ES2384444T3 - Procedimiento de soldadura de reparación subacuática - Google Patents
Procedimiento de soldadura de reparación subacuática Download PDFInfo
- Publication number
- ES2384444T3 ES2384444T3 ES07737495T ES07737495T ES2384444T3 ES 2384444 T3 ES2384444 T3 ES 2384444T3 ES 07737495 T ES07737495 T ES 07737495T ES 07737495 T ES07737495 T ES 07737495T ES 2384444 T3 ES2384444 T3 ES 2384444T3
- Authority
- ES
- Spain
- Prior art keywords
- welding
- protection plate
- holes
- defective part
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Arc Welding In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006053748 | 2006-02-28 | ||
JP2006053748A JP4846392B2 (ja) | 2006-02-28 | 2006-02-28 | 水中補修溶接方法 |
PCT/JP2007/053741 WO2007099996A1 (ja) | 2006-02-28 | 2007-02-28 | 水中補修溶接方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2384444T3 true ES2384444T3 (es) | 2012-07-05 |
Family
ID=38459097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES07737495T Active ES2384444T3 (es) | 2006-02-28 | 2007-02-28 | Procedimiento de soldadura de reparación subacuática |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090200277A1 (de) |
EP (1) | EP1992444B1 (de) |
JP (1) | JP4846392B2 (de) |
CN (1) | CN101394967B (de) |
ES (1) | ES2384444T3 (de) |
TW (1) | TW200800460A (de) |
WO (1) | WO2007099996A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4928983B2 (ja) * | 2007-02-28 | 2012-05-09 | 株式会社東芝 | 水中補修溶接方法 |
FR2943567B1 (fr) * | 2009-03-30 | 2012-08-31 | Comex Nucleaire | Procede de soudage sous eau d'une rustine |
JP5897289B2 (ja) * | 2011-09-22 | 2016-03-30 | 株式会社Ihi検査計測 | 水中補修溶接方法 |
CN102886590A (zh) * | 2012-10-16 | 2013-01-23 | 重庆望江工业有限公司 | 采用手工电弧焊浸水补焊修复零件缺陷的方法 |
CN104816092B (zh) * | 2015-05-19 | 2017-09-29 | 大族激光科技产业集团股份有限公司 | 一种换热板激光叠焊装置及方法 |
CN111408840B (zh) * | 2020-04-07 | 2021-10-19 | 哈尔滨工业大学(威海) | 一种感应加热辅助水下激光熔敷或增材的装置及使用方法 |
CN114434030A (zh) * | 2022-03-22 | 2022-05-06 | 苏州天脉导热科技股份有限公司 | 一种薄均温板激光焊接封合治具及焊接方法 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2332822B2 (de) * | 1973-06-28 | 1978-04-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen von diffundierten, kontaktierten und oberflächenpassivierten Halbleiterbauelementen aus Halbleiterscheiben aus Silizium |
WO1982000166A1 (en) | 1980-07-01 | 1982-01-21 | Portier J | Method for substituting a cement grout,a mortar or a concrete for bentonite mud contained in a cavity |
JPS58151989A (ja) * | 1982-03-03 | 1983-09-09 | Mitsubishi Heavy Ind Ltd | 補修溶接方法 |
JPS60210386A (ja) * | 1984-04-02 | 1985-10-22 | Mitsubishi Electric Corp | レ−ザ溶接方法及び装置 |
JPS6277176A (ja) * | 1985-09-30 | 1987-04-09 | Toshiba Corp | 水中溶接装置 |
CN86206543U (zh) * | 1986-11-26 | 1987-11-07 | 陈式亮 | 水下局部干法焊炬 |
JPH0675775B2 (ja) * | 1986-12-29 | 1994-09-28 | 株式会社東芝 | 水中溶接装置 |
US4801352A (en) * | 1986-12-30 | 1989-01-31 | Image Micro Systems, Inc. | Flowing gas seal enclosure for processing workpiece surface with controlled gas environment and intense laser irradiation |
US5407514A (en) * | 1988-02-03 | 1995-04-18 | E. O. Butts Consultants Ltd. | Method for welding thermoplastic materials |
JP2695945B2 (ja) * | 1989-11-01 | 1998-01-14 | 株式会社東芝 | 水中溶接装置 |
JPH04147786A (ja) * | 1990-10-09 | 1992-05-21 | Toshiba Corp | 水中レーザー溶接装置 |
JPH0531591A (ja) * | 1991-07-30 | 1993-02-09 | Toshiba Corp | 水中レーザー溶接装置 |
DE9112690U1 (de) * | 1991-10-11 | 1991-12-05 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh, 8000 Muenchen, De | |
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US5539174A (en) * | 1994-05-26 | 1996-07-23 | Lsi Logic Corporation | Clean laser cutting of metal lines on microelectronic circuit substrates using reactive gases |
