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  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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• • H—ELECTRICITY
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  • H01L23/00—Details of semiconductor or other solid state devices
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Definitions

• the present invention relates to a thermally conductive polyorganosiloxane composition.
• Thermally conductive greases and thermally conductive sheets that use silicone and that have high thermal conductivity to prevent the accumulation of heat caused due to electrical heating elements.
• thermally conductive fillers such as silica powder, alumina, boron nitride, aluminum nitride, and magnesium oxide, and the silicone are used in combination to enhance thermal conductivity of the silicone (Patent Document 1), and that surface treatment is performed on a thermally conductive filler to fill the thermally conductive filler at a higher filling ratio (Patent Document 2).
• Patent document JP-A-2009203373 describes thermally conductive composition able to comprise high level of thermally conductive fillers without losing flexibility.
• These compositions comprise a polysiloxane comprising at least two alkenyl groups, a thermally conductive filler, an organopolysiloxane comprising at least 3 SiH groups wherein the SiH are located along the chain, a polysiloxane having alkoxysilyl groups SiOR, a linear structure and a cyclic polysiloxane.
• Patent document EP-A-2 039 722 describes a silicone gel composition used for encapsulating modules of electronic devices and comprising a polysiloxane end-capped by alkenyl groups, fillers, an organopolysiloxane end-capped by Si-H groups and a Platinum-based catalyst.
• Patent document JP-A-2009292928 describes a heat-conductive silicone composition used as grease for coating gap between heat radiating components and electronic components.
• the composition comprises a polysiloxane comprising at least two alkenyl groups, a thermally conductive filler, an organopolysiloxane comprising at least 3 SiH groups (M H 6 DT), a silane comprising SiOR groups and a Platinum-based catalyst.
• Patent document US-A-2007/0185259 describes a thermally conductive silicone composition used in electronic devices comprising a polysiloxane comprising end-capped by alkenyl groups, a thermally conductive filler, an organopolysiloxane comprising at least 3 SiH groups, a polysiloxane having alkoxysilyl groups SiOR, a linear structure and a cyclic structure and a Platinum-based catalyst.
• thermoly conductive composition having flexibility.
• an addition reaction curable thermally conductive polysiloxane composition containing an organopolysiloxane having at least two alkenyl groups per molecule, and an organohydrogenepolysiloxane having at least two hydrogen atoms bonded to silicon atoms per molecule that uses a combination of an organohydrogenesiloxane having a Si-H group in a side chain and an organohydrogenesiloxane having a Si-H group at a terminal has been known (Patent Document 3).
• An object of the present invention is to provide a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility.
• the present invention relates to the following.
• thermoly conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility.
• Structural units of siloxane compounds may be also written using abbreviations shown below (hereinafter, each of these structural units may be also referred to as "M unit”, “D unit”, and the like).
• Examples of the monovalent hydrocarbon group include alkyl groups, cycloalkyl groups, aryl groups, and alkenyl groups.
• Examples of the monovalent hydrocarbon group having no aliphatic unsaturated bond include the monovalent hydrocarbon group described above except the alkenyl group.
• alkenyl group examples include a vinyl group, an allyl group, a 3-butenyl group, 5-hexenyl group, and the like.
• alkyl group examples include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, an octyl group, a decyl group, a dodecyl group, a hexadecyl group, and an octadecyl group, and the like.
• cycloalkyl group examples include a cyclopentyl group, a cyclohexyl group, and the like.
• aryl group examples include a phenyl group, a naphthyl group, a tolyl group, a xylyl group, and the like.
• the alkenyl group, the alkyl group, the cycloalkyl group, and the aryl group may be substituted by halogen, such as chlorine, fluorine, and bromine.
• thermally conductive filler may be also referred to as "(A)”.
• (E) platinum catalyst and the like.
