DE69104683T2 - System für das Zusammenschalten elektrischer Komponenten mit verschiedenen Verbindungserfordernissen zum Montieren der Komponenten auf Leiterplatten. - Google Patents

System für das Zusammenschalten elektrischer Komponenten mit verschiedenen Verbindungserfordernissen zum Montieren der Komponenten auf Leiterplatten.

Info

Publication number
DE69104683T2
DE69104683T2 DE69104683T DE69104683T DE69104683T2 DE 69104683 T2 DE69104683 T2 DE 69104683T2 DE 69104683 T DE69104683 T DE 69104683T DE 69104683 T DE69104683 T DE 69104683T DE 69104683 T2 DE69104683 T2 DE 69104683T2
Authority
DE
Germany
Prior art keywords
components
mounting
printed circuit
circuit boards
different connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69104683T
Other languages
English (en)
Other versions
DE69104683D1 (de
Inventor
Cheng-Cheng Chang
Lawrence Hanlon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69104683D1 publication Critical patent/DE69104683D1/de
Publication of DE69104683T2 publication Critical patent/DE69104683T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69104683T 1990-10-01 1991-03-21 System für das Zusammenschalten elektrischer Komponenten mit verschiedenen Verbindungserfordernissen zum Montieren der Komponenten auf Leiterplatten. Expired - Fee Related DE69104683T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/590,893 US5132879A (en) 1990-10-01 1990-10-01 Secondary board for mounting of components having differing bonding requirements

Publications (2)

Publication Number Publication Date
DE69104683D1 DE69104683D1 (de) 1994-11-24
DE69104683T2 true DE69104683T2 (de) 1995-05-11

Family

ID=24364164

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104683T Expired - Fee Related DE69104683T2 (de) 1990-10-01 1991-03-21 System für das Zusammenschalten elektrischer Komponenten mit verschiedenen Verbindungserfordernissen zum Montieren der Komponenten auf Leiterplatten.

Country Status (4)

Country Link
US (1) US5132879A (de)
EP (1) EP0478879B1 (de)
JP (1) JPH057062A (de)
DE (1) DE69104683T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
US5412539A (en) * 1993-10-18 1995-05-02 Hughes Aircraft Company Multichip module with a mandrel-produced interconnecting decal
AU3415095A (en) * 1994-09-06 1996-03-27 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
JPH08250827A (ja) * 1995-03-08 1996-09-27 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法並びに半導体装置
JP3607412B2 (ja) 1996-05-14 2005-01-05 アルプス電気株式会社 座標入力装置の製造方法
FR2750287B1 (fr) * 1996-06-21 2003-03-14 Siemens Automotive Sa Procede de montage, sur une carte de circuit imprime, d'un composant a semelle metallique percee d'un trou
US5825630A (en) * 1996-11-07 1998-10-20 Ncr Corporation Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density
US6249053B1 (en) * 1998-02-16 2001-06-19 Sumitomo Metal (Smi) Electronics Devices Inc. Chip package and method for manufacturing the same
US6495394B1 (en) 1999-02-16 2002-12-17 Sumitomo Metal (Smi) Electronics Devices Inc. Chip package and method for manufacturing the same
US6198634B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Electronic package with stacked connections
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US20070051535A1 (en) * 2005-09-02 2007-03-08 Hon Hai Precision Industry Co., Ltd. Circuit board assembly and electronic device utilizing the same
WO2008033484A2 (en) * 2006-09-14 2008-03-20 Uka Harshad K Connection for flex circuit and rigid circuit board
US7448923B2 (en) * 2006-09-14 2008-11-11 Harshad K Uka Connection for flex circuit and rigid circuit board
CN101273494B (zh) * 2006-10-27 2012-02-22 株式会社旭电化研究所 电连接构造
DE102007041770A1 (de) * 2007-09-04 2009-03-05 Continental Automotive Gmbh Leiterplattenstapel aus löttechnisch miteinander verbundenen Leiterplatten
JP5609451B2 (ja) * 2010-09-09 2014-10-22 富士通株式会社 コネクタ、光伝送装置およびコネクタ接続方法
US10375829B2 (en) * 2015-11-12 2019-08-06 Whirlpool Corporation Human-machine interface assemblies
US20230262886A1 (en) * 2022-02-11 2023-08-17 Accenture Global Solutions Limited 3d printed attachment devices for electronics

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
DE2345627A1 (de) * 1973-09-10 1975-03-20 Siemens Ag Elektrischer steckverbinder
US3888639A (en) * 1974-01-02 1975-06-10 Teledyne Electro Mechanisms Method for connecting printed circuits
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US4394712A (en) * 1981-03-18 1983-07-19 General Electric Company Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers
US4437141A (en) * 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
DE3316017A1 (de) * 1983-05-03 1984-11-08 Siegert GmbH, 8501 Cadolzburg Verfahren zur herstellung elektrischer verbindungen an multisubstratschaltungen, sowie hiernach hergestellte multisubstratschaltungen
DE3328547C1 (de) * 1983-08-08 1984-10-04 Hagenuk GmbH, 2300 Kiel Anordnung zum Verlöten elektrischer Bauelemente auf Leiterplatten
US4644643A (en) * 1984-02-22 1987-02-24 Kangyo Denkikiki Kabushiki Kaisha Method of electrically interconnecting a laminated printed circuit by use of a compressed, solder-plated connector pin
JPS61229389A (ja) * 1985-04-03 1986-10-13 イビデン株式会社 セラミツク配線板およびその製造方法
US4871317A (en) * 1987-12-02 1989-10-03 A. O. Smith Corporation Surface mounted component adaptor for interconnecting of surface mounted circuit components
US4803450A (en) * 1987-12-14 1989-02-07 General Electric Company Multilayer circuit board fabricated from silicon
US4887544A (en) * 1988-03-14 1989-12-19 General Dynamics Corp., Pomona Div. Vacuum well process
US4902237A (en) * 1989-03-30 1990-02-20 American Telephone And Telegraph Company Adaptor for surface mount and through-hole components
US5006922A (en) * 1990-02-14 1991-04-09 Motorola, Inc. Packaged semiconductor device having a low cost ceramic PGA package

Also Published As

Publication number Publication date
US5132879A (en) 1992-07-21
EP0478879B1 (de) 1994-10-19
EP0478879A2 (de) 1992-04-08
JPH057062A (ja) 1993-01-14
DE69104683D1 (de) 1994-11-24
EP0478879A3 (en) 1992-07-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee