ATE122088T1 - Gegen aktinische strahlung empfindliche, selbstklebende klebstoffzusammensetzung. - Google Patents

Gegen aktinische strahlung empfindliche, selbstklebende klebstoffzusammensetzung.

Info

Publication number
ATE122088T1
ATE122088T1 AT91300202T AT91300202T ATE122088T1 AT E122088 T1 ATE122088 T1 AT E122088T1 AT 91300202 T AT91300202 T AT 91300202T AT 91300202 T AT91300202 T AT 91300202T AT E122088 T1 ATE122088 T1 AT E122088T1
Authority
AT
Austria
Prior art keywords
actinic radiation
adhesive
self
adhesive composition
composition sensitive
Prior art date
Application number
AT91300202T
Other languages
English (en)
Inventor
Kazuo Ohkawa
Seiichi Saito
Original Assignee
Asahi Denka Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo Kk filed Critical Asahi Denka Kogyo Kk
Application granted granted Critical
Publication of ATE122088T1 publication Critical patent/ATE122088T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
AT91300202T 1990-01-12 1991-01-11 Gegen aktinische strahlung empfindliche, selbstklebende klebstoffzusammensetzung. ATE122088T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00493690A JP3181284B2 (ja) 1990-01-12 1990-01-12 エネルギー線反応性粘着剤組成物

Publications (1)

Publication Number Publication Date
ATE122088T1 true ATE122088T1 (de) 1995-05-15

Family

ID=11597465

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91300202T ATE122088T1 (de) 1990-01-12 1991-01-11 Gegen aktinische strahlung empfindliche, selbstklebende klebstoffzusammensetzung.

Country Status (7)

Country Link
US (2) US5278199A (de)
EP (1) EP0439258B1 (de)
JP (1) JP3181284B2 (de)
AT (1) ATE122088T1 (de)
DE (1) DE69109309T2 (de)
DK (1) DK0439258T3 (de)
ES (1) ES2073113T3 (de)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0539973A3 (en) * 1991-11-01 1995-07-12 Furukawa Electric Co Ltd A surface-protection method during etching
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
US5616670A (en) * 1993-11-10 1997-04-01 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good oily surface adhesion
US5602221A (en) * 1993-11-10 1997-02-11 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good low energy surface adhesion
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
US5654387A (en) * 1993-11-10 1997-08-05 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JPH08267668A (ja) * 1995-03-29 1996-10-15 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
US6008296A (en) 1995-04-19 1999-12-28 Optima, Inc. Optical terpolymer of polyisocyanate, polythiol and polyene monomers
DE69727714T2 (de) * 1996-07-15 2004-11-25 Sekisui Kagaku Kogyo K.K. Verfahren zum Verbinden von Teilen
JP3300610B2 (ja) * 1996-08-14 2002-07-08 旭光学工業株式会社 紫外線硬化性組成物
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5777024A (en) * 1997-04-30 1998-07-07 The Valspar Corporation Urethane resins and coating compositions and methods for their use
US5872158A (en) * 1997-06-12 1999-02-16 International Business Machines Corporation Cleavable diacrylate for removable acrylate compositions
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
US6174578B1 (en) * 1997-10-24 2001-01-16 Rexam Industries Corp. Radiation deactivatable adhesive tape
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US7105226B2 (en) * 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
US6342122B1 (en) * 2000-08-07 2002-01-29 Ashland Chemical, Inc. UV post curable pressure sensitive adhesives for membrane switch applications and their Production
US6946326B2 (en) * 2000-12-05 2005-09-20 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
US6641627B2 (en) * 2001-05-22 2003-11-04 3M Innovative Properties Company Abrasive articles
US6645263B2 (en) 2001-05-22 2003-11-11 3M Innovative Properties Company Cellular abrasive article
EP1460625A1 (de) * 2001-11-30 2004-09-22 TDK Corporation Informationsmedium-masterherstellungsverfahren, informationsmedium-stanzerherstellungsverfahren, informationsmedium-masterherstellungsvorrichtung und informationsmedium-stanzerherstellungsvorrichtung
WO2003077239A1 (fr) * 2002-03-11 2003-09-18 Tdk Corporation Procede de traitement conçu pour une matrice en resine photosensible, procede de production d'une matrice utilisant un support d'enregistrement, procede de production d'un support d'enregistrement, matrice en resine photosensible, matrice utilisant un support d'enregistrment et support d'enregistrement
TW575646B (en) * 2002-09-04 2004-02-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
US7166182B2 (en) * 2002-09-04 2007-01-23 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
US7616374B2 (en) * 2002-09-23 2009-11-10 Sipix Imaging, Inc. Electrophoretic displays with improved high temperature performance
US6887917B2 (en) * 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US9346987B2 (en) * 2003-01-24 2016-05-24 E Ink California, Llc Adhesive and sealing layers for electrophoretic displays
US7572491B2 (en) * 2003-01-24 2009-08-11 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
TWI230832B (en) * 2003-01-24 2005-04-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
EP1634673A4 (de) * 2003-04-25 2009-04-08 Nitto Denko Corp Verfahren zur herstellung eines mit einem laser bearbeiteten produkts und einer dafür verwendeten klebefolie zur laserbearbeitung
EP1658343B1 (de) * 2003-08-20 2007-05-09 Koninklijke Philips Electronics N.V. Nicht auslaufendes klebstoffsystem und seine verwendung im immersionsobjektiv
ES2666643T3 (es) * 2003-11-05 2018-05-07 E Ink Corporation Medio electroforético para pantallas electro-ópticas
WO2005063435A1 (ja) * 2003-12-25 2005-07-14 Nitto Denko Corporation レーザー加工用保護シート及びレーザー加工品の製造方法
WO2005085309A2 (de) * 2004-03-05 2005-09-15 Crylas Gmbh Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung
US20060052540A1 (en) 2004-09-09 2006-03-09 Maria Ellul Thermoplastic vulcanizates
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
US7678529B2 (en) * 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4881208B2 (ja) * 2007-03-30 2012-02-22 リンテック株式会社 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム
JP5356661B2 (ja) * 2007-06-21 2013-12-04 日本化薬株式会社 光硬化型透明接着剤組成物
US8092921B2 (en) * 2007-08-17 2012-01-10 Ppg Industries Ohio, Inc Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings
CN101382668B (zh) * 2007-09-04 2010-09-08 成都博深高技术材料开发有限公司 热敏调光材料及其制备方法和由其构成的光学器件
JP5464810B2 (ja) * 2008-03-13 2014-04-09 日本合成化学工業株式会社 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US20120261066A1 (en) * 2011-04-15 2012-10-18 Covidien Ag Sealed Device and Method of Sealing
JP6112014B2 (ja) * 2011-11-17 2017-04-12 株式会社スリーボンド アクリル樹脂組成物
JP5820306B2 (ja) * 2012-03-01 2015-11-24 株式会社イノアック技術研究所 粘着組成物および粘着組成物の製造方法
US11809100B2 (en) 2012-03-05 2023-11-07 Landa Corporation Ltd. Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems
JP5991833B2 (ja) * 2012-03-26 2016-09-14 日本合成化学工業株式会社 アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物
JP6261914B2 (ja) * 2013-08-30 2018-01-17 株式会社イノアック技術研究所 粘着性接着剤、積層体および積層体の製造方法
US11806997B2 (en) 2015-04-14 2023-11-07 Landa Corporation Ltd. Indirect printing system and related apparatus
EP3337868B1 (de) 2015-08-18 2022-02-09 3M Innovative Properties Company Schlagzäher polyesterhaftklebstoff
EP3337869B1 (de) 2015-08-18 2021-01-06 3M Innovative Properties Company Chemikalienbeständiger polyesterhaftkleberstoff
JP6890118B2 (ja) 2015-08-18 2021-06-18 スリーエム イノベイティブ プロパティズ カンパニー ポリエステル組成物
WO2017189389A1 (en) 2016-04-29 2017-11-02 3M Innovative Properties Company Adhesive and damping film
GB201609463D0 (en) 2016-05-30 2016-07-13 Landa Labs 2012 Ltd Method of manufacturing a multi-layer article
CN114148099A (zh) 2016-05-30 2022-03-08 兰达公司 数字印刷方法
EP3651991A4 (de) * 2017-07-14 2021-04-07 Landa Corporation Ltd. Übertragungs-zwischenelement
EP3854827B1 (de) * 2018-09-18 2023-11-08 i-Sens, Inc. Oxidationsreduktionspolymer mit übergangsmetallkomplex und elektrochemischer biosensor damit
WO2020075012A1 (en) 2018-10-08 2020-04-16 Landa Corporation Ltd. Friction reduction means for printing systems and method
EP4066064A4 (de) 2019-11-25 2024-01-10 Landa Corp Ltd Trocknen von tinte im digitaldruck mit infrarotstrahlung, die von in einem itm eingebetteten partikeln absorbiert wird