• the thermally conductive polysiloxane composition (hereinafter, also simply referred to as "composition") contains: (A) a thermally conductive filler; (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule; (D1) a linear polyorganohydrogensiloxane represented by the general formula (4); (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5); and (E) a platinum catalyst.
• a cured product of the composition has excellent tackiness, and thus it is possible to achieve both significant suppression of peeling of the cured product of the composition from a substrate and ease of reapplying a cured product of the composition at the time of repair.
• thermally conductive fillers include generally known inorganic fillers, such as alumina, magnesium oxide, zinc oxide, boron nitride, aluminum nitride, a silica powder, silicon carbide, a metal powder, diamond, aluminum hydroxide, and carbon. Especially preferred are alumina, zinc oxide, aluminum nitride, and silicon carbide.
• inorganic filler there is no particular limitation as long as it is of a grade that can be used as a thermally conductive filler, and those which are commercially available can be used.
• the inorganic filler a plurality of types of different chemical species can be used in combination.
• the thermally conductive filler is of a grade that can be used as a thermally conductive filler, but a thermally conductive filler having an average particle diameter of 300 ⁇ m or less is preferably used.
• the thermally conductive filler having an average particle diameter in the above range when the thermally conductive filler having a larger average particle diameter is incorporated, the filling ratio cannot be increased.
• the thermally conductive filler having a smaller average particle diameter is incorporated, the resultant composition tends to have an increased viscosity.
• a composition having a viscosity suitable for the purpose can be obtained.
• a filler having a relatively large particle diameter and a filler having a relatively small particle diameter are used in combination.
• the filler having a relatively small particle diameter goes into voids caused in the filler having a relatively large particle diameter, enabling higher filling.
• the proportion of the fillers incorporated can be arbitrary.
• the shape of the inorganic particles used as the thermally conductive filler there is no particular limitation.
• any of particles of a spherical shape, particles of a rounded shape, and particles of an indefinite shape can be used, and further two or more types of these particles can be used in combination.
• the average particle diameter of the inorganic particles is defined by a method known to those skilled in the art.
• the average particle diameter can be determined as, for example, a weight average value (or a median diameter) using a particle size distribution measurement apparatus by, for example, a laser light diffraction method.
• the composition contains a siloxane compound having an alkoxysilyl group and a linear siloxane structure as a surface treating agent of (A).
• the molecular structure of (B) is not particularly limited and is a linear structure, branched structure, or cyclic structure, but a cyclic structure is preferred. Examples of such preferred (B) include siloxane compounds represented by the following general formula (1): wherein R 1 , R 2 , R 3 , X, a, b, and c are as defined above.
• the unit containing R 1 , the unit containing R 2 , and the unit represented by SiR 3 2 O are not necessarily arranged as shown in the general formula (1) above. For example, the unit represented by SiR 3 2 O may be present between the unit containing R 1 and the unit containing R 2 .
• the siloxane compound represented by the general formula (1) can introduce a large number of hydrolyzable groups into its cyclic structure, and further has the hydrolyzable groups concentrated in the position of the structure. Therefore, it is considered to have an increased treatment efficiency for a thermally conductive filler, enabling higher filling.
• the siloxane compound represented by the general formula (1) per se has high heat resistance, and therefore can cause the thermally conductive polysiloxane composition to have high heat resistance.
• R 1 is a hydrolyzable functional group containing an alkoxysilyl group having 1 to 4 carbon atoms, and, as more specific examples, there can be mentioned groups having the structures shown below.
• R 1 may be directly bonded to X with silicon, but may be bonded to X through a linking group, such as an ester linkage. More specific examples of R 1' s include groups having the structures shown below.
• R 1 is preferably a group of a structure having two or more alkoxysilyl groups, especially having three alkoxysilyl groups. Further, in view of easy availability of the raw material, R 1 preferably contains a methoxysilyl group.
• R 2 is a linear organosiloxy group represented by the following general formula (2): wherein R 4 , Y, and d are as defined above.
