DK0439258T3 - Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale - Google Patents
Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmaterialeInfo
- Publication number
- DK0439258T3 DK0439258T3 DK91300202.8T DK91300202T DK0439258T3 DK 0439258 T3 DK0439258 T3 DK 0439258T3 DK 91300202 T DK91300202 T DK 91300202T DK 0439258 T3 DK0439258 T3 DK 0439258T3
- Authority
- DK
- Denmark
- Prior art keywords
- actinic radiation
- sensitive adhesive
- pressure
- adhesive material
- reactive
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract 3
- 239000000463 material Substances 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000007794 irritation Effects 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- -1 polyene compounds Chemical class 0.000 abstract 1
- 229920006295 polythiol Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP00493690A JP3181284B2 (ja) | 1990-01-12 | 1990-01-12 | エネルギー線反応性粘着剤組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0439258T3 true DK0439258T3 (da) | 1995-07-17 |
Family
ID=11597465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK91300202.8T DK0439258T3 (da) | 1990-01-12 | 1991-01-11 | Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale |
Country Status (7)
Country | Link |
---|---|
US (2) | US5278199A (da) |
EP (1) | EP0439258B1 (da) |
JP (1) | JP3181284B2 (da) |
AT (1) | ATE122088T1 (da) |
DE (1) | DE69109309T2 (da) |
DK (1) | DK0439258T3 (da) |
ES (1) | ES2073113T3 (da) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5300172A (en) * | 1991-11-01 | 1994-04-05 | The Furukawa Electric Co., Ltd. | Surface-protection method during etching |
JP3410202B2 (ja) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
US5616670A (en) * | 1993-11-10 | 1997-04-01 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good oily surface adhesion |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US5654387A (en) * | 1993-11-10 | 1997-08-05 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives |
US5602221A (en) * | 1993-11-10 | 1997-02-11 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good low energy surface adhesion |
US5683798A (en) * | 1993-11-10 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
JP3081122B2 (ja) * | 1994-07-18 | 2000-08-28 | シャープ株式会社 | 基板搬送用治具及びそれを用いた液晶表示素子の製造方法 |
JPH08267668A (ja) * | 1995-03-29 | 1996-10-15 | Nitta Ind Corp | 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法 |
US6008296A (en) * | 1995-04-19 | 1999-12-28 | Optima, Inc. | Optical terpolymer of polyisocyanate, polythiol and polyene monomers |
EP0819746B1 (en) * | 1996-07-15 | 2004-05-06 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Sheet form, curable pressure-sensitive adhesive |
JP3300610B2 (ja) * | 1996-08-14 | 2002-07-08 | 旭光学工業株式会社 | 紫外線硬化性組成物 |
US5902678A (en) * | 1997-04-01 | 1999-05-11 | Nitto Denko Corporation | Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal |
US5777024A (en) * | 1997-04-30 | 1998-07-07 | The Valspar Corporation | Urethane resins and coating compositions and methods for their use |
US5872158A (en) * | 1997-06-12 | 1999-02-16 | International Business Machines Corporation | Cleavable diacrylate for removable acrylate compositions |
JP4072927B2 (ja) * | 1997-08-28 | 2008-04-09 | リンテック株式会社 | エネルギー線硬化型親水性粘着剤組成物およびその利用方法 |
US6174578B1 (en) * | 1997-10-24 | 2001-01-16 | Rexam Industries Corp. | Radiation deactivatable adhesive tape |
US6235387B1 (en) | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
US7105226B2 (en) * | 1998-08-26 | 2006-09-12 | Lintec Corporation | Pressure sensitive adhesive double coated sheet and method of use thereof |
US6342122B1 (en) * | 2000-08-07 | 2002-01-29 | Ashland Chemical, Inc. | UV post curable pressure sensitive adhesives for membrane switch applications and their Production |
US7022546B2 (en) * | 2000-12-05 | 2006-04-04 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
US6641627B2 (en) * | 2001-05-22 | 2003-11-04 | 3M Innovative Properties Company | Abrasive articles |
