EP3850924A1 - Procédé de fabrication d'un ensemble carte de circuit imprimé et ensemble carte de circuit imprimé - Google Patents

Procédé de fabrication d'un ensemble carte de circuit imprimé et ensemble carte de circuit imprimé

Info

Publication number
EP3850924A1
EP3850924A1 EP19768755.1A EP19768755A EP3850924A1 EP 3850924 A1 EP3850924 A1 EP 3850924A1 EP 19768755 A EP19768755 A EP 19768755A EP 3850924 A1 EP3850924 A1 EP 3850924A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
solder paste
board substrate
connection contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19768755.1A
Other languages
German (de)
English (en)
Inventor
Rafael DEL REY
Markus BEBENDORF
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive Technologies GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP3850924A1 publication Critical patent/EP3850924A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Definitions

  • the invention relates to a method for producing a printed circuit board arrangement.
  • the invention further relates to a circuit board arrangement.
  • solder balls are used for the electrically conductive connection of two printed circuit boards. This allows more solder paste to be used per connection than is typically the case with simple solder paste connections.
  • So-called ball grid arrays (BAG) have been developed for the arrangement of the solder balls, which use rows and columns of discretely spaced solder balls in order to produce the necessary electrical connections by melting the solder paste.
  • solder balls are placed one after the other in each connection provided for this purpose and then pressure-contacted.
  • solder balls can be arranged on the connection contacts using a positioning system (pick and place system) and connected using SMD technology (surface-mounting technology, SMT).
  • SMD technology surface-mounting technology
  • US 20060249303 A1 discloses a connection-free connection from board to board, from cable to board or from cable to Electric wire.
  • the connection has solder beads or semi-ellipsoidal surface structures for connection.
  • DE 10138042 A1 discloses a method for producing an electronic component which has at least one semiconductor chip and a rewiring plate, on the first side of which the semiconductor chip is mounted, conductor structures and connection contacts for electrical contacting of the contacting being on a second side of the rewiring plate facing away from the semiconductor chip
  • Electronic component with a printed circuit board are provided, with the steps: providing an um wiring board with applied on the second side conductor tracks and connection contacts, mounting a semiconductor chip on the first side of the redistribution board without conductor track structures and making electrical connections between contact connections of the semiconductor chip and the Conductor tracks of the rewiring plate, application of a closed solder stop layer on the second side of the rewiring plate, structuring of the solder stop layer, the connection contacts are at least partially exposed, and an inner circumferential surface of an opening of the solder stop layer surrounding each connection contact, which is widened obliquely and / or in steps, is formed, applying a solder ball to each exposed connection contact, the solder balls each
  • the invention has for its object to provide an inexpensive and simple solution to the above problem.
  • This object is achieved by specifying a method for producing a circuit board arrangement with the features of claim 1 and specifying a circuit board arrangement with the features of claim 8.
  • the object is achieved by specifying a method for producing a printed circuit board arrangement with the steps:
  • the first printed circuit board substrate having an underside and the second printed circuit board substrate having a surface, the upper surface and the underside being arranged opposite one another,
  • solder paste cylinders to the first connection contacts, wherein the application of the solder paste cylinders to the first connection contacts is carried out by a solder paste application method with solder paste, the applied solder paste cylinders each having a solder paste cylinder surface, and
  • Printed circuit board substrate is usually to be understood as a printed circuit board (PCB) or a substrate which is provided for forming a printed circuit board.
  • PCB printed circuit board
  • Solder paste cylinders are to be understood as columns / cylinders, essentially cylindrical in shape, made of solder paste (solder paste). It should be noted that cylinder is only to be understood as the rough shape, with smaller and larger deviations, and not an exact mathematical description. It has been recognized that a connection made by solder balls can be destroyed if a distortion or warp caused by thermal expansion during subsequent melting occurs in the two circuit board substrates by one or more solder balls remaining during melting only with one of the two printed circuit board substrates is in contact.
  • the invention has the effect that the separation of the connection between the circuit board substrates is avoided.
