ES2070343T3 - Metodo para revestir sustratos con compuestos a base de silicio. - Google Patents
Metodo para revestir sustratos con compuestos a base de silicio.Info
- Publication number
- ES2070343T3 ES2070343T3 ES90917735T ES90917735T ES2070343T3 ES 2070343 T3 ES2070343 T3 ES 2070343T3 ES 90917735 T ES90917735 T ES 90917735T ES 90917735 T ES90917735 T ES 90917735T ES 2070343 T3 ES2070343 T3 ES 2070343T3
- Authority
- ES
- Spain
- Prior art keywords
- silicon
- based compounds
- coating substrates
- sputtering
- troublesome
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
UN METODO PARA DEPOSITAR PELICULAS FINAS DE COMPUESTOS CON BASE DE SILICIO, PARTICULARMENTE DIOXIDO DE SILICIO, MEDIANTE PULVERIZACION CATODO REACTIVA, QUE UTILIZA UN MAGNETRON CILINDRICO ROTATORIO (20) IMPULSADO POR UN POTENCIAL DE C.A. (30). EL RESULTADO ES UNA TECNICA DE FORMACION DE UNA PELICULA UNIFORME EN SUSTRATOS GRANDES (12) CON VELOCIDADES ALTAS DE DEPOSICION. LA FORMACION DE CHISPAS NORMALMENTE ASOCIADA CON LA PULVERIZACION DIFICULTOSA EN RECUBRIMIENTOS DIELECTRICOS TALES COMO OXIDOS DE SILICIO, SE ELIMINA SUSTANCIALMENTE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/433,690 US5047131A (en) | 1989-11-08 | 1989-11-08 | Method for coating substrates with silicon based compounds |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2070343T3 true ES2070343T3 (es) | 1995-06-01 |
Family
ID=23721176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES90917735T Expired - Lifetime ES2070343T3 (es) | 1989-11-08 | 1990-11-07 | Metodo para revestir sustratos con compuestos a base de silicio. |
Country Status (11)
Country | Link |
---|---|
US (1) | US5047131A (es) |
EP (1) | EP0502068B1 (es) |
JP (1) | JP3164364B2 (es) |
KR (1) | KR100199663B1 (es) |
AT (1) | ATE120806T1 (es) |
AU (1) | AU631710B2 (es) |
CA (1) | CA2069329C (es) |
DE (1) | DE69018479T2 (es) |
DK (1) | DK0502068T3 (es) |
ES (1) | ES2070343T3 (es) |
WO (1) | WO1991007519A1 (es) |
Families Citing this family (101)
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US5377045A (en) * | 1990-05-10 | 1994-12-27 | The Boc Group, Inc. | Durable low-emissivity solar control thin film coating |
BE1003701A3 (fr) * | 1990-06-08 | 1992-05-26 | Saint Roch Glaceries | Cathode rotative. |
US5427665A (en) * | 1990-07-11 | 1995-06-27 | Leybold Aktiengesellschaft | Process and apparatus for reactive coating of a substrate |
JP3516949B2 (ja) * | 1990-08-10 | 2004-04-05 | バイラテック・シン・フィルムズ・インコーポレイテッド | 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング |
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JPH0586462A (ja) * | 1991-06-28 | 1993-04-06 | Mitsubishi Materials Corp | スパツタリング用ターゲツト及びその製造方法 |
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TW221703B (es) * | 1992-03-04 | 1994-03-11 | Boc Group Inc | |
BE1007067A3 (nl) * | 1992-07-15 | 1995-03-07 | Emiel Vanderstraeten Besloten | Sputterkathode en werkwijze voor het vervaardigen van deze kathode. |
US5270248A (en) * | 1992-08-07 | 1993-12-14 | Mobil Solar Energy Corporation | Method for forming diffusion junctions in solar cell substrates |
US5946013A (en) * | 1992-12-22 | 1999-08-31 | Canon Kabushiki Kaisha | Ink jet head having a protective layer with a controlled argon content |
US5425860A (en) * | 1993-04-07 | 1995-06-20 | The Regents Of The University Of California | Pulsed energy synthesis and doping of silicon carbide |
CA2120875C (en) * | 1993-04-28 | 1999-07-06 | The Boc Group, Inc. | Durable low-emissivity solar control thin film coating |
CA2123479C (en) * | 1993-07-01 | 1999-07-06 | Peter A. Sieck | Anode structure for magnetron sputtering systems |
