ES2184155T3 - Transistor con efecto de campo. - Google Patents

Transistor con efecto de campo.

Info

Publication number
ES2184155T3
ES2184155T3 ES98103825T ES98103825T ES2184155T3 ES 2184155 T3 ES2184155 T3 ES 2184155T3 ES 98103825 T ES98103825 T ES 98103825T ES 98103825 T ES98103825 T ES 98103825T ES 2184155 T3 ES2184155 T3 ES 2184155T3
Authority
ES
Spain
Prior art keywords
adulterated
layer
separation
transistor
superposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98103825T
Other languages
English (en)
Inventor
Mitsuru Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of ES2184155T3 publication Critical patent/ES2184155T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
    • H01L29/151—Compositional structures
    • H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
    • H01L29/155—Comprising only semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
    • H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
    • H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
    • H01L29/7784—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material with delta or planar doped donor layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

EN UN SUSTRATO INP SEMI - AISLANTE ADULTERADO CON HIERRO, UNA PRIMERA CAPA DE SEPARACION DE IN 0,52 AL 0,48 AS NO ADULTERADO, UNA SEGUNDA CAPA DE SEPARACION EN UNA ESTRUCTURA RETICULAR SUPERPUESTA DE IN 0,52 AL 0,48 AS NO ADULTERADO Y AL 0,25 GA 0,75 AS NO ADULTERADO, UNA TERCERA CA PA DE SEPARACION DE IN 0,52 AL 0,48 AS NO ADULTERADO, UNA CAPA DE CANAL DE IN 0,53 GA 0,47 AS, UNA CAPA DISTANCIADORA DE IN 0,52 AL 0,48 AS, NO ADULTERADO, UNA CA PA DE ADULTERACION DELTA DE SILICIO Y UNA CAPA SCHOTTKY DE IN SUB,0,52 AL 0,48 AS SON SATISFACTORIAMENTE SUPERPUESTAS. S OBRE LA CAPA SCHOTTKY, SE FORMA UNA CAPA DE RECUBRIMIENTO EN UNA ESTRUCTURA REBAJADA. SOBRE LA CAPA DE RECUBRIMIENTO, SE FORMAN UN ELECTRODO DE FUENTE Y UN ELECTRODO DE DRENAJE, CON UN ELECTRODO DE PUERTA EN UN AREA REBAJADA DE LA CAPA DE RECUBRIMIENTO.
ES98103825T 1997-03-05 1998-03-04 Transistor con efecto de campo. Expired - Lifetime ES2184155T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9050618A JPH10247727A (ja) 1997-03-05 1997-03-05 電界効果型トランジスタ

Publications (1)

Publication Number Publication Date
ES2184155T3 true ES2184155T3 (es) 2003-04-01

Family

ID=12863974

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98103825T Expired - Lifetime ES2184155T3 (es) 1997-03-05 1998-03-04 Transistor con efecto de campo.

Country Status (8)

Country Link
EP (1) EP0863554B1 (es)
JP (1) JPH10247727A (es)
KR (1) KR19980079943A (es)
CN (1) CN1155099C (es)
CA (1) CA2231206A1 (es)
DE (1) DE69808161T2 (es)
ES (1) ES2184155T3 (es)
TW (1) TW375841B (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462361B1 (en) 1995-12-27 2002-10-08 Showa Denko K.K. GaInP epitaxial stacking structure and fabrication method thereof, and a FET transistor using this structure
TW522574B (en) * 1999-09-28 2003-03-01 Showa Denko Kk GaInP epitaxial stacking structure, a GaInP epitaxial stacking structure for FETs and a fabrication method thereof
US7297977B2 (en) * 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7465972B2 (en) * 2005-01-21 2008-12-16 Taiwan Semiconductor Manufacturing Company, Ltd. High performance CMOS device design
JP5495069B2 (ja) * 2011-05-17 2014-05-21 古河電気工業株式会社 半導体素子及びその製造方法
CN103026492B (zh) * 2011-06-30 2016-04-06 株式会社日本有机雷特显示器 薄膜晶体管器件以及薄膜晶体管器件的制造方法
US8941123B2 (en) * 2013-05-30 2015-01-27 International Business Machines Corporation Local interconnects by metal-III-V alloy wiring in semi-insulating III-V substrates
JP6507912B2 (ja) 2015-07-30 2019-05-08 三菱電機株式会社 半導体受光素子

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666334B2 (ja) * 1987-02-10 1994-08-24 日本電気株式会社 電界効果トランジスタ
JPS63278277A (ja) * 1987-05-09 1988-11-15 Fujitsu Ltd 化合物半導体装置
JPH01233776A (ja) * 1988-03-14 1989-09-19 Nec Corp ヘテロ接合電界効果トランジスタ
JPH01256176A (ja) * 1988-04-05 1989-10-12 Fujitsu Ltd 化合物半導体装置
JPH02150038A (ja) * 1988-11-30 1990-06-08 Sharp Corp 変調ドープ電界効果トランジスタ
JPH04369842A (ja) * 1991-06-19 1992-12-22 Matsushita Electric Ind Co Ltd ヘテロ接合電界効果トランジスタ
JP2611735B2 (ja) * 1993-12-22 1997-05-21 日本電気株式会社 ヘテロ接合ｆｅｔ
US5856685A (en) * 1995-02-22 1999-01-05 Nec Corporation Heterojunction field effect transistor

Also Published As

Publication number Publication date
DE69808161T2 (de) 2003-01-30
CN1192587A (zh) 1998-09-09
DE69808161D1 (de) 2002-10-31
EP0863554B1 (en) 2002-09-25
CN1155099C (zh) 2004-06-23
EP0863554A3 (en) 1998-12-30
JPH10247727A (ja) 1998-09-14
CA2231206A1 (en) 1998-09-05
KR19980079943A (ko) 1998-11-25
EP0863554A2 (en) 1998-09-09
TW375841B (en) 1999-12-01

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