TW200500814A - Pattern writing apparatus - Google Patents
Pattern writing apparatusInfo
- Publication number
- TW200500814A TW200500814A TW093105519A TW93105519A TW200500814A TW 200500814 A TW200500814 A TW 200500814A TW 093105519 A TW093105519 A TW 093105519A TW 93105519 A TW93105519 A TW 93105519A TW 200500814 A TW200500814 A TW 200500814A
- Authority
- TW
- Taiwan
- Prior art keywords
- mask
- substrate
- carrying base
- openings
- optical unit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The pattern wiring apparatus 1 of the present invention includes: a carrying base 32 for holding a substrate 9; a carrying base moving mechanism 2 for moving the carrying base 32; a light emitting part 51 for emitting light to the substrate 9; a mask part 52 having a first mask 53 and a second mask 54 formed thereon a plurality of openings; and an optical unit 58 for enlarging or reducing an illumination area of the substrate 9 illuminated by the light passing through the mask part 52. In the pattern wiring apparatus 1, it is very easy to vary the width and pitch of the written pattern by changing the overlapping part of the openings of the first mask 53 or the second mask 54, and magnification factor of the optical unit 58, so as to quickly plot stripe patterns with high resolution on the photosensitive material of the substrate 9.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003144537A JP4323863B2 (en) | 2003-05-22 | 2003-05-22 | Pattern drawing device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200500814A true TW200500814A (en) | 2005-01-01 |
TWI252379B TWI252379B (en) | 2006-04-01 |
Family
ID=33531965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093105519A TWI252379B (en) | 2003-05-22 | 2004-03-03 | Pattern writing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4323863B2 (en) |
KR (1) | KR100695335B1 (en) |
CN (1) | CN1292312C (en) |
TW (1) | TWI252379B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100573317C (en) * | 2005-03-29 | 2009-12-23 | 中国科学院光电技术研究所 | Continuous-surface shape mask moving photoetching exposure device |
TWI432914B (en) * | 2007-01-04 | 2014-04-01 | 尼康股份有限公司 | Projection optical apparatus, exposure method and apparatus, and device manufacturing method |
CN107589634B (en) * | 2017-08-11 | 2019-12-27 | 京东方科技集团股份有限公司 | Exposure device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590144A (en) * | 1991-09-30 | 1993-04-09 | Toshiba Corp | Charged beam exposure method and aligner |
JPH08314121A (en) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | Image producing method and pattern forming method using charged particle beam |
JP3478058B2 (en) * | 1997-05-30 | 2003-12-10 | 株式会社日立製作所 | Charged particle beam drawing equipment |
-
2003
- 2003-05-22 JP JP2003144537A patent/JP4323863B2/en not_active Expired - Fee Related
-
2004
- 2004-03-03 TW TW093105519A patent/TWI252379B/en not_active IP Right Cessation
- 2004-03-26 CN CNB2004100313106A patent/CN1292312C/en not_active Expired - Fee Related
- 2004-05-11 KR KR1020040033028A patent/KR100695335B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4323863B2 (en) | 2009-09-02 |
CN1573555A (en) | 2005-02-02 |
KR100695335B1 (en) | 2007-03-15 |
JP2004347846A (en) | 2004-12-09 |
CN1292312C (en) | 2006-12-27 |
KR20040100908A (en) | 2004-12-02 |
TWI252379B (en) | 2006-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |