ES2940083T3 - Formación directa de nitruro de boro hexagonal sobre dieléctricos basados en silicio - Google Patents
Formación directa de nitruro de boro hexagonal sobre dieléctricos basados en silicio Download PDFInfo
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- ES2940083T3 ES2940083T3 ES17722645T ES17722645T ES2940083T3 ES 2940083 T3 ES2940083 T3 ES 2940083T3 ES 17722645 T ES17722645 T ES 17722645T ES 17722645 T ES17722645 T ES 17722645T ES 2940083 T3 ES2940083 T3 ES 2940083T3
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- graphene
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/675—Group III-V materials, Group II-VI materials, Group IV-VI materials, selenium or tellurium
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Carbon And Carbon Compounds (AREA)
- Formation Of Insulating Films (AREA)
- Physical Vapour Deposition (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662335149P | 2016-05-12 | 2016-05-12 | |
| PCT/US2017/030124 WO2017196559A1 (en) | 2016-05-12 | 2017-04-28 | Direct formation of hexagonal boron nitride on silicon based dielectrics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2940083T3 true ES2940083T3 (es) | 2023-05-03 |
Family
ID=58692666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES17722645T Active ES2940083T3 (es) | 2016-05-12 | 2017-04-28 | Formación directa de nitruro de boro hexagonal sobre dieléctricos basados en silicio |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10658472B2 (enExample) |
| EP (3) | EP4131338A3 (enExample) |
| JP (3) | JP6775804B2 (enExample) |
| KR (3) | KR102419924B1 (enExample) |
| CN (1) | CN109791876B (enExample) |
| ES (1) | ES2940083T3 (enExample) |
| WO (1) | WO2017196559A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994078B (zh) * | 2017-12-14 | 2020-08-11 | 北京华碳科技有限责任公司 | 具有源极控制电极的场效应晶体管、制造方法和电子器件 |
| US10490673B2 (en) * | 2018-03-02 | 2019-11-26 | Texas Instruments Incorporated | Integration of graphene and boron nitride hetero-structure device |
| US11332369B2 (en) * | 2018-03-22 | 2022-05-17 | BNNano, Inc. | Compositions and aggregates comprising boron nitride nanotube structures, and methods of making |
| CN109180026A (zh) * | 2018-07-26 | 2019-01-11 | 吉林大学 | 利用化学气相沉积方法制备蓝宝石光纤包层的方法 |
| US11339499B2 (en) * | 2018-10-08 | 2022-05-24 | Korea Institute Of Science And Technology | Method for epitaxial growth of single crystalline heterogeneous 2D materials and stacked structure |
| JP7253943B2 (ja) * | 2019-03-15 | 2023-04-07 | 東京エレクトロン株式会社 | 六方晶窒化ホウ素膜を形成する方法および装置 |
| US11158807B2 (en) * | 2019-10-18 | 2021-10-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Field effect transistor and method of manufacturing the same |
| CN110676384B (zh) * | 2019-11-05 | 2024-11-26 | 南京理工大学 | 一种氮化硼封装的二维有机-无机异质结及其制备方法 |
| CN113023718B (zh) * | 2019-12-24 | 2022-11-01 | 北京大学 | 一种洁净转移制备高质量悬空二维材料支撑膜的方法 |
| CN111243942A (zh) * | 2020-01-19 | 2020-06-05 | 吉林大学 | 利用过渡金属或合金作为缓冲层提高六方氮化硼结晶质量的方法 |
| US11075273B1 (en) | 2020-03-04 | 2021-07-27 | International Business Machines Corporation | Nanosheet electrostatic discharge structure |