US6645263B2 (en) | 2001-05-22 | 2003-11-11 | 3M Innovative Properties Company | Cellular abrasive article |
EP1460625A1 (en) * | 2001-11-30 | 2004-09-22 | TDK Corporation | Information medium master manufacturing method, information medium stamper manufacturing method, information medium master manufacturing apparatus, and information medium stamper manufacturing apparatus |
US7297472B2 (en) * | 2002-03-11 | 2007-11-20 | Tdk Corporation | Processing method for photoresist master, production method for recording medium-use mater, production method for recording medium, photoresist master, recording medium-use master and recording medium |
US7166182B2 (en) * | 2002-09-04 | 2007-01-23 | Sipix Imaging, Inc. | Adhesive and sealing layers for electrophoretic displays |
TW575646B (en) * | 2002-09-04 | 2004-02-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
US7616374B2 (en) * | 2002-09-23 | 2009-11-10 | Sipix Imaging, Inc. | Electrophoretic displays with improved high temperature performance |
US6887917B2 (en) * | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
US9346987B2 (en) * | 2003-01-24 | 2016-05-24 | E Ink California, Llc | Adhesive and sealing layers for electrophoretic displays |
TWI230832B (en) * | 2003-01-24 | 2005-04-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
US7572491B2 (en) * | 2003-01-24 | 2009-08-11 | Sipix Imaging, Inc. | Adhesive and sealing layers for electrophoretic displays |
EP1634673A4 (en) * | 2003-04-25 | 2009-04-08 | Nitto Denko Corp | METHOD FOR PRODUCING A LASER-TREATED PRODUCT AND AN ADHESIVE SHEET FOR A LASER TREATMENT USED FOR THIS PRODUCT |
DE602004006426T2 (de) * | 2003-08-20 | 2008-01-10 | Koninklijke Philips Electronics N.V. | Nicht auslaufendes klebstoffsystem und seine verwendung im immersionsobjektiv |
WO2005048228A2 (en) * | 2003-11-05 | 2005-05-26 | E Ink Corporation | Electro-optic displays |
EP1714730B1 (en) * | 2003-12-25 | 2012-04-11 | Nitto Denko Corporation | Method of manufacturing by laser workpieces |
WO2005085309A2 (de) * | 2004-03-05 | 2005-09-15 | Crylas Gmbh | Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung |
US20060052540A1 (en) | 2004-09-09 | 2006-03-09 | Maria Ellul | Thermoplastic vulcanizates |
JP4854061B2 (ja) * | 2005-01-14 | 2012-01-11 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
JP4873863B2 (ja) * | 2005-01-14 | 2012-02-08 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用粘着シート |
JP2006309114A (ja) * | 2005-03-30 | 2006-11-09 | Lintec Corp | 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法 |
US7678529B2 (en) * | 2005-11-21 | 2010-03-16 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method |
JP5140996B2 (ja) * | 2006-08-29 | 2013-02-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
JP4881208B2 (ja) * | 2007-03-30 | 2012-02-22 | リンテック株式会社 | 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム |
JP5356661B2 (ja) * | 2007-06-21 | 2013-12-04 | 日本化薬株式会社 | 光硬化型透明接着剤組成物 |
US8092921B2 (en) * | 2007-08-17 | 2012-01-10 | Ppg Industries Ohio, Inc | Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings |
CN101382668B (zh) * | 2007-09-04 | 2010-09-08 | 成都博深高技术材料开发有限公司 | 热敏调光材料及其制备方法和由其构成的光学器件 |
JP5464810B2 (ja) * | 2008-03-13 | 2014-04-09 | 日本合成化学工業株式会社 | 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法 |
JP5503357B2 (ja) * | 2009-03-23 | 2014-05-28 | 古河電気工業株式会社 | ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法 |
JP5068793B2 (ja) * | 2009-09-24 | 2012-11-07 | リンテック株式会社 | 粘着シート |
JP5762781B2 (ja) * | 2011-03-22 | 2015-08-12 | リンテック株式会社 | 基材フィルムおよび該基材フィルムを備えた粘着シート |
US20120261066A1 (en) * | 2011-04-15 | 2012-10-18 | Covidien Ag | Sealed Device and Method of Sealing |
US20140309327A1 (en) * | 2011-11-17 | 2014-10-16 | Three Bond Fine Chemical Co., Ltd. | Acrylic resin composition |
JP5820306B2 (ja) * | 2012-03-01 | 2015-11-24 | 株式会社イノアック技術研究所 | 粘着組成物および粘着組成物の製造方法 |
US11809100B2 (en) | 2012-03-05 | 2023-11-07 | Landa Corporation Ltd. | Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems |
