DE69216685T2 - Sputteranlage - Google Patents
SputteranlageInfo
- Publication number
- DE69216685T2 DE69216685T2 DE69216685T DE69216685T DE69216685T2 DE 69216685 T2 DE69216685 T2 DE 69216685T2 DE 69216685 T DE69216685 T DE 69216685T DE 69216685 T DE69216685 T DE 69216685T DE 69216685 T2 DE69216685 T2 DE 69216685T2
- Authority
- DE
- Germany
- Prior art keywords
- plasma
- sputtering
- sputtering system
- substrate
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0623—Sulfides, selenides or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0073—Reactive sputtering by exposing the substrates to reactive gases intermittently
- C23C14/0078—Reactive sputtering by exposing the substrates to reactive gases intermittently by moving the substrates between spatially separate sputtering and reaction stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0676—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5826—Treatment with charged particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70903591A | 1991-05-31 | 1991-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69216685D1 DE69216685D1 (de) | 1997-02-27 |
DE69216685T2 true DE69216685T2 (de) | 1997-05-28 |
Family
ID=24848218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69216685T Expired - Lifetime DE69216685T2 (de) | 1991-05-31 | 1992-05-28 | Sputteranlage |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0516436B1 (de) |
JP (1) | JP3420594B2 (de) |
AT (1) | ATE147890T1 (de) |
DE (1) | DE69216685T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4305748A1 (de) * | 1993-02-25 | 1994-09-01 | Leybold Ag | Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer |
WO1995000677A1 (en) * | 1993-06-17 | 1995-01-05 | Deposition Sciences, Inc. | Sputtering device |
US6402902B1 (en) * | 1995-02-13 | 2002-06-11 | Deposition Sciences, Inc. | Apparatus and method for a reliable return current path for sputtering processes |
US5849162A (en) * | 1995-04-25 | 1998-12-15 | Deposition Sciences, Inc. | Sputtering device and method for reactive for reactive sputtering |
US5616224A (en) * | 1995-05-09 | 1997-04-01 | Deposition Sciences, Inc. | Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process |
DE19722056A1 (de) * | 1997-05-27 | 1998-12-03 | Roland Dr Gesche | Verfahren und Anordnung zum Herstellen dünner Schichten mittels Niederdruck-Gasentladung in einer Hohlkathode |
US6049169A (en) * | 1998-04-08 | 2000-04-11 | Philips Electronics North America Corp. | Electric lamp having optical interference filter of alternating layers of SiO2 and Nb2 O5 --Ta2 O5 |
JP3506949B2 (ja) | 1999-04-09 | 2004-03-15 | 松下電器産業株式会社 | 薄膜の製造方法、薄膜が形成された回転楕円体、及びこれを用いた電球と薄膜形成装置。 |
US20030029716A1 (en) * | 2001-08-13 | 2003-02-13 | Ga-Lane Chen | DWDM filter system design |
JP2005538028A (ja) * | 2002-09-14 | 2005-12-15 | ショット アクチエンゲゼルシャフト | 被覆物 |
EP1554412B1 (de) * | 2002-09-19 | 2013-08-14 | General Plasma, Inc. | Plasmaunterstützte chemische Gasphasenabscheidung Vorrichtung |
WO2005035822A1 (en) * | 2003-10-07 | 2005-04-21 | Deposition Sciences, Inc. | Apparatus and process for high rate deposition of rutile titanium dioxide |
DE112005002056B4 (de) * | 2004-08-30 | 2021-09-23 | Ulvac, Inc. | Filmformungsvorrichtung |
GB0505517D0 (en) * | 2005-03-17 | 2005-04-27 | Dupont Teijin Films Us Ltd | Coated polymeric substrates |
JP2007092095A (ja) * | 2005-09-27 | 2007-04-12 | Shincron:Kk | 薄膜形成方法及び薄膜形成装置 |
CN101410931B (zh) * | 2006-03-28 | 2011-02-16 | 贝卡尔特股份有限公司 | 涂覆设备 |
EP2188411B1 (de) * | 2007-08-30 | 2011-10-26 | Koninklijke Philips Electronics N.V. | Sputtersystem |
US11814718B2 (en) | 2015-03-31 | 2023-11-14 | Bühler Alzenau Gmbh | Method for producing coated substrates |
WO2017110464A1 (ja) * | 2015-12-24 | 2017-06-29 | コニカミノルタ株式会社 | 成膜装置および成膜方法 |
GB201603233D0 (en) * | 2016-02-24 | 2016-04-06 | Gencoa Ltd | Ionisation enhancement device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2307649B2 (de) * | 1973-02-16 | 1980-07-31 | Robert Bosch Gmbh, 7000 Stuttgart | Anordnung zum Aufstäuben verschiedener Materialien auf einem Substrat |
US4026787A (en) * | 1974-01-25 | 1977-05-31 | Coulter Information Systems, Inc. | Thin film deposition apparatus using segmented target means |
JPS5875839A (ja) * | 1981-10-30 | 1983-05-07 | Fujitsu Ltd | スパツタ装置 |
DE3378508D1 (en) * | 1982-09-10 | 1988-12-22 | Nippon Telegraph & Telephone | Plasma deposition method and apparatus |
JPH0627323B2 (ja) * | 1983-12-26 | 1994-04-13 | 株式会社日立製作所 | スパツタリング方法及びその装置 |
EP0173164B1 (de) * | 1984-08-31 | 1988-11-09 | Hitachi, Ltd. | Aufstäuben mittels Mikrowellen |
JPH0243824B2 (ja) * | 1985-02-22 | 1990-10-01 | Hitachi Ltd | Supatsutaringusochi |
US4892633A (en) * | 1988-11-14 | 1990-01-09 | Vac-Tec Systems, Inc. | Magnetron sputtering cathode |
-
1992
- 1992-05-28 DE DE69216685T patent/DE69216685T2/de not_active Expired - Lifetime
- 1992-05-28 EP EP92304870A patent/EP0516436B1/de not_active Expired - Lifetime
- 1992-05-28 AT AT92304870T patent/ATE147890T1/de not_active IP Right Cessation
- 1992-05-29 JP JP13928292A patent/JP3420594B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69216685D1 (de) | 1997-02-27 |
EP0516436A2 (de) | 1992-12-02 |
ATE147890T1 (de) | 1997-02-15 |
EP0516436A3 (en) | 1993-03-31 |
EP0516436B1 (de) | 1997-01-15 |
JP3420594B2 (ja) | 2003-06-23 |
JPH05156436A (ja) | 1993-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8365 | Fully valid after opposition proceedings | ||
R071 | Expiry of right |
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