  • the solder paste cylinders expand flexibly when the two printed circuit board substrates are bulged, for example due to melting, so that almost all connections are preserved during a heating process. Due to the cylindrical shape made of solder paste, a detachment of the connection between the circuit board substrates can be avoided with a high warpage and a large curvature, for example up to 2.5 times the original distance between the two circuit board substrates. Even in the case of a delay in which the distance between the two printed circuit board substrates is less than the original distance between the two printed circuit board substrates, the connection is maintained by the solder paste cylinders being able to be compressed or pressed together flexibly. A burst, as can be the case with metallic solder balls, for example, can be avoided.
  • solder balls can also be dispensed with, which leads to lower manufacturing costs.
  • the manufacture of the circuit board substrates according to the invention also requires no fastening or alignment elements, which results in lower manufacturing costs.
  • the solder paste cylinders according to the invention enable flexible arrangement on the printed circuit board substrates.
  • HDI printed circuit boards high-density interconnect printed circuit boards
  • printed circuit boards with more than 500 connections or pins per square decimeter can thus be formed.
  • the method preferably comprises the further step: melting the solder paste cylinders to form a mechanical and electrically conductive connection between the first connection contacts of the first printed circuit board substrate and the second connection contacts of the second printed circuit board substrate. This creates a reliable contact between the two circuit board substrates. Due to the melting, a particularly simple connection between the first and second connection contacts is possible.
  • the melting is accomplished by a reflow process or a Schwallot process.
  • Reflow soldering is a technology in which a solder paste that has already been applied to the component to be soldered is liquefied again by heating and the desired contacts are thereby produced.
  • the solder paste is usually printed on the circuit boards or components to be soldered.
  • the reflow process is mainly used for SMD components (surface-mount device).
  • At least one distortion point occurs during the melting due to thermal expansion of the first circuit board substrate and / or the second circuit board substrate, so that the solder paste cylinders form a peanut-shaped shape and / or a compact columnar shape at the at least one distortion point. Due to the flexible expansion of the soldering the mechanical and electrical connection is retained.
  • solder paste cylinders are furthermore preferably applied to the first connection contacts by means of a solder paste printing process. This makes it easy to apply the solder paste cylinder.
  • solder paste cylinders are applied by the solder paste application method, at least one surface-mountable connection surface made of solder paste, in particular for fastening SMD components, is simultaneously applied to a connection pad provided for this purpose and arranged on the underside.
  • connections can be made in one work step both for the circuit board arrangement in the form of the solder paste cylinders and for SMD components.
  • no additional work step is therefore necessary. This saves both manufacturing time and costs.
  • the solder paste cylinders are formed on the first connection contacts through at least one first passage channel in a printing template and the formation of a connection area through at least a second passage channel in the printing template, the printing template having a stepped height profile with a first height and at least a second height has, so that the first passage channel has the first height and the second passage channel has the second height.
  • first circuit board substrate a first circuit board substrate
  • second printed circuit board substrate which is arranged substantially plane-parallel to the first printed circuit board substrate
  • the first printed circuit board substrate having an underside
  • the second printed circuit board substrate having a surface, the surface and the underside being arranged opposite one another
  • first connection contacts which are applied to the underside of the first circuit board substrate and second to
  • Solder paste cylinders which are arranged between the first connection contacts of the first printed circuit board substrate and the corresponding second connection contacts of the second printed circuit board substrate to form a mechanical and electrically conductive connection between the first connection contacts of the first printed circuit board substrate and the second connection contacts of the second printed circuit board substrate, the Solder paste cylinders are applied to the first connection contacts by a solder paste application method with solder paste.
  • the circuit board arrangement according to the invention has the effect that almost all of the connections which are formed by the solder paste cylinders are retained during heating and subsequent cooling.
  • the advantages of the method can also be transferred to the circuit board arrangement.
  • the solder paste application process is a solder paste printing process. This makes it particularly easy to apply the solder paste.
  • the solder paste cylinders preferably have a height that extends between the first connection contacts of the first printed circuit board substrate and the second connection contacts of the second printed circuit board substrate, the height having a value in the range from 350 ⁇ m to 700 ⁇ m. This height is particularly suitable good for making a circuit board assembly that can be used in a vehicle.