• R 2 is a linear organosiloxy group represented by the general formula (2)
• d is an integer of 2 to 500, preferably an integer of 4 to 400, more preferably an integer of 10 to 200, even more preferably an integer of 10 to 100, and particularly preferably an integer of 10 to 50.
• d is in this range, the effect on the fluidity is improved, enabling high incorporation, so that the viscosity of the siloxane compound represented by the general formula (1) can be reduced.
• Each R 4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, and is preferably an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms.
• R 4 is particularly preferably a methyl group.
• Y is a group selected from the group consisting of a methyl group, a vinyl group, and R 1 .
• R 2 is a linear organosiloxy group represented by the general formula (2) because the affinity between the thermally conductive filler and the base polymer tends to be increased through R 2 , and a substance with excellent handleability, such that the viscosity of the composition has been reduced, tends to be obtained.
• X is a linking group that bonds R 1 and R 2 with the cyclic siloxane moiety of the siloxane represented by the general formula (1).
• X is a divalent hydrocarbon group having 2 to 10 carbon atoms, and is preferably an alkylene group having 2 to 10 carbon atoms, such as -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, - CH 2 CH 2 CH 2 CH 2 CH 2 -, - CH 2 CH(CH 3 )-, and -CH 2 CH(CH 3 )CH 2 -.
• X is preferably -CH 2 CH 2 - or -CH 2 CH(CH 3 )-.
• R 3 is each independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
• the monovalent hydrocarbon group having from 1 to 6 carbon atoms an alkyl group having from 1 to 6 carbon atoms is preferred.
• R 3 is preferably a methyl group or a hydrogen atom.
• a is an integer of 1 or more, and preferably 1.
• b is an integer of 1 or more, and preferably 1 or 2.
• c is an integer of 0 or more, and preferably 0 to 2. Further, the sum of a + b + c is an integer of 4 or more, and is preferably 4 from the viewpoint of easy synthesis of the compound.
• siloxane compound represented by the general formula (1) is preferably compounds represented by the following structural formulae.
• the polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule is a base polymer.
• the number of the alkenyl groups bonded to the silicon atoms is less than 2, it becomes difficult to sufficiently cure the resulting composition.
• (C) contains no hydrogen atom bonded to silicon atom and no alkoxysilyl group. That is, (C) is not (B) and (D2).
• alkenyl group examples include alkenyl groups having 2 to 6 carbon atoms, and in view of easy preparation of the compound, a vinyl group is preferred.
• the alkenyl group may be bonded at a terminal or in a middle of a molecular chain but is preferably bonded to both terminals of the molecular chain from the viewpoint of obtaining a cured product having superior flexibility.
• Examples of the group bonded to a silicon atom except the alkenyl group include monovalent hydrocarbon group having no aliphatic unsaturated bond and having from 1 to 12 carbon atoms.
• alkyl groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, and cycloalkyl groups having 3 to 12 carbon atoms are preferred, and a methyl group or a phenyl group is particularly preferred.
• (C) is linear or branched, and preferably linear.
• (C) is more preferably linear polyorganosiloxane represented by the following general formula (3): wherein R 5 , R 6 , and e are as defined above.
• R 6 is synonymous with R 4 .
• R 5 is preferably a vinyl group
• R 6 is preferably a methyl group. Therefore, (C) is particularly preferably polymethylvinylsiloxane, in which both terminals are capped by dimethylvinylsiloxane units and units in the middle comprises dimethylsiloxane units.
• the viscosity of (C) at 23°C is 0.01 to 50 Pa ⁇ s, preferably 0.02 to 20 Pa ⁇ s, and particularly preferably 0.05 to 10 Pa ⁇ s.
• the weight average molecular weight of (C) is preferably adjusted to set the viscosity to be within the viscosity range.
