ES2478267T3 - Método para producir depósitos de cobre mate - Google Patents

Método para producir depósitos de cobre mate Download PDF

Info

Publication number
ES2478267T3
ES2478267T3 ES12152390.6T ES12152390T ES2478267T3 ES 2478267 T3 ES2478267 T3 ES 2478267T3 ES 12152390 T ES12152390 T ES 12152390T ES 2478267 T3 ES2478267 T3 ES 2478267T3
Authority
ES
Spain
Prior art keywords
copper
layer
substrate
acid
divalent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12152390.6T
Other languages
English (en)
Spanish (es)
Inventor
Stefan Kretschmer
Dr. Philip Hartmann
Dr. Bernd Roelfs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2478267T3 publication Critical patent/ES2478267T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
ES12152390.6T 2012-01-25 2012-01-25 Método para producir depósitos de cobre mate Active ES2478267T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12152390.6A EP2620529B1 (en) 2012-01-25 2012-01-25 Method for producing matt copper deposits

Publications (1)

Publication Number Publication Date
ES2478267T3 true ES2478267T3 (es) 2014-07-21

Family

ID=47226182

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12152390.6T Active ES2478267T3 (es) 2012-01-25 2012-01-25 Método para producir depósitos de cobre mate

Country Status (11)

Country Link
US (1) US20150014177A1 (zh)
EP (1) EP2620529B1 (zh)
JP (1) JP6086930B2 (zh)
KR (1) KR101979975B1 (zh)
CN (1) CN104080955B (zh)
BR (1) BR112014018114B1 (zh)
CA (1) CA2862141C (zh)
ES (1) ES2478267T3 (zh)
PL (1) PL2620529T3 (zh)
TW (1) TWI526582B (zh)
WO (1) WO2013110373A2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020096906A1 (en) 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer
US11384446B2 (en) 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
JP2024530122A (ja) * 2021-08-05 2024-08-16 マクダーミッド エンソン インコーポレイテッド ナノ双晶銅の電着のための組成物及び方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
JPH04139787A (ja) * 1990-09-28 1992-05-13 Fujitsu Ltd プリント配線板の電解メッキ方法
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JP2915305B2 (ja) * 1994-11-04 1999-07-05 有限会社カネヒロ・メタライジング つや消しメッキ方法および検針器対応つや消しメッキ方法
DE19540011C2 (de) * 1995-10-27 1998-09-10 Lpw Chemie Gmbh Verfahren zur galvanischen Abscheidung von blendfreien Nickel- oder Nickellegierungsniederschlägen
DE19653681C2 (de) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
US6679983B2 (en) * 2000-10-13 2004-01-20 Shipley Company, L.L.C. Method of electrodepositing copper
US6649038B2 (en) * 2000-10-13 2003-11-18 Shipley Company, L.L.C. Electroplating method
BR0114600B1 (pt) * 2000-10-19 2011-04-05 banho de revestimento eletrolìtico de cobre e processo de eletroposição de uma camada fosca de cobre.
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
US20050045485A1 (en) * 2003-09-03 2005-03-03 Taiwan Semiconductor Manufacturing Co. Ltd. Method to improve copper electrochemical deposition
DE10354760A1 (de) * 2003-11-21 2005-06-23 Enthone Inc., West Haven Verfahren zur Abscheidung von Nickel und Chrom(VI)freien metallischen Mattschichten
EP2143828B1 (en) * 2008-07-08 2016-12-28 Enthone, Inc. Electrolyte and method for the deposition of a matt metal layer
DE102008033174B3 (de) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
JP5823665B2 (ja) * 2009-02-20 2015-11-25 株式会社大和化成研究所 めっき浴及びそれを用いためっき方法
KR101141923B1 (ko) * 2009-12-28 2012-05-07 한밭대학교 산학협력단 이중 전기도금법을 이용한 전기도금법 및 이로부터 형성되는 금속 박막

Also Published As

Publication number Publication date
BR112014018114A2 (zh) 2017-06-20
KR101979975B1 (ko) 2019-09-03
BR112014018114A8 (pt) 2017-07-11
JP2015510038A (ja) 2015-04-02
JP6086930B2 (ja) 2017-03-01
CA2862141A1 (en) 2013-08-01
WO2013110373A2 (en) 2013-08-01
BR112014018114B1 (pt) 2020-09-01
CA2862141C (en) 2020-03-10
TWI526582B (zh) 2016-03-21
WO2013110373A3 (en) 2014-04-24
TW201333274A (zh) 2013-08-16
US20150014177A1 (en) 2015-01-15
PL2620529T3 (pl) 2014-09-30
KR20140119123A (ko) 2014-10-08
CN104080955A (zh) 2014-10-01
EP2620529A1 (en) 2013-07-31
EP2620529B1 (en) 2014-04-30
CN104080955B (zh) 2016-03-23

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