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920877A (en) * 1971-07-01 1975-11-18 Grace W R & Co Fully cured crosslinkable pressure sensitive adhesive materials and method of making same
US3925320A (en) * 1972-05-05 1975-12-09 Grace W R & Co Solid curable polyene compositions containing liquid polythiols and solid styrene-allyl alcohol copolymer based polyenes
US3908039A (en) * 1973-10-25 1975-09-23 Grace W R & Co Photocurable polyene-polythiol lacquer composition
US4234676A (en) * 1978-01-23 1980-11-18 W. R. Grace & Co. Polythiol effect curable polymeric composition
US4264658A (en) * 1978-07-10 1981-04-28 Owens-Illinois, Inc. Three-component polymeric coating for glass substrate
JPS6020427B2 (ja) * 1983-06-17 1985-05-22 日立化成工業株式会社 放射線硬化型感圧性接着剤組成物
JPS60124677A (ja) * 1983-12-09 1985-07-03 Hitachi Chem Co Ltd 放射線硬化型粘着テ−プ類の製造方法
US4587313A (en) * 1984-11-20 1986-05-06 Hitachi Chemical Company, Ltd. Radiation curable pressure-sensitive adhesive composition
DE3665191D1 (en) * 1985-02-14 1989-09-28 Bando Chemical Ind A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
US4820746A (en) * 1986-08-12 1989-04-11 Avery International Corporation Radiation-cured rubber-based pressure-sensitive adhesive
EP0298448B1 (de) * 1987-07-08 1994-06-29 The Furukawa Electric Co., Ltd. Strahlungsvernetzbare Klebestreifen

Also Published As

Publication number Publication date
US5360873A (en) 1994-11-01
DK0439258T3 (da) 1995-07-17
ES2073113T3 (es) 1995-08-01
DE69109309T2 (de) 1995-09-28
US5278199A (en) 1994-01-11
JPH03210312A (ja) 1991-09-13
EP0439258B1 (de) 1995-05-03
DE69109309D1 (de) 1995-06-08
EP0439258A2 (de) 1991-07-31
EP0439258A3 (en) 1992-04-29
JP3181284B2 (ja) 2001-07-03

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