DK0439258T3 - Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale - Google Patents

Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Info

Publication number
DK0439258T3
DK0439258T3 DK91300202.8T DK91300202T DK0439258T3 DK 0439258 T3 DK0439258 T3 DK 0439258T3 DK 91300202 T DK91300202 T DK 91300202T DK 0439258 T3 DK0439258 T3 DK 0439258T3
Authority
DK
Denmark
Prior art keywords
actinic radiation
sensitive adhesive
pressure
adhesive material
reactive
Prior art date
Application number
DK91300202.8T
Other languages
English (en)
Inventor
Kazuo Ohkawa
Seiichi Saito
Original Assignee
Asahi Denka Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo Kk filed Critical Asahi Denka Kogyo Kk
Application granted granted Critical
Publication of DK0439258T3 publication Critical patent/DK0439258T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
DK91300202.8T 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale DK0439258T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00493690A JP3181284B2 (ja) 1990-01-12 1990-01-12 エネルギー線反応性粘着剤組成物

Publications (1)

Publication Number Publication Date
DK0439258T3 true DK0439258T3 (da) 1995-07-17

Family

ID=11597465

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91300202.8T DK0439258T3 (da) 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Country Status (7)

Country Link
US (2) US5278199A (da)
EP (1) EP0439258B1 (da)
JP (1) JP3181284B2 (da)
AT (1) ATE122088T1 (da)
DE (1) DE69109309T2 (da)
DK (1) DK0439258T3 (da)
ES (1) ES2073113T3 (da)

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US5616670A (en) * 1993-11-10 1997-04-01 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good oily surface adhesion
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5654387A (en) * 1993-11-10 1997-08-05 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives
US5602221A (en) * 1993-11-10 1997-02-11 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good low energy surface adhesion
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JPH08267668A (ja) * 1995-03-29 1996-10-15 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
US6008296A (en) * 1995-04-19 1999-12-28 Optima, Inc. Optical terpolymer of polyisocyanate, polythiol and polyene monomers
EP0819746B1 (en) * 1996-07-15 2004-05-06 Sekisui Kagaku Kogyo Kabushiki Kaisha Sheet form, curable pressure-sensitive adhesive
JP3300610B2 (ja) * 1996-08-14 2002-07-08 旭光学工業株式会社 紫外線硬化性組成物
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5777024A (en) * 1997-04-30 1998-07-07 The Valspar Corporation Urethane resins and coating compositions and methods for their use
US5872158A (en) * 1997-06-12 1999-02-16 International Business Machines Corporation Cleavable diacrylate for removable acrylate compositions
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
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US6641627B2 (en) * 2001-05-22 2003-11-04 3M Innovative Properties Company Abrasive articles
US6645263B2 (en) 2001-05-22 2003-11-11 3M Innovative Properties Company Cellular abrasive article
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US6887917B2 (en) * 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US9346987B2 (en) * 2003-01-24 2016-05-24 E Ink California, Llc Adhesive and sealing layers for electrophoretic displays
TWI230832B (en) * 2003-01-24 2005-04-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
US7572491B2 (en) * 2003-01-24 2009-08-11 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
EP1634673A4 (en) * 2003-04-25 2009-04-08 Nitto Denko Corp METHOD FOR PRODUCING A LASER-TREATED PRODUCT AND AN ADHESIVE SHEET FOR A LASER TREATMENT USED FOR THIS PRODUCT
DE602004006426T2 (de) * 2003-08-20 2008-01-10 Koninklijke Philips Electronics N.V. Nicht auslaufendes klebstoffsystem und seine verwendung im immersionsobjektiv
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US20060052540A1 (en) 2004-09-09 2006-03-09 Maria Ellul Thermoplastic vulcanizates
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
US7678529B2 (en) * 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4881208B2 (ja) * 2007-03-30 2012-02-22 リンテック株式会社 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム
JP5356661B2 (ja) * 2007-06-21 2013-12-04 日本化薬株式会社 光硬化型透明接着剤組成物
US8092921B2 (en) * 2007-08-17 2012-01-10 Ppg Industries Ohio, Inc Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings
CN101382668B (zh) * 2007-09-04 2010-09-08 成都博深高技术材料开发有限公司 热敏调光材料及其制备方法和由其构成的光学器件
JP5464810B2 (ja) * 2008-03-13 2014-04-09 日本合成化学工業株式会社 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US20120261066A1 (en) * 2011-04-15 2012-10-18 Covidien Ag Sealed Device and Method of Sealing
US20140309327A1 (en) * 2011-11-17 2014-10-16 Three Bond Fine Chemical Co., Ltd. Acrylic resin composition
JP5820306B2 (ja) * 2012-03-01 2015-11-24 株式会社イノアック技術研究所 粘着組成物および粘着組成物の製造方法
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JP5991833B2 (ja) * 2012-03-26 2016-09-14 日本合成化学工業株式会社 アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物
JP6261914B2 (ja) * 2013-08-30 2018-01-17 株式会社イノアック技術研究所 粘着性接着剤、積層体および積層体の製造方法
US11806997B2 (en) 2015-04-14 2023-11-07 Landa Corporation Ltd. Indirect printing system and related apparatus
KR20180031752A (ko) 2015-08-18 2018-03-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리에스테르 조성물
EP3337869B1 (en) 2015-08-18 2021-01-06 3M Innovative Properties Company Chemical-resistant polyester pressure-sensitive adhesive
WO2017030881A1 (en) 2015-08-18 2017-02-23 3M Innovative Properties Company Impact-resistant polyester pressure-sensitive adhesive
CN109072034B (zh) 2016-04-29 2021-05-07 3M创新有限公司 粘合剂和阻尼膜
CN114148099A (zh) 2016-05-30 2022-03-08 兰达公司 数字印刷方法
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JP7246496B2 (ja) 2018-10-08 2023-03-27 ランダ コーポレイション リミテッド 印刷システムおよび方法に関する摩擦低減手段
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Also Published As

Publication number Publication date
US5360873A (en) 1994-11-01
ATE122088T1 (de) 1995-05-15
US5278199A (en) 1994-01-11
EP0439258A2 (en) 1991-07-31
DE69109309T2 (de) 1995-09-28
DE69109309D1 (de) 1995-06-08
EP0439258A3 (en) 1992-04-29
JPH03210312A (ja) 1991-09-13
ES2073113T3 (es) 1995-08-01
JP3181284B2 (ja) 2001-07-03
EP0439258B1 (en) 1995-05-03

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