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FR2714917B1 (fr) * | 1994-01-07 | 1996-03-01 | Pechiney Recherche | Bande à base d'aluminium revêtue, résistant à la corrosion et déformable, procédé d'obtention et applications. |
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US5521765A (en) * | 1994-07-07 | 1996-05-28 | The Boc Group, Inc. | Electrically-conductive, contrast-selectable, contrast-improving filter |
US5510155A (en) * | 1994-09-06 | 1996-04-23 | Becton, Dickinson And Company | Method to reduce gas transmission |
FR2728559B1 (fr) * | 1994-12-23 | 1997-01-31 | Saint Gobain Vitrage | Substrats en verre revetus d'un empilement de couches minces a proprietes de reflexion dans l'infrarouge et/ou dans le domaine du rayonnement solaire |
FR2730990B1 (fr) | 1995-02-23 | 1997-04-04 | Saint Gobain Vitrage | Substrat transparent a revetement anti-reflets |
ES2202439T3 (es) * | 1995-04-25 | 2004-04-01 | Von Ardenne Anlagentechnik Gmbh | Sistema de pulverizacion que utiliza un magnetron cilindrico rotativo alimentado electricamente utilizando corriente alterna. |
DE19615242A1 (de) * | 1996-04-18 | 1997-10-23 | Daimler Benz Ag | Verfahren zur Herstellung von Schichtsystemen auf Kunststoffoberflächen |
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PL181650B1 (pl) | 1996-12-30 | 2001-08-31 | Jan Kuklinski | Uklad optyczny, przeksztalcajacy promieniowanie ultrafioletowe PL PL |
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US6391400B1 (en) | 1998-04-08 | 2002-05-21 | Thomas A. Russell | Thermal control films suitable for use in glazing |
JP2002512311A (ja) * | 1998-04-16 | 2002-04-23 | シンバコ・ナムローゼ・フエンノートシャップ | マグネトロンにおけるターゲットの腐食とスパッタリングの制御方法 |
US6660365B1 (en) | 1998-12-21 | 2003-12-09 | Cardinal Cg Company | Soil-resistant coating for glass surfaces |
US6974629B1 (en) | 1999-08-06 | 2005-12-13 | Cardinal Cg Company | Low-emissivity, soil-resistant coating for glass surfaces |
US6964731B1 (en) * | 1998-12-21 | 2005-11-15 | Cardinal Cg Company | Soil-resistant coating for glass surfaces |
JP2000239827A (ja) * | 1998-12-22 | 2000-09-05 | Bridgestone Corp | 積層構造体及びその製造方法 |
US6352626B1 (en) | 1999-04-19 | 2002-03-05 | Von Zweck Heimart | Sputter ion source for boron and other targets |
US6652974B1 (en) | 1999-05-18 | 2003-11-25 | Cardinal Ig Company | Hard, scratch-resistant coatings for substrates |
EP1251188B1 (en) | 1999-10-13 | 2008-01-09 | AGC Ceramics Co., Ltd. | Sputtering target and method for preparing the same and film-forming method |
US20100330748A1 (en) | 1999-10-25 | 2010-12-30 | Xi Chu | Method of encapsulating an environmentally sensitive device |
US6413645B1 (en) | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US7198832B2 (en) * | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
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US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
TWI259525B (en) * | 2002-03-29 | 2006-08-01 | Ritek Corp | Method of fabricating multi-layer mirror |
US8808457B2 (en) * | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US8900366B2 (en) | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
US7157123B2 (en) * | 2002-12-18 | 2007-01-02 | Cardinal Cg Company | Plasma-enhanced film deposition |
US20040200418A1 (en) * | 2003-01-03 | 2004-10-14 | Klaus Hartig | Plasma spray systems and methods of uniformly coating rotary cylindrical targets |
US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
US7014741B2 (en) * | 2003-02-21 | 2006-03-21 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron with self cleaning target |
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US7648925B2 (en) | 2003-04-11 | 2010-01-19 | Vitex Systems, Inc. | Multilayer barrier stacks and methods of making multilayer barrier stacks |