  • connection is particularly preferably a soldered connection.
  • the mechanical and electrically conductive connection between the first connection contacts of the first printed circuit board substrate and the second connection contacts of the second printed circuit board substrate is particularly preferably accomplished by melting the solder paste cylinders. This enables a particularly simple connection to be established.
  • the soldering paste cylinders have a peanut-shaped shape and / or a compact columnar shape at the at least one warping point.
  • the solder paste cylinders have a peanut-shaped shape, and / or in the case of a delay in which the first printed circuit board substrate has a second printed circuit board substrate, compared to the original distance, has a smaller distance, the solder paste cylinder has a compact columnar shape. This allows the warpage to be compensated for well without breaking the resulting connections.
  • the first connection contacts and the solder paste cylinders applied thereon are arranged in a ring on the underside.
  • a ring-shaped pattern can be used to reduce thermal distortion / warping when melting.
  • the first connection contacts and the soldering paste cylinders preferably form a plurality of ring circumference lines, the soldering paste cylinders of the individual ring circumference lines have a distant distance from each other.
  • the individual ring circumference lines are also equidistant from one another. Thereby, thermal hot spots can be avoided.
  • the first printed circuit board substrate particularly preferably has at least one SMD component arranged on the underside and the second printed circuit board substrate has a recess, the at least one SMD component at least partially protruding into the recess. This can save space.
  • the first printed circuit board substrate is substantially larger than the second printed circuit board substrate.
  • the first circuit board substrate can thus serve as the main circuit board, while the second circuit board substrate serves as a circuit module carrier.
  • Such a circuit board arrangement is particularly well suited for use in an electronic instrument cluster or another motor vehicle / control / display device, such as a radio etc.
  • the circuit board arrangement is particularly preferably produced using the method as described above.
  • the printed circuit board assembly 100 comprises a first printed circuit board 101 and a second printed circuit board 102 as well as solder balls 103 arranged therebetween for mechanical and electrically conductive connection.
  • the solder balls 103 are preformed metal balls.
  • the thermal expansion of the printed circuit boards 101, 102 results in warping or warping of the printed circuit boards 101, 102, which here results in an opposite curvature of the two printed circuit boards 101 and 102.
  • the oppositely directed curvature of the two printed circuit boards 101, 102 and the resulting spacing between the two printed circuit boards 101, 102 result in the solder balls 103 adhering to one of the two printed circuit boards 101, 102 and separating the solder balls 103. that some of the connections are broken.
  • the solder balls 103 solidify before they have contact with the two printed circuit boards 101, 102 again.
  • FIG. 3 shows a second printed circuit board substrate 2 for forming a printed circuit board arrangement 3 (FIG. 3) according to the invention.
  • the second printed circuit board substrate 2 has a surface 12 and second connection contacts 4 arranged thereon and a recess 5.
  • the second connection contacts 4 are arranged in a ring on the surface 12 in an edge region 6 or periphery of the recess 5. It also includes a square rounded or beveled at the corners.
  • a connection contact 4 preferably has a circular surface with a diameter of 450 ⁇ m.
  • the circuit board arrangement 3 shows a circuit board arrangement 3 according to the invention.
  • the circuit board arrangement 3 has a first circuit board substrate
  • the first printed circuit board substrate 1 likewise has first connection contacts 14 (FIG. 4), which are arranged on the underside 11.
  • the first connection contacts 14 and second connection contacts 4 (FIG. 2) are arranged corresponding to one another on the underside 11 of the first printed circuit board substrate 1 and the surface 12 of the second printed circuit board substrate 2.
  • the first printed circuit board substrate 1 can be designed, for example, as a printed circuit board (PCB).
  • solder paste cylinders 7 are applied to the first connection contacts 14 (FIG. 4) by means of the solder paste printing method.
  • connection surfaces 10 for connecting other SMD components can also be applied to corresponding connection pads (not shown) of the first printed circuit board substrate 1 and / or other connections.
  • SMD components do not require circuit board holes for their assembly, but are soldered with their connections directly to the connection pads provided for this purpose on the circuit board substrate.
  • SMD components are then mechanically placed on the connection pads provided with soldering paste using, for example, automatic placement machines and soldered together with the soldering paste cylinder 7 in a single reflow process.