• the viscosity is a value measured at 23°C by using a B-type rotational viscometer. Examples of the rotor number include No. 1 to No. 4, and examples of the rotational speed include 12, 30, and 60 rpm. The type of the rotor and the rotational speed can be appropriately selected depending on the viscosity of the measurement target.
• (D1) Linear polyorganohydrogensiloxane is represented by the following general formula (4): wherein R 7 , R 8 , and f are as defined above.
• the hydrogen atoms bonded to silicon atoms contained in (D1) and (D2) contribute as crosslinking agents to perform a hydrosilylation reaction with an alkenyl group in (C).
• the number of f is in the range of 1 to 200, preferably in the range of 5 to 100, and more preferably in the range of 10 to 50.
• f is in this range, a higher effect for flowability is achieved, a high incorporation can be blended, the viscosity of the siloxane compound can be suppressed, the shape stability is enhanced, and a cured product having superior flexibility can be obtained.
• R 8 is a monovalent hydrocarbon group having no aliphatic unsaturated bond and having 1 to 12 carbon atoms, and is preferably an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms. From the viewpoint of easy synthesis of the compound, R 8 is particularly preferably a methyl group.
• (D2) has per molecule at least three units represented by the following general formula (5): R 9 g R 10 h SiO ( ⁇ 4 - (g + h) ⁇ /2) (5) wherein R 9 , R 10 , g, and h are as defined above. Note that (D2) has no alkoxysilyl group and no alkenyl group bonded to a silicon atom. That is, (D2) is not (B) and (C).
• the molecular structure of (D2) is not particularly limited and is a linear, cyclic, or branched structure.
• g is an integer of 0 to 2, and preferably 1 or 2.
• h is an integer of 1 or 2, and preferably 1.
• the sum of g + h is an integer of 1 to 3, and preferably 3 from the viewpoint of easy synthesis of the compound.
• R 9 is synonymous with R 8 .
• R 9 is preferably a methyl group.
• the organic group bonded to a silicon atom is each independently synonymous with R 9 , and from the viewpoint of easy synthesis of the compound, a methyl group is preferred.
• (D2) is preferably a polyorganohydrogensiloxane comprising a R 11 2 HSiO 1/2 unit (wherein, R 11 is as defined above) and an SiO 4/2 unit, and having at least three hydrogen atoms bonded to silicon atoms per molecule.
• the content of the hydrogen atoms bonded to the silicon atoms of (D2) is not particularly limited but is preferably from 0.1 to 1.2 wt.%, and particularly preferably from 0.5 to 1.1 wt.%. When the content of the hydrogen atoms bonded to silicon atoms of (D2) is 0.1 wt.% or more, higher thermal conductivity can be achieved even with a smaller content of (D2).
• the molecular weight of (D2) is not particularly limited but is preferably 330 to 50,000, and particularly preferably 500 to 10,000. When the molecular weight of (D2) is 330 or more, the crosslinking density does not become excessively high, and thus a cured product having superior flexibility can be obtained. When the molecular weight of (D2) is 50,000 or less, excellent workability of the composition can be achieved.
• the molecular weight is a number average molecular weight measured by gel permeation chromatography based on calibration with polystyrene.
• D2 molecular weight measured by gel permeation chromatography based on calibration with polystyrene.
• the proportions of the R 11 2 HSiO 1/2 unit and the SiO 4/2 unit can be appropriately adjusted.
• the platinum catalyst (E) is a curing catalyst used for reacting an unsaturated group of (C) with a hydrogen group of (D) to obtain a cured product.
• the platinum compounds include chloroplatinic acid, a platinum-olefin complex, a platinum-vinylsiloxane complex, a platinum-phosphorus complex, a platinum-alcohol complex, and platinum black.
• the activity of the catalyst can be suppressed by adding (F) a reaction inhibitor.
• reaction inhibitors for the platinum catalyst include acetylenic alcohols, such as 2-methyl-3-butyn-2-ol and 1-ethynyl-2-cyclohexanol, and diallyl maleate.