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US20060065524A1 (en) * | 2004-09-30 | 2006-03-30 | Richard Newcomb | Non-bonded rotatable targets for sputtering |
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US8652310B2 (en) * | 2008-07-24 | 2014-02-18 | Seagate Technology Llc | Trim magnets to adjust erosion rate of cylindrical sputter targets |
US9337446B2 (en) | 2008-12-22 | 2016-05-10 | Samsung Display Co., Ltd. | Encapsulated RGB OLEDs having enhanced optical output |
US9184410B2 (en) | 2008-12-22 | 2015-11-10 | Samsung Display Co., Ltd. | Encapsulated white OLEDs having enhanced optical output |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
TW201110831A (en) * | 2009-09-03 | 2011-03-16 | Chunghwa Picture Tubes Ltd | Plasma apparatus and method of fabricating nano-crystalline silicon thin film |
JP5270505B2 (ja) * | 2009-10-05 | 2013-08-21 | 株式会社神戸製鋼所 | プラズマcvd装置 |
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US8590338B2 (en) | 2009-12-31 | 2013-11-26 | Samsung Mobile Display Co., Ltd. | Evaporator with internal restriction |
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US3826728B2 (en) * | 1970-05-20 | 1994-07-12 | Boc Group Plc | Transparent article having reduced solar radiation transmittance and method of making same |
US3798146A (en) * | 1973-06-06 | 1974-03-19 | Shatterproof Glass Corp | Method of making a transparent article having reduced radiation transmittance |
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US4046659A (en) * | 1974-05-10 | 1977-09-06 | Airco, Inc. | Method for coating a substrate |
US3956093A (en) * | 1974-12-16 | 1976-05-11 | Airco, Inc. | Planar magnetron sputtering method and apparatus |
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US4131530A (en) * | 1977-07-05 | 1978-12-26 | Airco, Inc. | Sputtered chromium-alloy coating for plastic |
DE3047113A1 (de) * | 1980-12-13 | 1982-07-29 | Leybold-Heraeus GmbH, 5000 Köln | Katodenanordnung und regelverfahren fuer katodenzerstaeubungsanlagen mit einem magnetsystem zur erhoehung der zerstaeubungsrate |
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-
1989
- 1989-11-08 US US07/433,690 patent/US5047131A/en not_active Expired - Lifetime
-
1990
- 1990-11-07 KR KR1019920701089A patent/KR100199663B1/ko not_active IP Right Cessation
- 1990-11-07 WO PCT/US1990/006459 patent/WO1991007519A1/en active IP Right Grant
- 1990-11-07 AU AU68730/91A patent/AU631710B2/en not_active Ceased
- 1990-11-07 EP EP90917735A patent/EP0502068B1/en not_active Expired - Lifetime
- 1990-11-07 JP JP50051491A patent/JP3164364B2/ja not_active Expired - Fee Related
- 1990-11-07 DK DK90917735.4T patent/DK0502068T3/da active
- 1990-11-07 DE DE69018479T patent/DE69018479T2/de not_active Expired - Fee Related
- 1990-11-07 AT AT90917735T patent/ATE120806T1/de not_active IP Right Cessation
- 1990-11-07 ES ES90917735T patent/ES2070343T3/es not_active Expired - Lifetime
- 1990-11-07 CA CA002069329A patent/CA2069329C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1991007519A1 (en) | 1991-05-30 |
US5047131A (en) | 1991-09-10 |
DE69018479D1 (de) | 1995-05-11 |
KR100199663B1 (ko) | 1999-06-15 |
DE69018479T2 (de) | 1995-12-14 |
AU631710B2 (en) | 1992-12-03 |
JPH05501587A (ja) | 1993-03-25 |
ATE120806T1 (de) | 1995-04-15 |
DK0502068T3 (da) | 1995-06-19 |
EP0502068A1 (en) | 1992-09-09 |
AU6873091A (en) | 1991-06-13 |
CA2069329C (en) | 2001-01-09 |
EP0502068A4 (en) | 1993-04-28 |
JP3164364B2 (ja) | 2001-05-08 |
EP0502068B1 (en) | 1995-04-05 |
CA2069329A1 (en) | 1991-05-09 |
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