ES8305853A1 - Un metodo de disposicion no electrolitico para depositar oro sobre un sustrato. - Google Patents
Un metodo de disposicion no electrolitico para depositar oro sobre un sustrato.Info
- Publication number
- ES8305853A1 ES8305853A1 ES510661A ES510661A ES8305853A1 ES 8305853 A1 ES8305853 A1 ES 8305853A1 ES 510661 A ES510661 A ES 510661A ES 510661 A ES510661 A ES 510661A ES 8305853 A1 ES8305853 A1 ES 8305853A1
- Authority
- ES
- Spain
- Prior art keywords
- alkali metal
- gold
- electroless
- nickel
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 6
- 229910052737 gold Inorganic materials 0.000 title abstract 6
- 239000010931 gold Substances 0.000 title abstract 6
- 238000007747 plating Methods 0.000 title abstract 3
- 229910052783 alkali metal Inorganic materials 0.000 abstract 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- 150000001340 alkali metals Chemical class 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- -1 alkali metal cyanoborohydride Chemical class 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 abstract 1
- 239000006172 buffering agent Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/246,472 US4337091A (en) | 1981-03-23 | 1981-03-23 | Electroless gold plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES510661A0 ES510661A0 (es) | 1983-04-16 |
| ES8305853A1 true ES8305853A1 (es) | 1983-04-16 |
Family
ID=22930824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES510661A Expired ES8305853A1 (es) | 1981-03-23 | 1982-03-22 | Un metodo de disposicion no electrolitico para depositar oro sobre un sustrato. |
Country Status (15)
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE8302798L (sv) * | 1982-06-07 | 1983-12-08 | Occidental Chem Co | Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet |
| DE3237394A1 (de) * | 1982-10-08 | 1984-04-12 | Siemens AG, 1000 Berlin und 8000 München | Chemisches vergoldungsbad |
| US4474838A (en) * | 1982-12-01 | 1984-10-02 | Omi International Corporation | Electroless direct deposition of gold on metallized ceramics |
| CH656401A5 (de) * | 1983-07-21 | 1986-06-30 | Suisse Horlogerie Rech Lab | Verfahren zur stromlosen abscheidung von metallen. |
| JPS60121274A (ja) * | 1983-12-06 | 1985-06-28 | Electroplating Eng Of Japan Co | 自己触媒型無電解金めっき液 |
| JPS6299477A (ja) * | 1985-10-25 | 1987-05-08 | C Uyemura & Co Ltd | 無電解金めつき液 |
| US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
| US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
| DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
| US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
| US4946563A (en) * | 1988-12-12 | 1990-08-07 | General Electric Company | Process for manufacturing a selective plated board for surface mount components |
| US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
| US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
| JP2538461B2 (ja) * | 1991-02-22 | 1996-09-25 | 奥野製薬工業株式会社 | 無電解金めっき方法 |
| US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
| US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
| JP3302512B2 (ja) * | 1994-08-19 | 2002-07-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
| JP3331260B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
| JP3331261B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
| US5635253A (en) * | 1994-08-30 | 1997-06-03 | International Business Machines Corporation | Method of replenishing electroless gold plating baths |
| US6086946A (en) * | 1996-08-08 | 2000-07-11 | International Business Machines Corporation | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
| US5728433A (en) * | 1997-02-28 | 1998-03-17 | Engelhard Corporation | Method for gold replenishment of electroless gold bath |
| EP0924777A3 (en) | 1997-10-15 | 1999-07-07 | Canon Kabushiki Kaisha | A method for the formation of an indium oxide film by electro deposition process or electroless deposition process, a substrate provided with said indium oxide film for a semiconductor element, and a semiconductor element provided with said substrate |
| TW432397B (en) * | 1997-10-23 | 2001-05-01 | Sumitomo Metal Mining Co | Transparent electro-conductive structure, progess for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid |
| US20060032757A1 (en) * | 2004-08-16 | 2006-02-16 | Science & Technology Corporation @ Unm | Activation of aluminum for electrodeposition or electroless deposition |
| WO2022040334A1 (en) | 2020-08-18 | 2022-02-24 | Enviro Metals, LLC | Metal refinement |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
| SE361056B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1969-10-30 | 1973-10-15 | Western Electric Co | |
| US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
| US3697296A (en) * | 1971-03-09 | 1972-10-10 | Du Pont | Electroless gold plating bath and process |
| US3917885A (en) * | 1974-04-26 | 1975-11-04 | Engelhard Min & Chem | Electroless gold plating process |
| JPS52124428A (en) * | 1976-04-13 | 1977-10-19 | Hideji Sasaki | Nonnelectrolytic gold plating bath |
| JPS52151637A (en) * | 1976-04-29 | 1977-12-16 | Trw Inc | Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature |
| GB1547028A (en) * | 1976-11-19 | 1979-06-06 | Mine Safety Appliances Co | Electroless gold plating baths |
| JPS5948951B2 (ja) * | 1978-08-05 | 1984-11-29 | 日本特殊陶業株式会社 | 無電解金メッキ液 |
| FR2441666A1 (fr) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | Procede de depot chimique d'or par reduction autocatalytique |
-
1981
- 1981-03-23 US US06/246,472 patent/US4337091A/en not_active Expired - Fee Related
-
1982
- 1982-03-03 SE SE8201309A patent/SE8201309L/ not_active Application Discontinuation
- 1982-03-12 CA CA000398196A patent/CA1183656A/en not_active Expired
- 1982-03-17 AT AT0106282A patent/AT378540B/de not_active IP Right Cessation
- 1982-03-19 DK DK125882A patent/DK125882A/da not_active IP Right Cessation
- 1982-03-19 GB GB8208104A patent/GB2095292B/en not_active Expired
- 1982-03-19 IT IT48030/82A patent/IT1189239B/it active
- 1982-03-20 DE DE3210268A patent/DE3210268C2/de not_active Expired
- 1982-03-22 FR FR8204835A patent/FR2502184B1/fr not_active Expired
- 1982-03-22 CH CH1761/82A patent/CH652149A5/de not_active IP Right Cessation
- 1982-03-22 ES ES510661A patent/ES8305853A1/es not_active Expired
- 1982-03-23 NL NL8201216A patent/NL8201216A/nl not_active Application Discontinuation
- 1982-03-23 BE BE0/207645A patent/BE892604A/fr not_active IP Right Cessation
- 1982-03-23 JP JP57046170A patent/JPS57169077A/ja active Granted
-
1986
- 1986-11-13 HK HK854/86A patent/HK85486A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US4337091A (en) | 1982-06-29 |
| ES510661A0 (es) | 1983-04-16 |
| FR2502184A1 (fr) | 1982-09-24 |
| GB2095292A (en) | 1982-09-29 |
| DE3210268A1 (de) | 1982-09-30 |
| ATA106282A (de) | 1985-01-15 |
| FR2502184B1 (fr) | 1985-09-13 |
| CH652149A5 (de) | 1985-10-31 |
| CA1183656A (en) | 1985-03-12 |
| IT1189239B (it) | 1988-01-28 |
| HK85486A (en) | 1986-11-21 |
| GB2095292B (en) | 1985-07-17 |
| DE3210268C2 (de) | 1984-04-05 |
| IT8248030A0 (it) | 1982-03-19 |
| NL8201216A (nl) | 1982-10-18 |
| SE8201309L (sv) | 1982-09-24 |
| DK125882A (da) | 1982-09-24 |
| AT378540B (de) | 1985-08-26 |
| JPS57169077A (en) | 1982-10-18 |
| JPH0230388B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-07-05 |
| BE892604A (fr) | 1982-09-23 |
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