODUCING A PRINTED CIRCUIT SHIELDED AGAINST INTERFERENCE RADIATION
SG108830A1 (en) Printed wiring board and method for manufacturing printed wiring board
AU2003222851A1 (en) Screening device for electronic subsassemblies on a printed circuit board
DE69831700D1 (en) Arrangement for shielding an electronic circuit board against radio waves
EP1542518A4 (en) Board for printed wiring, printed wiring board, and method for manufacturing them
WO2002039793A3 (en) Multi-layer printed circuit board fabrication system and method
SG99360A1 (en) A method for forming a printed circuit board and a printed circuit board formed thereby
TW200501845A (en) Multi-layered circuit board and electromagnetic shielding method for the multi-layered circuit board
GB2343553B (en) Printed circuit board and method for wiring signal lines on the same
AU2003271131A1 (en) Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition
GB2382475B (en) Electronic circuit grounding method
AU2003269030A1 (en) Machine for exposing printed circuit boards
AU2002357592A1 (en) Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
AU2002258691A1 (en) Shielded electrical connector for mounting on a printed circuit board
ATE383621T1 (en) DATA CARRIER WITH INTEGRATED CIRCUIT AND TRANSMISSION COIL
HK1050608A1 (en) Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard.
AU2003250326A8 (en) Method for producing a copy protection for an electronic circuit and corresponding component
AU2003264701A8 (en) Press assembly for electronic board testing
GB0109670D0 (en) An electronic editing system
SG100634A1 (en) Method for mounting a connector on a printed circuit board, and shielded connector and lower shielding plate for use in such a method
GB0230356D0 (en) Assembly and method for interconnecting printed circuit boards