• the content of each component in the composition is as follows.
• the content of (A) is preferably 10 to 5,000 parts by mass, more preferably 50 to 4,000 parts by mass, and particularly preferably 100 to 3,000 parts by mass, per 100 parts by mass of the total content of (B), (C), (D1), and (D2).
• content of (A) is set to such a range, higher thermal conductivity can be achieved.
• the content of (B) is preferably 0.01 to 20 parts by mass, and particularly preferably 0.1 to 15 parts by mass, per 100 parts by mass of the content of (A).
• amount of (B) is set to this range, higher thermal conductivity can be achieved while the property of filling of the thermally conductive filler is enhanced.
• the content of (B) is preferably 0.01 parts by mass or more, and particularly preferably 0.1 to 500 parts by mass, per 100 parts by mass of the total content of (C), (D1), and (D2).
• the amount of (B) is 0.01 parts by mass or more per 100 parts by mass of the total content of (C), (D1), and (D2), a surface treatment effect of the thermally conductive filler is sufficiently exhibited, and a greater amount of (A) can be blended.
• the amount of (B) is 500 parts by mass or less per 100 parts by mass of the total content of (C), (D1), and (D2), excellent mechanical properties and/or heat resistance after the curing can be achieved.
• the content of (C) can be appropriately set depending on the thermal conductivity required for the composition but is preferably 1 to 30 parts by mass, and more preferably 3 to 20 parts by mass, per 100 parts by mass of the content of (A).
• the content of (E) is preferably an amount that allows the amount of platinum element to be 0.1 to 1,000 ppm relative to the amount of the alkenyl group-containing polyorganosiloxane of (C). When the content is within such a range, curability and curing rate are sufficient.
• the contents of (C), (D1), and (D2) can be appropriately set depending on the thermal conductivity required for the composition; however, the amounts are preferably such that the ratio of the sum of the number H D1 of the hydrogen atoms bonded to silicon atoms of (D1) and the number H D2 of the hydrogen atoms bonded to silicon atoms of (D2) (H D1 + H D2 ) to the number Vi C of the alkenyl group of (C) ((H D1 + H D2 )/Vi C ) is less than 1.50.
• the ratio (H D1 + H D2 )/Vi C is less than 1.50, elongation of the cured product is further enhanced, and superior tackiness can be achieved.
• the ratio (H D1 + H D2 )/Vi C is preferably 1.20 or less, more preferably 1.10 or less, even more preferably 0.90 or less, and particularly preferably 0.80 or less.
• the ratio (H D1 + H D2 )/Vi C is not particularly limited but is preferably 0.60 or more, more preferably 0.70 or more, and particularly preferably 0.80 or more.
• the ratio of the number H D1 of the hydrogen atoms bonded to silicon atoms of (D1) to the number H D2 of the hydrogen atoms bonded to silicon atoms of (D2) (H D1 :H D2 ) is not particularly limited but is preferably 9.9:0.1 to 1:9, and more preferably 9:1 to 5:5. When the ratio is within such a range, elongation of the cured product of the composition is further enhanced, and superior tackiness can be achieved.
• the ratio (H D1 + H D2 )/Vi C is 0.85 or less and H D1 :H D2 is from 9:1 to 8:2.
• the ratios are within such ranges, particularly high elongation of the cured product of the composition and particularly superior tackiness can be achieved.
• the composition may be prepared by mixing (B), (C), (D1) and (D2), and (A) by using a kneader. Otherwise, the composition may be prepared by mixing (B) and (A) to perform the surface treatment, and then by dispersing the resultant mixture in (C), (D1), and (D2). Furthermore, as necessary, heating, pressure reduction, or other treatment by known methods may be performed. Furthermore, a mixture to which (C) has been blended in advance may be prepared, and then a mixture of (D1), (D2), and (E) may be added immediately before curing. (F) is preferably added at the same stage as (E).
