ES2073113T3 - Composicion adhesiva sensible a la presion y reactiva a las radiaciones actinicas. - Google Patents

Composicion adhesiva sensible a la presion y reactiva a las radiaciones actinicas.

Info

Publication number
ES2073113T3
ES2073113T3 ES91300202T ES91300202T ES2073113T3 ES 2073113 T3 ES2073113 T3 ES 2073113T3 ES 91300202 T ES91300202 T ES 91300202T ES 91300202 T ES91300202 T ES 91300202T ES 2073113 T3 ES2073113 T3 ES 2073113T3
Authority
ES
Spain
Prior art keywords
actinic radiation
pressure
reactive
adhesive composition
composition sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91300202T
Other languages
English (en)
Inventor
Kazuo Ohkawa
Seiichi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Application granted granted Critical
Publication of ES2073113T3 publication Critical patent/ES2073113T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

UNA COMPOSICION ADHESIVA DE LA PRESION SENSITIVA DE UN REACTIVO DE RADIACION ACTINICA, PUEDE SER REMEDIADA CON AIRE A ALTA PRESION, SIN CREAR IRRITACION Y MALOS OLORES. (1) UN COMPUESTO ORGANICO ADHESIVO DE PRESION SENSITIVA Y, (2) COMPRENDIENDO UNA RESINA ACTINICA DE RADIACION CURABLE (1), UNO O MAS COMPUESTOS DE POLITILES Y (2) UNO O MAS COMPUESTOS DE POLIENO, CADA UNO TENIENDO POR LO MENOS DOS REACTIVOS DE REACCION CARBON-A-CARBON EN DOBLE VINCULO EN LA MOLECULA.
ES91300202T 1990-01-12 1991-01-11 Composicion adhesiva sensible a la presion y reactiva a las radiaciones actinicas. Expired - Lifetime ES2073113T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00493690A JP3181284B2 (ja) 1990-01-12 1990-01-12 エネルギー線反応性粘着剤組成物

Publications (1)

Publication Number Publication Date
ES2073113T3 true ES2073113T3 (es) 1995-08-01

Family

ID=11597465

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91300202T Expired - Lifetime ES2073113T3 (es) 1990-01-12 1991-01-11 Composicion adhesiva sensible a la presion y reactiva a las radiaciones actinicas.

Country Status (7)

Country Link
US (2) US5278199A (es)
EP (1) EP0439258B1 (es)
JP (1) JP3181284B2 (es)
AT (1) ATE122088T1 (es)
DE (1) DE69109309T2 (es)
DK (1) DK0439258T3 (es)
ES (1) ES2073113T3 (es)

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JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
US5616670A (en) * 1993-11-10 1997-04-01 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good oily surface adhesion
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5602221A (en) * 1993-11-10 1997-02-11 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good low energy surface adhesion
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
US5654387A (en) * 1993-11-10 1997-08-05 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JPH08267668A (ja) * 1995-03-29 1996-10-15 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
US6008296A (en) 1995-04-19 1999-12-28 Optima, Inc. Optical terpolymer of polyisocyanate, polythiol and polyene monomers
EP1249479B1 (en) * 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
JP3300610B2 (ja) * 1996-08-14 2002-07-08 旭光学工業株式会社 紫外線硬化性組成物
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5777024A (en) * 1997-04-30 1998-07-07 The Valspar Corporation Urethane resins and coating compositions and methods for their use
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US6759273B2 (en) * 2000-12-05 2004-07-06 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
US6645263B2 (en) 2001-05-22 2003-11-11 3M Innovative Properties Company Cellular abrasive article
US6641627B2 (en) * 2001-05-22 2003-11-04 3M Innovative Properties Company Abrasive articles
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US7166182B2 (en) * 2002-09-04 2007-01-23 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
US7616374B2 (en) * 2002-09-23 2009-11-10 Sipix Imaging, Inc. Electrophoretic displays with improved high temperature performance
US6887917B2 (en) * 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7572491B2 (en) * 2003-01-24 2009-08-11 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
TWI230832B (en) * 2003-01-24 2005-04-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
US9346987B2 (en) * 2003-01-24 2016-05-24 E Ink California, Llc Adhesive and sealing layers for electrophoretic displays
EP1634673A4 (en) * 2003-04-25 2009-04-08 Nitto Denko Corp METHOD FOR PRODUCING A LASER-TREATED PRODUCT AND AN ADHESIVE SHEET FOR A LASER TREATMENT USED FOR THIS PRODUCT
WO2005019365A2 (en) * 2003-08-20 2005-03-03 Koninklijke Philips Electronics N.V. Non-leaching adhesive system and its use in a liquid immersion objective
ES2666643T3 (es) * 2003-11-05 2018-05-07 E Ink Corporation Medio electroforético para pantallas electro-ópticas
ATE553638T1 (de) * 2003-12-25 2012-04-15 Nitto Denko Corp Verfahren zur herstellung durch laser werkstücke
WO2005085309A2 (de) * 2004-03-05 2005-09-15 Crylas Gmbh Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung
US20060052540A1 (en) 2004-09-09 2006-03-09 Maria Ellul Thermoplastic vulcanizates
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
US7678529B2 (en) * 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4881208B2 (ja) * 2007-03-30 2012-02-22 リンテック株式会社 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム
JP5356661B2 (ja) * 2007-06-21 2013-12-04 日本化薬株式会社 光硬化型透明接着剤組成物
US8092921B2 (en) * 2007-08-17 2012-01-10 Ppg Industries Ohio, Inc Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings
CN101382668B (zh) * 2007-09-04 2010-09-08 成都博深高技术材料开发有限公司 热敏调光材料及其制备方法和由其构成的光学器件
JP5464810B2 (ja) * 2008-03-13 2014-04-09 日本合成化学工業株式会社 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
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JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
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US11809100B2 (en) 2012-03-05 2023-11-07 Landa Corporation Ltd. Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems
JP5991833B2 (ja) * 2012-03-26 2016-09-14 日本合成化学工業株式会社 アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物
JP6261914B2 (ja) * 2013-08-30 2018-01-17 株式会社イノアック技術研究所 粘着性接着剤、積層体および積層体の製造方法
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JP6890118B2 (ja) 2015-08-18 2021-06-18 スリーエム イノベイティブ プロパティズ カンパニー ポリエステル組成物
JP6800215B2 (ja) 2015-08-18 2020-12-16 スリーエム イノベイティブ プロパティズ カンパニー 耐衝撃性ポリエステル感圧接着剤
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Also Published As

Publication number Publication date
EP0439258A2 (en) 1991-07-31
DE69109309T2 (de) 1995-09-28
US5360873A (en) 1994-11-01
JPH03210312A (ja) 1991-09-13
DE69109309D1 (de) 1995-06-08
JP3181284B2 (ja) 2001-07-03
ATE122088T1 (de) 1995-05-15
EP0439258B1 (en) 1995-05-03
EP0439258A3 (en) 1992-04-29
US5278199A (en) 1994-01-11
DK0439258T3 (da) 1995-07-17

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