GB0230356D0 - Assembly and method for interconnecting printed circuit boards - Google Patents

Assembly and method for interconnecting printed circuit boards

Info

Publication number
GB0230356D0
GB0230356D0 GB0230356A GB0230356A GB0230356D0 GB 0230356 D0 GB0230356 D0 GB 0230356D0 GB 0230356 A GB0230356 A GB 0230356A GB 0230356 A GB0230356 A GB 0230356A GB 0230356 D0 GB0230356 D0 GB 0230356D0
Authority
GB
United Kingdom
Prior art keywords
assembly
printed circuit
circuit boards
interconnecting printed
interconnecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0230356A
Other versions
GB2396976A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB0230356A priority Critical patent/GB2396976A/en
Publication of GB0230356D0 publication Critical patent/GB0230356D0/en
Publication of GB2396976A publication Critical patent/GB2396976A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
GB0230356A 2002-12-31 2002-12-31 Assembly and method for interconnecting printed circuit boards using a PLCC socket and frame Withdrawn GB2396976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0230356A GB2396976A (en) 2002-12-31 2002-12-31 Assembly and method for interconnecting printed circuit boards using a PLCC socket and frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0230356A GB2396976A (en) 2002-12-31 2002-12-31 Assembly and method for interconnecting printed circuit boards using a PLCC socket and frame

Publications (2)

Publication Number Publication Date
GB0230356D0 true GB0230356D0 (en) 2003-02-05
GB2396976A GB2396976A (en) 2004-07-07

Family

ID=9950558

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0230356A Withdrawn GB2396976A (en) 2002-12-31 2002-12-31 Assembly and method for interconnecting printed circuit boards using a PLCC socket and frame

Country Status (1)

Country Link
GB (1) GB2396976A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9202789B2 (en) * 2014-04-16 2015-12-01 Qualcomm Incorporated Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
CN107546506B (en) * 2017-07-24 2019-06-11 番禺得意精密电子工业有限公司 Clamping piece

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4460237A (en) * 1981-12-30 1984-07-17 Methode Electronics, Inc. Contacts for chip carrier socket
US4814857A (en) * 1987-02-25 1989-03-21 International Business Machines Corporation Circuit module with separate signal and power connectors
JP2598650Y2 (en) * 1993-12-14 1999-08-16 モレックス インコーポレーテッド Electrical connector for connecting printed circuit boards
US5395250A (en) * 1994-01-21 1995-03-07 The Whitaker Corporation Low profile board to board connector
US5842874A (en) * 1994-05-25 1998-12-01 Molex Incorporated Dual housing board-to-board connector
JP3068477B2 (en) * 1996-12-17 2000-07-24 静岡日本電気株式会社 connector

Also Published As

Publication number Publication date
GB2396976A (en) 2004-07-07

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)