• a pigment, a flame retardant, an adhesion imparting agent, a heat resistance imparting agent, a diluent, or an organic solvent and others which have been known to those skilled in the art, can be appropriately incorporated in such an amount that the effects of the present invention are not sacrificed. Because the cured product of the composition has high elongation, the cured product exhibits excellent followability with regard to deformation (e.g., bending) of a base material when an adhesion imparting agent is added as an optional component.
• the composition can be cured at room temperature or by being heated.
• the conditions for heat curing are known to those skilled in the art, and, as examples of apparatuses which can be used in a curing reaction caused due to heat, there can be mentioned apparatuses known to those skilled in the art, such as a constant temperature bath.
• the heating conditions can be appropriately selected according to the heat resistance temperature of a member to which the composition is applied, and the curing time can be determined. For example, heat at a temperature higher than room temperature (23°C) but 120°C or lower can be applied to the composition for a period of time in the range of 1 minute to 5 hours. From the viewpoint of operability, the heating temperature is preferably 40 to 120°C, more preferably 50 to 110°C, and particularly preferably 60 to 100°C.
• the heating time is preferably 5 minutes to 72 hours, more preferably 5 minutes to 3 hours, and particularly preferably 10 minutes to 2 hours. Furthermore, when curing is performed at room temperature, the curing time is preferably 72 hours or less, and particularly preferably 24 hours or less.
• a silicone rubber obtained by curing the composition can be used as a radiator member for electronic devices and electronic parts, such as an integrated circuit element.
• M H m Q 0.02 Pa ⁇ s polymethylhydrogen siloxane represented by the average compositional formula M H m Q (polymethylhydrogensiloxane consisting of the M H unit and the Q unit, and having at least three hydrogen atoms bonded to silicon atoms per molecule) (content of the hydrogen atoms bonded to silicon atoms: 1.0 wt.%; number average molecular weight in terms of polystyrene: 800); viscosity 0.02 Pa ⁇ s
• the viscosity of the composition was measured in accordance with JIS K 6249 by using a B-type rotational viscometer (Vismetron VDH) (manufactured by Shibaura System K.K.) and using No. 7 rotor at 10 rpm, at 23°C for 1 minute.
• Vismetron VDH B-type rotational viscometer
• the composition was charged in a mold having the thickness of 6 mm and subjected to heat curing at 70°C for 30 minutes.
• the hardness of the cured product of the composition (type E hardness) was measured in accordance with JIS K 6249.
• the composition was charged in a mold having the thickness of 2 mm and subjected to heat curing at 70°C for 30 minutes.
• the elongation of the cured product of the composition B was measured in accordance with JIS K 6249.
• the thermal conductivity of the composition was measured by using a thermal conductivity meter (TPS 1500, manufactured by Kyoto Electronics Manufacturing Co., Ltd.).
• TPS 1500 manufactured by Kyoto Electronics Manufacturing Co., Ltd.
• the composition was charged in a metal container that was made from aluminum and coated with Teflon (registered trademark) and that had the inner diameter of 30 mm and the depth of 6 mm, and subject to heat-curing at 70°C for 30 minutes.
• the sensor of the thermal conductivity meter was sandwiched by two produced samples to measure the thermal conductivity (unit: W/(m ⁇ K)) of the cured product of the composition.
• the composition was charged in a metal container that was made from aluminum and coated with Teflon (registered trademark) and that had the size of 60 mm X 30 mm and the depth of 6 mm, and heat-cured at 70°C for 30 minutes.
• the tackiness of the cured product of the composition B was measured in accordance with JIS Z 0237.
• Comparative Example 1 was a composition containing no (D2)
• Comparative Example 2 was a composition containing no (D1)
• Comparative Example 3 used, in place of (D2), a crosslinking agent having silicon-bonded hydrogen atoms in the middle units; however, the elongation of the cured product of the composition of Comparative Example 3 was remarkably insufficient, and the tackiness was poor.

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