JP3119090B2 (ja) * | 1994-10-05 | 2000-12-18 | 株式会社日立製作所 | 水中レーザ加工装置及びその装置を用いた水中施工方法 |
CA2168413C (en) * | 1995-01-31 | 2000-04-18 | Kouki Okazaki | Underwater laser processing method and apparatus |
US5798497A (en) * | 1995-02-02 | 1998-08-25 | Battelle Memorial Institute | Tunable, self-powered integrated arc plasma-melter vitrification system for waste treatment and resource recovery |
JP3619286B2 (ja) * | 1995-06-27 | 2005-02-09 | 石川島播磨重工業株式会社 | 水中レーザ溶接装置 |
US5705786A (en) * | 1995-12-29 | 1998-01-06 | General Electric Company | Underwater welding |
EP1391281A1 (de) * | 1996-04-14 | 2004-02-25 | Suzuka Fuji Xerox Co., Ltd. | Verfahren zur Wiederverwendung von beschichteten Formkörpern |
JPH11179570A (ja) * | 1997-12-22 | 1999-07-06 | Ishikawajima Harima Heavy Ind Co Ltd | 水中レーザ溶接部可視化装置 |
JP2000280087A (ja) * | 1999-03-30 | 2000-10-10 | Hitachi Ltd | 水中レーザ溶接装置及び水中レーザ溶接方法 |
JP2000301345A (ja) * | 1999-04-23 | 2000-10-31 | Komatsu Ltd | Si系材料の溶接方法 |
WO2001021362A2 (en) * | 1999-09-21 | 2001-03-29 | Hypertherm, Inc. | Process and apparatus for cutting or welding a workpiece |
WO2003064101A1 (en) * | 2000-01-10 | 2003-08-07 | Arcmatic Integrated Systems, Incorporated | Consumable guide tube |
JP2001219269A (ja) * | 2000-02-07 | 2001-08-14 | Hitachi Ltd | 水中加工装置及びその加工方法 |
DE60117964T2 (de) * | 2000-03-31 | 2006-12-14 | Kabushiki Kaisha Toshiba | Einrichtung zum reparieren bzw.zur instandhaltung unter wasser |
JP4155489B2 (ja) * | 2000-09-28 | 2008-09-24 | 株式会社東芝 | 水中レーザ補修溶接装置 |
US6284997B1 (en) * | 2000-11-08 | 2001-09-04 | Integrated Materials, Inc. | Crack free welding of silicon |
JP4490608B2 (ja) * | 2001-08-09 | 2010-06-30 | 株式会社東芝 | 構造物の補修方法 |
JP3752451B2 (ja) * | 2001-12-17 | 2006-03-08 | 株式会社日立製作所 | 沸騰水型原子炉用制御棒の製造方法 |
JP4304913B2 (ja) * | 2002-04-17 | 2009-07-29 | 株式会社日立製作所 | 亀裂状欠陥の補修方法 |
US6870124B2 (en) * | 2002-05-08 | 2005-03-22 | Dana Corporation | Plasma-assisted joining |
US6852945B2 (en) * | 2002-06-19 | 2005-02-08 | The Babcock & Wilcox Company | Laser welding boiler tube wall panels |
US6713710B1 (en) * | 2002-10-15 | 2004-03-30 | Shaobin Zhang | Apparatus and method for trackless movement and full penetration arc welding |
JP2004148374A (ja) * | 2002-10-31 | 2004-05-27 | Honda Motor Co Ltd | 高密度エネルギービームによるアルミニウム又はアルミニウム合金から成る被溶接部材同士の貫通溶接方法 |
US7271363B2 (en) * | 2004-09-01 | 2007-09-18 | Noritsu Koki Co., Ltd. | Portable microwave plasma systems including a supply line for gas and microwaves |
-
2006
- 2006-02-28 JP JP2006053748A patent/JP4846392B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-27 TW TW096106867A patent/TW200800460A/zh not_active IP Right Cessation
- 2007-02-28 CN CN2007800071522A patent/CN101394967B/zh not_active Expired - Fee Related
- 2007-02-28 EP EP07737495A patent/EP1992444B1/de not_active Expired - Fee Related
- 2007-02-28 WO PCT/JP2007/053741 patent/WO2007099996A1/ja active Application Filing
- 2007-02-28 ES ES07737495T patent/ES2384444T3/es active Active
-
2008
- 2008-08-28 US US12/200,535 patent/US20090200277A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN101394967B (zh) | 2011-09-21 |
WO2007099996A1 (ja) | 2007-09-07 |
EP1992444B1 (de) | 2011-12-28 |
EP1992444A1 (de) | 2008-11-19 |
JP2007229757A (ja) | 2007-09-13 |
US20090200277A1 (en) | 2009-08-13 |
TW200800460A (en) | 2008-01-01 |
JP4846392B2 (ja) | 2011-12-28 |
TWI317668B (de) | 2009-12-01 |
EP1992444A4 (de) | 2009-10-28 |
CN101394967A (zh) | 2009-03-25 |
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