| KR102314020B1 (ko) * | 2020-05-06 | 2021-10-15 | 아주대학교산학협력단 | 육방정계 질화붕소/그래핀 2차원 복합 소재 제조방법 |
| CN115004343B (zh) * | 2020-06-28 | 2025-02-28 | 深圳清华大学研究院 | 带有微结构的原子级平整器件及其制备方法 |
| KR20220033997A (ko) * | 2020-09-10 | 2022-03-17 | 에이에스엠 아이피 홀딩 비.브이. | 갭 충진 유체를 증착하기 위한 방법 그리고 이와 관련된 시스템 및 장치 |
| US11545565B2 (en) * | 2020-10-21 | 2023-01-03 | IceMos Technology Limited | Semiconductor device and method of forming low voltage power MOSFETs using graphene for metal layers and graphene nanoribbons for channel and drain enhancement regions of power vertical and lateral MOSFETs |
| JP7501312B2 (ja) * | 2020-11-05 | 2024-06-18 | 富士通株式会社 | 光センサ及びその製造方法 |
| CN112582542B (zh) * | 2020-12-06 | 2022-09-30 | 南开大学 | 一种基于二维范德华异质结构的单分子场效应晶体管及其制备方法 |
| US11830729B2 (en) * | 2021-01-08 | 2023-11-28 | Applied Materials, Inc. | Low-k boron carbonitride films |
| CN113136641B (zh) * | 2021-03-15 | 2022-05-31 | 杭州电子科技大学 | 一种氮、硼掺杂非晶碳中空纤维膜的制备方法 |
| KR102504324B1 (ko) * | 2021-06-28 | 2023-02-28 | 경희대학교 산학협력단 | 자외선 방출 광 소자 및 이의 동작 방법 |
| US20240295596A1 (en) * | 2021-09-08 | 2024-09-05 | Otowa Electric Co., Ltd. | A sensor device capable of measuring electric field strength of an external electric field and method for measuring external electric field |
| CN118077030A (zh) * | 2021-09-17 | 2024-05-24 | 应用材料公司 | 六方氮化硼沉积 |
| EP4500576A1 (en) * | 2022-03-31 | 2025-02-05 | Archer Materials Limited | FABRICATION AND PROCESSING OF GRAPHENE ELECTRONIC DEVICES ON SILICON WITH A SiO2 PASSIVATION LAYER |
| CN115064595B (zh) * | 2022-06-30 | 2025-11-07 | 中国科学院半导体研究所 | 一种mos器件及其制备方法 |
| KR20240092593A (ko) * | 2022-12-14 | 2024-06-24 | 에이에스엠 아이피 홀딩 비.브이. | 질화붕소 증착 방법 및 시스템 |
| EP4639634A1 (en) * | 2022-12-23 | 2025-10-29 | Archer Materials Limited | Methods for fabrication of graphene field-effect transistors with a liquid top-gate and associated componentry |
| WO2025085123A2 (en) * | 2023-06-20 | 2025-04-24 | Kansas State University Research Foundation | Crystalline hexagonal boron nitride with nitrogen-15 isotope enrichment |
| CN117512559B (zh) * | 2023-11-13 | 2025-10-31 | 吉林大学 | 一种原位c掺杂的p型六方氮化硼薄膜及其制备方法 |
| CN118374789A (zh) * | 2024-04-19 | 2024-07-23 | 南京大学 | 快速等厚生长高介电性能六方氮化硼薄膜的方法及薄膜 |
| CN118929587B (zh) * | 2024-08-27 | 2025-10-03 | 中国科学院兰州化学物理研究所 | 一种自组装球状氮化硼及其制备方法 |
| US12479730B1 (en) | 2024-12-02 | 2025-11-25 | Lyten, Inc. | Homogenous, partially oxidized carbon and microwave-assisted methods of making the same |
| CN119980151A (zh) * | 2025-01-13 | 2025-05-13 | 南京理工大学 | 一种可控合成金属-有机纳米带的方法 |
| CN119913478A (zh) * | 2025-01-24 | 2025-05-02 | 中山大学 | 高附着力的8英寸六方氮化硼厚膜生长方法 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5547379A (en) * | 1978-10-02 | 1980-04-03 | Takehiko Takahashi | Manufacture of boron nitride coated film by chemical vapor deposition |
| JPS61174621A (ja) * | 1985-01-28 | 1986-08-06 | Nippon Telegr & Teleph Corp <Ntt> | 半導体薄膜結晶の製造方法 |
| JPS61177372A (ja) | 1985-01-31 | 1986-08-09 | Kyocera Corp | 窒化ホウ素膜の製造方法 |
