FR2359215A1 - Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique - Google Patents

Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique

Info

Publication number
FR2359215A1
FR2359215A1 FR7621989A FR7621989A FR2359215A1 FR 2359215 A1 FR2359215 A1 FR 2359215A1 FR 7621989 A FR7621989 A FR 7621989A FR 7621989 A FR7621989 A FR 7621989A FR 2359215 A1 FR2359215 A1 FR 2359215A1
Authority
FR
France
Prior art keywords
plating soln
bright metallic
giving
metallic appearance
mole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7621989A
Other languages
English (en)
Other versions
FR2359215B1 (fr
Inventor
Masahiro Oita
Hyogo Hirohata
Nobuhiro Hamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to FR7621989A priority Critical patent/FR2359215A1/fr
Publication of FR2359215A1 publication Critical patent/FR2359215A1/fr
Application granted granted Critical
Publication of FR2359215B1 publication Critical patent/FR2359215B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Abstract

Solutions de revêtement non électrolytique de cuivre. Ces solutions comprennent un sel de cuivre, un agent de complexation, un réducteur, un hydroxyde alcalin et un agent tensio-actif non ionique contenant un groupe perfluorocarboné aliphatique. La présente est particulièrement utile pour fournir des solutions de revêtement non électrolytique de cuivre, convenant à la production de dépôts de cuivre ayant une ductilité élevée et un bon aspect, à l'aide de solutions qui sont très stables même à temperature élevée.
FR7621989A 1976-07-19 1976-07-19 Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique Granted FR2359215A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7621989A FR2359215A1 (fr) 1976-07-19 1976-07-19 Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7621989A FR2359215A1 (fr) 1976-07-19 1976-07-19 Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique

Publications (2)

Publication Number Publication Date
FR2359215A1 true FR2359215A1 (fr) 1978-02-17
FR2359215B1 FR2359215B1 (fr) 1978-12-22

Family

ID=9175869

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7621989A Granted FR2359215A1 (fr) 1976-07-19 1976-07-19 Solutions de revetement non electrolytique de cuivre, renfermant un agent tensio-actif a groupe perfluorocarbone aliphatique

Country Status (1)

Country Link
FR (1) FR2359215A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3581677A1 (fr) * 2018-06-15 2019-12-18 Rohm and Haas Electronic Materials LLC Compositions de placage électrolytique de cuivre et procédés de placage électrolytique de cuivre sur des substrats
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3581677A1 (fr) * 2018-06-15 2019-12-18 Rohm and Haas Electronic Materials LLC Compositions de placage électrolytique de cuivre et procédés de placage électrolytique de cuivre sur des substrats
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN110607520A (zh) * 2018-06-15 2019-12-24 罗门哈斯电子材料有限责任公司 无电镀铜组合物和用于在基材上无电镀铜的方法
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN110607520B (zh) * 2018-06-15 2021-07-30 罗门哈斯电子材料有限责任公司 无电镀铜组合物和用于在基材上无电镀铜的方法

Also Published As

Publication number Publication date
FR2359215B1 (fr) 1978-12-22

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