  • solder paste cylinder 7 Due to the simultaneous application of the solder paste cylinder 7 to form a mechanical and electrically conductive connection between the first connection contacts 14 (FIG. 4) and second connection contacts 4 (FIG. 2) and thus between the first circuit board substrate 1 and the second circuit board substrate 2 and the connection area 10 (FIG 4) in a common work step, the manufacturing costs can be reduced by up to 50%. Faster production can be accomplished.
  • the connection by solder paste cylinder 7 also requires no separate fastening or alignment elements, for example adhesive. This can also save costs.
  • solder paste cylinders 7 have a cylindrical column shape before melting, for example in a reflow process.
  • a solder paste cylinder 7 before melting is shown in FIG. 4.
  • solder paste or solder paste is usually a paste-like mixture of solder metal powder and flux.
  • solder pastes for brazing based on copper / zinc and silver and for resistance soldering are solder pastes for brazing based on copper / zinc and silver and for resistance soldering.
  • solder paste suitable for SMD soldering consists of approximately 90% tin alloy beads and approximately 10% flux. The percentages relate to the percentages by mass.
  • the solder pastes which can be used in the present invention preferably comprise paste-like printing compositions of any chemical compositions which are preferably used for producing electrically conductive contacts can. However, other suitable solder pastes can also be used.
  • the SMD components can be arranged on the underside 11 of the circuit board substrate 1 in such a way that when the circuit board substrate 1 is arranged on the second circuit board substrate 2 they at least partially protrude into the recess 5 (FIG. 2).
  • solder paste is applied by means of a printing template 8, as shown in FIG. 4.
  • the solder paste is by means of
  • the printing template 8 has passage channels 9a, 9b. Furthermore, the printing template 8 has a stepped height profile with at least two different heights h1 and h2, hl being higher than h2. This results in at least one first passage channel 9a with a first height hl and a second
  • connection surface 10 for SMD components is formed on the connection contacts 14 to form solder paste cylinders 7.
  • solder paste cylinders 7 are printed with the aid of the passage channels 9a, which have the height h1.
  • the passage channels 9a must be positioned centered on the connection contacts 14. The same applies to the connection areas 10.
  • solder paste cylinders 7 and connection surfaces 10 made of solder paste has the advantage that the solder paste is sticky and so the SMD components and the second printed circuit board substrate 2 with the second connection contacts 4 (FIG. 2) adhere directly to the solder paste cylinders 7. For example, separate gluing can thus be dispensed with.
  • the circuit board arrangement 3 thus produced is passed through a so-called reflow oven, in which the flux is activated by the heat effect and finally evaporates.
  • solder paste cylinders 7 melt and connect to the first connection contacts 14 and second connection contacts 4 (FIG. 2) of the respective printed circuit board substrate 1, 2. The same applies to the connection surfaces 10 and the SMD components fitted thereon.
  • the mechanical and electrically conductive connection is formed, which is also referred to as a solder or solder connection.
  • solder paste cylinders 7 can also be printed on the second connection contacts 4 (FIG. 2) of the second printed circuit board substrate 2. You can then continue as described above.
  • the printing stencil 8 has a first height h1 of approximately 300 ⁇ m for the first passage channel 9a, and a second height h2 of approximately 150 ⁇ m for the second passage channel 9b.
  • the passage channels 9a, 9b have a total distance from one another, which is composed of the distances A1 and A2.
  • the first has a distance Al has a width greater than 5.85 ⁇ m and the second distance A2 has a width greater than or equal to 0.65 ⁇ m.
  • the height can also be chosen differently.
  • the solder paste cylinders 7 can also have a height of 700 ⁇ m.
  • a well-known solder paste application process is screen or stencil printing.
  • the stencil / screen printing process enables high-precision application of solder paste on printed circuit boards.
  • the solder paste cylinder 7 preferably has a value between 300 and 700 ⁇ m.
  • the solder paste cylinder 7 has a substantially cylindrical shape.
  • FIG. 4 also shows a connection area 10 for connecting SMD components.
  • the electrically conductive connection produced by the solder paste cylinders 7 allows the printed circuit board substrate 1, 2 to be designed as HDI printed circuit boards
  • High-density interconnect circuit board with high contact or connection density, in particular a circuit board with more than 500 connections or pins per square decimeter.
  • solder paste cylinder 7 shows a printed circuit board arrangement 3 in the reflow process, with the first printed circuit board substrate 1 and the second printed circuit board substrate 2.
  • the two printed circuit board substrates 1, 2 each have an oppositely directed curvature due to the thermal expansion in the reflow process.
  • solder paste cylinder 7 this curvature can be compensated for.
  • the solder paste cylinders 7 can expand and take on the shape of a peanut, for example, if a distance between the circuit board sub strate 1, 2 arises due to the curvature, which is greater than the previous distance.