| JPS63145779A (ja) | 1986-12-08 | 1988-06-17 | Katsumitsu Nakamura | 六方晶窒化硼素膜の応力制御方法 |
| JP2747044B2 (ja) * | 1989-07-25 | 1998-05-06 | 昭和電工株式会社 | p―n接合を有する立方晶窒化ほう素半導体の製造法 |
| JPH03223463A (ja) * | 1990-01-26 | 1991-10-02 | Olympus Optical Co Ltd | 立方晶窒化硼素の合成方法 |
| FR2765567B1 (fr) | 1997-07-02 | 1999-10-01 | Europ Propulsion | Preparation de polyborazylene mesophasique, polyborazylene mesophasique, utilisation a titre de precurseur de bn |
| JP2002016064A (ja) * | 2000-06-28 | 2002-01-18 | Mitsubishi Heavy Ind Ltd | 低誘電率六方晶窒化ホウ素膜、層間絶縁膜及びその製造方法 |
| KR100448714B1 (ko) * | 2002-04-24 | 2004-09-13 | 삼성전자주식회사 | 다층 나노라미네이트 구조를 갖는 반도체 장치의 절연막및 그의 형성방법 |
| JP4764260B2 (ja) | 2006-06-08 | 2011-08-31 | 日本電信電話株式会社 | 半導体積層構造及びその製造方法 |
| KR100923304B1 (ko) | 2007-10-29 | 2009-10-23 | 삼성전자주식회사 | 그라펜 시트 및 그의 제조방법 |
| KR101344493B1 (ko) | 2007-12-17 | 2013-12-24 | 삼성전자주식회사 | 단결정 그라펜 시트 및 그의 제조방법 |
| JP4916486B2 (ja) * | 2008-06-11 | 2012-04-11 | 日本電信電話株式会社 | 六方晶窒化ホウ素構造および製造方法 |
| AR075976A1 (es) | 2009-03-30 | 2011-05-11 | Sumitomo Metal Ind | Metodo para la manufactura de tuberias sin costura |
| CN102448879B (zh) | 2009-06-16 | 2014-10-22 | 富士通株式会社 | 石墨结构体、电子部件及电子部件的制造方法 |
| KR101622304B1 (ko) | 2009-08-05 | 2016-05-19 | 삼성전자주식회사 | 그라펜 기재 및 그의 제조방법 |
| US8158200B2 (en) | 2009-08-18 | 2012-04-17 | University Of North Texas | Methods of forming graphene/(multilayer) boron nitride for electronic device applications |
| US8187955B2 (en) | 2009-08-24 | 2012-05-29 | International Business Machines Corporation | Graphene growth on a carbon-containing semiconductor layer |
| KR101736462B1 (ko) | 2009-09-21 | 2017-05-16 | 한화테크윈 주식회사 | 그래핀의 제조 방법 |
| US8808810B2 (en) | 2009-12-15 | 2014-08-19 | Guardian Industries Corp. | Large area deposition of graphene on substrates, and products including the same |
| US9096437B2 (en) | 2010-03-08 | 2015-08-04 | William Marsh Rice University | Growth of graphene films from non-gaseous carbon sources |
| CN101817684B (zh) * | 2010-03-25 | 2012-08-15 | 西安交通大学 | 一种多孔Si3N4基体表面覆涂h-BN涂层的方法 |
| US20110233513A1 (en) * | 2010-03-29 | 2011-09-29 | International Business Machines Corporation | Enhanced bonding interfaces on carbon-based materials for nanoelectronic devices |
| US8592291B2 (en) * | 2010-04-07 | 2013-11-26 | Massachusetts Institute Of Technology | Fabrication of large-area hexagonal boron nitride thin films |
| KR101172625B1 (ko) * | 2011-01-21 | 2012-08-08 | 한국과학기술원 | 레이저를 이용한 반도체 소자 제조방법, 이에 의하여 제조된 그래핀 반도체 및 그래핀 트랜지스터 |
| CN102064189A (zh) | 2010-12-06 | 2011-05-18 | 苏州纳维科技有限公司 | 金属-半导体电极结构及其制备方法 |
| US9257509B2 (en) | 2010-12-21 | 2016-02-09 | The Trustees Of Columbia University In The City Of New York | Electrical devices with graphene on boron nitride |
| GB201104824D0 (en) * | 2011-03-22 | 2011-05-04 | Univ Manchester | Structures and methods relating to graphene |
| KR101962870B1 (ko) * | 2011-03-22 | 2019-03-27 | 더 유니버시티 오브 맨체스터 | 트랜지스터 소자 및 제조를 위한 물질들 |
| US20140120270A1 (en) | 2011-04-25 | 2014-05-01 | James M. Tour | Direct growth of graphene films on non-catalyst surfaces |