JP5991833B2 (ja) * | 2012-03-26 | 2016-09-14 | 日本合成化学工業株式会社 | アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物 |
JP6261914B2 (ja) * | 2013-08-30 | 2018-01-17 | 株式会社イノアック技術研究所 | 粘着性接着剤、積層体および積層体の製造方法 |
US11806997B2 (en) | 2015-04-14 | 2023-11-07 | Landa Corporation Ltd. | Indirect printing system and related apparatus |
KR20180031752A (ko) | 2015-08-18 | 2018-03-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리에스테르 조성물 |
EP3337869B1 (en) | 2015-08-18 | 2021-01-06 | 3M Innovative Properties Company | Chemical-resistant polyester pressure-sensitive adhesive |
WO2017030881A1 (en) | 2015-08-18 | 2017-02-23 | 3M Innovative Properties Company | Impact-resistant polyester pressure-sensitive adhesive |
CN109072034B (zh) | 2016-04-29 | 2021-05-07 | 3M创新有限公司 | 粘合剂和阻尼膜 |
CN114148099A (zh) | 2016-05-30 | 2022-03-08 | 兰达公司 | 数字印刷方法 |
GB201609463D0 (en) | 2016-05-30 | 2016-07-13 | Landa Labs 2012 Ltd | Method of manufacturing a multi-layer article |
WO2019012456A1 (en) * | 2017-07-14 | 2019-01-17 | Landa Corporation Ltd. | INTERMEDIATE TRANSFER ELEMENT |
JP7083069B2 (ja) * | 2018-09-18 | 2022-06-09 | アイセンス,インコーポレーテッド | 遷移金属複合体を含む酸化-還元高分子およびこれを利用した電気化学的バイオセンサ |
JP7246496B2 (ja) | 2018-10-08 | 2023-03-27 | ランダ コーポレイション リミテッド | 印刷システムおよび方法に関する摩擦低減手段 |
US11833813B2 (en) | 2019-11-25 | 2023-12-05 | Landa Corporation Ltd. | Drying ink in digital printing using infrared radiation |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3920877A (en) * | 1971-07-01 | 1975-11-18 | Grace W R & Co | Fully cured crosslinkable pressure sensitive adhesive materials and method of making same |
US3925320A (en) * | 1972-05-05 | 1975-12-09 | Grace W R & Co | Solid curable polyene compositions containing liquid polythiols and solid styrene-allyl alcohol copolymer based polyenes |
US3908039A (en) * | 1973-10-25 | 1975-09-23 | Grace W R & Co | Photocurable polyene-polythiol lacquer composition |
US4234676A (en) * | 1978-01-23 | 1980-11-18 | W. R. Grace & Co. | Polythiol effect curable polymeric composition |
US4264658A (en) * | 1978-07-10 | 1981-04-28 | Owens-Illinois, Inc. | Three-component polymeric coating for glass substrate |
JPS6020427B2 (ja) * | 1983-06-17 | 1985-05-22 | 日立化成工業株式会社 | 放射線硬化型感圧性接着剤組成物 |
JPS60124677A (ja) * | 1983-12-09 | 1985-07-03 | Hitachi Chem Co Ltd | 放射線硬化型粘着テ−プ類の製造方法 |
US4587313A (en) * | 1984-11-20 | 1986-05-06 | Hitachi Chemical Company, Ltd. | Radiation curable pressure-sensitive adhesive composition |
EP0194706B1 (en) * | 1985-02-14 | 1989-08-23 | Bando Chemical Industries, Ltd. | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
US4820746A (en) * | 1986-08-12 | 1989-04-11 | Avery International Corporation | Radiation-cured rubber-based pressure-sensitive adhesive |
EP0298448B1 (en) * | 1987-07-08 | 1994-06-29 | The Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
-
1990
- 1990-01-12 JP JP00493690A patent/JP3181284B2/ja not_active Expired - Lifetime
- 1990-12-21 US US07/632,190 patent/US5278199A/en not_active Expired - Fee Related
-
1991
- 1991-01-11 DE DE69109309T patent/DE69109309T2/de not_active Expired - Fee Related
- 1991-01-11 DK DK91300202.8T patent/DK0439258T3/da active
- 1991-01-11 ES ES91300202T patent/ES2073113T3/es not_active Expired - Lifetime
- 1991-01-11 AT AT91300202T patent/ATE122088T1/de active
- 1991-01-11 EP EP91300202A patent/EP0439258B1/en not_active Expired - Lifetime
-
1993
- 1993-08-20 US US08/110,078 patent/US5360873A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5360873A (en) | 1994-11-01 |
ATE122088T1 (de) | 1995-05-15 |
US5278199A (en) | 1994-01-11 |
EP0439258A2 (en) | 1991-07-31 |
DE69109309T2 (de) | 1995-09-28 |
DE69109309D1 (de) | 1995-06-08 |
EP0439258A3 (en) | 1992-04-29 |
JPH03210312A (ja) | 1991-09-13 |
ES2073113T3 (es) | 1995-08-01 |
JP3181284B2 (ja) | 2001-07-03 |
EP0439258B1 (en) | 1995-05-03 |
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