DE3677714D1 - Mit kupferfolie laminierte platte fuer biegsame gedruckte leiterplatte. - Google Patents

Mit kupferfolie laminierte platte fuer biegsame gedruckte leiterplatte.

Info

Publication number
DE3677714D1
DE3677714D1 DE8686402584T DE3677714T DE3677714D1 DE 3677714 D1 DE3677714 D1 DE 3677714D1 DE 8686402584 T DE8686402584 T DE 8686402584T DE 3677714 T DE3677714 T DE 3677714T DE 3677714 D1 DE3677714 D1 DE 3677714D1
Authority
DE
Germany
Prior art keywords
copper
circuit board
printed circuit
flexible printed
plate laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686402584T
Other languages
English (en)
Inventor
Yoshitugu Eguchi
Masaru Miyashita
Hitoshi Arai
Yoshimi Ogushi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26164785A external-priority patent/JPS62122193A/ja
Priority claimed from JP26164885A external-priority patent/JPS62122192A/ja
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE3677714D1 publication Critical patent/DE3677714D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
DE8686402584T 1985-11-21 1986-11-20 Mit kupferfolie laminierte platte fuer biegsame gedruckte leiterplatte. Expired - Fee Related DE3677714D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26164785A JPS62122193A (ja) 1985-11-21 1985-11-21 フレキシブル銅張り積層板
JP26164885A JPS62122192A (ja) 1985-11-21 1985-11-21 フレキシブル回路板

Publications (1)

Publication Number Publication Date
DE3677714D1 true DE3677714D1 (de) 1991-04-04

Family

ID=26545175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686402584T Expired - Fee Related DE3677714D1 (de) 1985-11-21 1986-11-20 Mit kupferfolie laminierte platte fuer biegsame gedruckte leiterplatte.

Country Status (3)

Country Link
US (1) US4806432A (de)
EP (1) EP0223716B1 (de)
DE (1) DE3677714D1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1286586C (en) * 1987-03-26 1991-07-23 Shigeki Yokoyama Finish laminates for high frequency circuits
US4810326A (en) * 1987-08-31 1989-03-07 International Business Machines Corporation Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
US5035759A (en) * 1989-09-19 1991-07-30 Andoe, Inc. Method of protecting hulls of marine vessels from fouling
US5336304A (en) * 1992-07-28 1994-08-09 Cresco, Inc., Sa. Environmentally safe epoxy adhesive-copper hull coating and method
US5571312A (en) * 1992-07-28 1996-11-05 Cresco Inc., Sa. Environmentally safe epoxy adhesive-copper hull coating and method
US7507903B2 (en) * 1999-03-30 2009-03-24 Daniel Luch Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US8138413B2 (en) * 2006-04-13 2012-03-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8076568B2 (en) * 2006-04-13 2011-12-13 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8222513B2 (en) 2006-04-13 2012-07-17 Daniel Luch Collector grid, electrode structures and interconnect structures for photovoltaic arrays and methods of manufacture
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US20090111206A1 (en) 1999-03-30 2009-04-30 Daniel Luch Collector grid, electrode structures and interrconnect structures for photovoltaic arrays and methods of manufacture
US7898054B2 (en) * 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US7898053B2 (en) * 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US8198696B2 (en) 2000-02-04 2012-06-12 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US20110067754A1 (en) * 2000-02-04 2011-03-24 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US6629348B2 (en) 2001-05-01 2003-10-07 Oak-Mitsui, Inc. Substrate adhesion enhancement to film
EP1447214B1 (de) * 2001-11-01 2010-07-21 Arakawa Chemical Industries, Ltd. Polyimidmetallschichten aufweisende produkte und polyamidimidmetallschichten aufweisendes produkt
KR100449156B1 (ko) * 2002-05-09 2004-09-18 엘지전선 주식회사 솔더 범프용 동박의 제조방법
JP2005333028A (ja) * 2004-05-20 2005-12-02 Nitto Denko Corp 配線回路基板
GB0520303D0 (en) * 2005-10-06 2005-11-16 Pilkington Plc Laminated glazing
GB0520306D0 (en) * 2005-10-06 2005-11-16 Pilkington Plc Laminated glazing
JP2007134658A (ja) * 2005-11-14 2007-05-31 Nitto Denko Corp 配線回路基板および配線回路基板を製造し電子部品を実装する方法
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
EP1908584A1 (de) * 2006-10-02 2008-04-09 Scheuten S.à.r.l. Verbundverglasung
US9266307B2 (en) * 2008-09-10 2016-02-23 Solutia Inc. Heated multiple layer glazings
US9290756B2 (en) * 2008-11-10 2016-03-22 The Board Of Trustees Of The University Of Illinois Apparatus and methods for high throughput network electrophysiology and cellular analysis
JP5511597B2 (ja) * 2010-09-06 2014-06-04 日東電工株式会社 配線回路基板の製造方法
BR112013025177A2 (pt) * 2011-04-07 2019-09-24 Nissan Motor Co Ltda dispositivo de empilhamento de eletrodo e método de empilhamento de eletrodo
JP5362921B1 (ja) * 2012-11-09 2013-12-11 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板
US9279801B2 (en) 2013-07-26 2016-03-08 Axion Biosystems, Inc. Devices, systems and methods for high-throughput electrophysiology
CN103692724A (zh) * 2013-12-23 2014-04-02 松扬电子材料(昆山)有限公司 透明绝缘层复合式双面铜箔基板
US10067117B2 (en) 2014-08-12 2018-09-04 Axion Biosystems, Inc. Cell-based biosensor array and associated methods for manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1301618A (fr) * 1961-02-13 1962-08-17 Clevite Corp Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille
US3902951A (en) * 1969-12-28 1975-09-02 Matsushita Electric Works Ltd Copper-clad laminate and production thereof
GB1411799A (en) * 1972-12-08 1975-10-29 Fortin Laminating Corp Laminates of electrically conducting and insulating material
SE446703B (sv) * 1982-01-20 1986-10-06 Tetra Pak Finance & Trading Sett att framstella ett for djupdragning eller streckning lempat laminatmaterial, genom settet framstellt laminat samt av laminatet tillverkad artikel
JPS59218789A (ja) * 1983-05-06 1984-12-10 信越化学工業株式会社 フレキシブルプリント配線基板およびその製造方法
KR920003400B1 (ko) * 1983-12-29 1992-04-30 가부시기가이샤 히다찌세이사꾸쇼 금속과 수지와의 복합체 및 그 제조방법
US4647508A (en) * 1984-07-09 1987-03-03 Rogers Corporation Flexible circuit laminate

Also Published As

Publication number Publication date
EP0223716A3 (en) 1987-08-05
EP0223716A2 (de) 1987-05-27
US4806432A (en) 1989-02-21
EP0223716B1 (de) 1991-02-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8370 Indication of lapse of patent is to be deleted
8339 Ceased/non-payment of the annual fee