| KR101878732B1 (ko) | 2011-06-24 | 2018-07-16 | 삼성전자주식회사 | 그래핀 기재 및 이를 채용한 투명전극과 트랜지스터 |
| US8884310B2 (en) * | 2011-10-19 | 2014-11-11 | Sunedison Semiconductor Limited (Uen201334164H) | Direct formation of graphene on semiconductor substrates |
| KR20130043063A (ko) | 2011-10-19 | 2013-04-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| US9029228B2 (en) | 2011-10-19 | 2015-05-12 | SunEdision Semiconductor Limited (UEN201334164H) | Direct and sequential formation of monolayers of boron nitride and graphene on substrates |
| US9059219B2 (en) | 2012-06-27 | 2015-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP6417674B2 (ja) | 2013-03-07 | 2018-11-07 | 株式会社リコー | 感熱記録材料 |
| US9029226B2 (en) | 2013-03-13 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for doping lightly-doped-drain (LDD) regions of finFET devices |
| KR20140114199A (ko) * | 2013-03-18 | 2014-09-26 | 삼성전자주식회사 | 이종 적층 구조체 및 그 제조방법, 및 상기 이종 적층 구조체를 구비하는 전기소자 |
| KR102100925B1 (ko) * | 2013-03-22 | 2020-04-14 | 삼성전자주식회사 | 기판 구조체, 상기 기판 구조체를 형성하는 방법, 및 이를 구비하는 전기소자 |
| EP4293707A3 (en) * | 2013-05-09 | 2024-03-27 | GlobalWafers Co., Ltd. | Direct and sequential formation of monolayers of boron nitride and graphene on substrates |
| KR102144999B1 (ko) * | 2013-11-05 | 2020-08-14 | 삼성전자주식회사 | 이차원 물질과 그 형성방법 및 이차원 물질을 포함하는 소자 |
| JP5687328B2 (ja) * | 2013-12-11 | 2015-03-18 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| EP3158365A2 (en) * | 2014-06-23 | 2017-04-26 | Rensselaer Polytechnic Institute | Radiation-detecting structures and fabrication methods thereof |
| KR102237826B1 (ko) * | 2014-07-18 | 2021-04-08 | 삼성전자주식회사 | 그래핀 소자와 그 제조 및 동작방법과 그래핀 소자를 포함하는 전자장치 |
| JP6241398B2 (ja) * | 2014-09-11 | 2017-12-06 | 株式会社デンソー | グラフェン積層体の製造方法 |
| US9972740B2 (en) * | 2015-06-07 | 2018-05-15 | Tesla, Inc. | Chemical vapor deposition tool and process for fabrication of photovoltaic structures |
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- 2017-04-28 EP EP22197005.6A patent/EP4131338A3/en active Pending
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- 2017-04-28 CN CN201780029376.7A patent/CN109791876B/zh active Active
- 2017-04-28 WO PCT/US2017/030124 patent/WO2017196559A1/en not_active Ceased
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| US11289577B2 (en) | 2022-03-29 |
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| JP6775804B2 (ja) | 2020-10-28 |
| JP2021020848A (ja) | 2021-02-18 |
| EP3455874B1 (en) | 2022-12-28 |
| KR20190007425A (ko) | 2019-01-22 |
| EP4131339A3 (en) | 2023-02-15 |
| KR20210130831A (ko) | 2021-11-01 |
| KR102317740B1 (ko) | 2021-10-28 |
| JP7283707B2 (ja) | 2023-05-30 |
| CN109791876B (zh) | 2023-08-15 |
| WO2017196559A1 (en) | 2017-11-16 |
| EP4131338A3 (en) | 2023-02-15 |
| EP3455874A1 (en) | 2019-03-20 |
| JP2022121422A (ja) | 2022-08-19 |
| CN109791876A (zh) | 2019-05-21 |
| US11276759B2 (en) | 2022-03-15 |
| JP2019522348A (ja) | 2019-08-08 |
| US20190097000A1 (en) | 2019-03-28 |
| JP7066127B2 (ja) | 2022-05-13 |
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