  • the solder paste cylinders 7 can be pressed together and, for example, the shape of a squeezed column assume if the distance between the two circuit board substrates 1, 2 produced by the curvature is less than the original distance before the reflow process.
  • solder paste cylinders 7 there is no detachment of the solder paste cylinders 7 from the first connection contacts 14 (FIG. 4) and / or second connection contacts 4 (FIG. 2) due to a height distortion caused by thermal expansion, that is to say if the original distance between the two printed circuit board substrates 1, 2 due to the curvature to one another is now greater than the distance between the printed circuit board substrates 1, 2 to one another before the reflow process.
  • the solder paste cylinders 7 remain in contact with both the first connection contacts 14 of the first printed circuit board substrate 1 and the second connections of the second printed circuit board substrate 2 during the reflow process and subsequently form the electrically conductive connection.
  • solder paste cylinders 7 there is no “bursting” of the solder paste cylinders 7, as is the case, for example, with the solder balls, if the original distance between the two printed circuit board substrates 1, 2 due to the curvature is now substantially smaller than the distance between the printed circuit board substrates 1, 2 before the reflow process, because the solder paste cylinder 7 can be squeezed into a squeezed column shape.
  • the printed circuit board arrangement 3 produced in this way can accordingly have melted-on solder paste cylinders 7, some of which have a squeezed column shape or peanut shape.
  • any suitable melting process can be used.
  • FIG. 6 shows an arrangement of the solder paste cylinders 7 on the first printed circuit board substrate 1. These can be arranged essentially in a ring on the first printed circuit board substrate 1, whereby circular also means a rounded square. This ring-shaped arrangement allows warpage / warping to be reduced during the melting process. Furthermore, a more flexible distribution of the solder paste cylinders 7 can be achieved, as can a better weight balance.
  • FIG. 6 also shows a section of solder paste cylinders 7 after the reflow process. These have a "peanut" shape due to warpage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un ensemble carte de circuit imprimé (3) comprenant les étapes suivantes : fournir un premier substrat de cartes de circuit imprimé (1), fournir un second substrat de cartes de circuit imprimé (2) qui est disposé sensiblement dans un plan parallèle au premier substrat de cartes de circuit imprimé (1). Ledit premier substrat de cartes de circuit imprimé (1) a une face inférieure (11) et le second substrat de cartes de circuit imprimé (2) a une surface (12) supérieure. La surface (12) et la face inférieure (11) sont disposées à l'opposé l'une de l'autre, fournissant des premiers contacts de borne (14) qui sont appliqués sur la face inférieure (11) du premier substrat de cartes de circuit imprimé (1), fournissant des seconds contacts de borne, qui sont appliqués sur la surface (12) du second substrat de cartes de circuit imprimé (2), en appliquant des cylindres de pâte à souder (7) sur les premiers contacts de borne (14), l'application des cylindres de pâte à souder (7) sur les premiers contacts de borne (14) étant réalisée par un procédé d'application de pâte à souder utilisant de la pâte à souder. Les cylindres de pâte à souder appliqués (7) ont chacun une surface de cylindres de pâte à souder et en disposant les seconds contacts de borne (4) du second substrat de cartes de circuit imprimé (2) sur les surfaces de cylindres de pâte à souder des cylindres de pâte à souder (7). L'invention concerne en outre un ensemble carte de circuits imprimés.
EP19768755.1A 2018-09-14 2019-09-10 Procédé de fabrication d'un ensemble carte de circuit imprimé et ensemble carte de circuit imprimé Pending EP3850924A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018215672.7A DE102018215672A1 (de) 2018-09-14 2018-09-14 Verfahren zur Herstellung einer Leiterplattenanordnung und Leiterplattenanordnung
PCT/EP2019/074014 WO2020053160A1 (fr) 2018-09-14 2019-09-10 Procédé de fabrication d'un ensemble carte de circuit imprimé et ensemble carte de circuit imprimé

Publications (1)

Publication Number Publication Date
EP3850924A1 true EP3850924A1 (fr) 2021-07-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP19768755.1A Pending EP3850924A1 (fr) 2018-09-14 2019-09-10 Procédé de fabrication d'un ensemble carte de circuit imprimé et ensemble carte de circuit imprimé

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US (1) US20210329793A1 (fr)
EP (1) EP3850924A1 (fr)
CN (1) CN112703825A (fr)
DE (1) DE102018215672A1 (fr)
WO (1) WO2020053160A1 (fr)

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Publication number Priority date Publication date Assignee Title
US11718087B2 (en) 2021-08-24 2023-08-08 Robert Bosch Gmbh Squeegee for stencil printing
US20230064682A1 (en) * 2021-08-24 2023-03-02 Robert Bosch Gmbh Stencil for stencil printing process
US11622452B2 (en) 2021-08-24 2023-04-04 Robert Bosch Gmbh Method of manufacturing a conductive track on a board via stencil printing

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CN112703825A (zh) 2021-04-23
DE102018215672A1 (de) 2020-03-19
WO2020053160A1 (fr) 2020-03-19
US20210329793A1 (en) 2021-10-21

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